DE69530801T2 - Montageelement und methode zum klemmen eines flachen, dünnen und leitfähigen werkstückes - Google Patents

Montageelement und methode zum klemmen eines flachen, dünnen und leitfähigen werkstückes Download PDF

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Publication number
DE69530801T2
DE69530801T2 DE69530801T DE69530801T DE69530801T2 DE 69530801 T2 DE69530801 T2 DE 69530801T2 DE 69530801 T DE69530801 T DE 69530801T DE 69530801 T DE69530801 T DE 69530801T DE 69530801 T2 DE69530801 T2 DE 69530801T2
Authority
DE
Germany
Prior art keywords
electrodes
gas
wafer
workpiece
clamping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69530801T
Other languages
German (de)
English (en)
Other versions
DE69530801D1 (de
Inventor
R. Nicholas WHITE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Semiconductor Equipment Associates Inc
Original Assignee
Varian Semiconductor Equipment Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Semiconductor Equipment Associates Inc filed Critical Varian Semiconductor Equipment Associates Inc
Application granted granted Critical
Publication of DE69530801D1 publication Critical patent/DE69530801D1/de
Publication of DE69530801T2 publication Critical patent/DE69530801T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10P72/0434—
    • H10P72/0432—
    • H10P72/72—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69530801T 1994-10-17 1995-10-17 Montageelement und methode zum klemmen eines flachen, dünnen und leitfähigen werkstückes Expired - Fee Related DE69530801T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US32376494A 1994-10-17 1994-10-17
US323764 1994-10-17
PCT/US1995/013158 WO1996013058A2 (en) 1994-10-17 1995-10-17 Apparatus and method for temperature control of workpieces in vacuum

Publications (2)

Publication Number Publication Date
DE69530801D1 DE69530801D1 (de) 2003-06-18
DE69530801T2 true DE69530801T2 (de) 2004-03-11

Family

ID=23260617

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69530801T Expired - Fee Related DE69530801T2 (de) 1994-10-17 1995-10-17 Montageelement und methode zum klemmen eines flachen, dünnen und leitfähigen werkstückes

Country Status (5)

Country Link
US (1) US5822172A (Direct)
EP (1) EP0871843B1 (Direct)
JP (1) JP4079992B2 (Direct)
DE (1) DE69530801T2 (Direct)
WO (1) WO1996013058A2 (Direct)

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JPH10240356A (ja) * 1997-02-21 1998-09-11 Anelva Corp 基板処理装置の基板温度制御法と基板温度制御性判定法
WO1999006110A1 (en) 1997-07-29 1999-02-11 Silicon Genesis Corporation Cluster tool method and apparatus using plasma immersion ion implantation
US6274459B1 (en) 1998-02-17 2001-08-14 Silicon Genesis Corporation Method for non mass selected ion implant profile control
US6113735A (en) * 1998-03-02 2000-09-05 Silicon Genesis Corporation Distributed system and code for control and automation of plasma immersion ion implanter
JP2000021964A (ja) 1998-07-06 2000-01-21 Ngk Insulators Ltd 静電チャックのパーティクル発生低減方法および半導体製造装置
FR2785737B1 (fr) * 1998-11-10 2001-01-05 Semco Engineering Sa Dispositif de maintien electrostatique
US6303411B1 (en) 1999-05-03 2001-10-16 Vortek Industries Ltd. Spatially resolved temperature measurement and irradiance control
EP1194954B1 (en) * 1999-07-08 2011-05-18 Lam Research Corporation Electrostatic chuck and its manufacturing method
WO2001026141A2 (en) * 1999-10-01 2001-04-12 Varian Semiconductor Equipment Associates, Inc. Surface structure and method of making, and electrostatic wafer clamp incorporating surface structure
US6362946B1 (en) * 1999-11-02 2002-03-26 Varian Semiconductor Equipment Associates, Inc. Electrostatic wafer clamp having electrostatic seal for retaining gas
US6538873B1 (en) 1999-11-02 2003-03-25 Varian Semiconductor Equipment Associates, Inc. Active electrostatic seal and electrostatic vacuum pump
JP2001284440A (ja) * 2000-03-16 2001-10-12 Asm Lithography Bv リソグラフ装置の基板ホルダ
US6736952B2 (en) * 2001-02-12 2004-05-18 Speedfam-Ipec Corporation Method and apparatus for electrochemical planarization of a workpiece
TWI272689B (en) * 2001-02-16 2007-02-01 Tokyo Electron Ltd Method and apparatus for transferring heat from a substrate to a chuck
US6998353B2 (en) * 2001-11-05 2006-02-14 Ibis Technology Corporation Active wafer cooling during damage engineering implant to enhance buried oxide formation in SIMOX wafers
CN101324470B (zh) 2001-12-26 2011-03-30 加拿大马特森技术有限公司 测量温度和热处理的方法及系统
US6734117B2 (en) * 2002-03-12 2004-05-11 Nikon Corporation Periodic clamping method and apparatus to reduce thermal stress in a wafer
US20040066601A1 (en) * 2002-10-04 2004-04-08 Varian Semiconductor Equipment Associates, Inc. Electrode configuration for retaining cooling gas on electrostatic wafer clamp
WO2004057650A1 (en) 2002-12-20 2004-07-08 Mattson Technology Canada, Inc. Methods and systems for supporting a workpiece and for heat-treating the workpiece
US7283346B2 (en) * 2002-12-26 2007-10-16 Mitsubishi Heavy Industries, Ltd. Electrostatic chuck and its manufacturing method
US6934595B1 (en) * 2003-02-26 2005-08-23 National Semiconductor Corp. Method and system for reducing semiconductor wafer breakage
US7357115B2 (en) * 2003-03-31 2008-04-15 Lam Research Corporation Wafer clamping apparatus and method for operating the same
US7151658B2 (en) * 2003-04-22 2006-12-19 Axcelis Technologies, Inc. High-performance electrostatic clamp comprising a resistive layer, micro-grooves, and dielectric layer
WO2005059991A1 (en) 2003-12-19 2005-06-30 Mattson Technology Canada Inc. Apparatuses and methods for suppressing thermally induced motion of a workpiece
US7352554B2 (en) * 2004-06-30 2008-04-01 Axcelis Technologies, Inc. Method for fabricating a Johnsen-Rahbek electrostatic wafer clamp
US20060060145A1 (en) * 2004-09-17 2006-03-23 Van Den Berg Jannes R Susceptor with surface roughness for high temperature substrate processing
US7126091B1 (en) 2005-03-23 2006-10-24 Eclipse Energy Systems, Inc. Workpiece holder for vacuum processing
WO2008058397A1 (en) 2006-11-15 2008-05-22 Mattson Technology Canada, Inc. Systems and methods for supporting a workpiece during heat-treating
TWI459851B (zh) * 2007-09-10 2014-11-01 日本碍子股份有限公司 heating equipment
EP2095946A1 (en) 2008-02-27 2009-09-02 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO A system for patterning flexible foils
US9558980B2 (en) 2008-04-30 2017-01-31 Axcelis Technologies, Inc. Vapor compression refrigeration chuck for ion implanters
US9036326B2 (en) * 2008-04-30 2015-05-19 Axcelis Technologies, Inc. Gas bearing electrostatic chuck
US9070590B2 (en) 2008-05-16 2015-06-30 Mattson Technology, Inc. Workpiece breakage prevention method and apparatus
JP2010123810A (ja) * 2008-11-20 2010-06-03 Ulvac Japan Ltd 基板保持装置及び基板温度制御方法
US8004817B2 (en) * 2009-06-18 2011-08-23 Varian Semiconductor Equipment Associates, Inc. Method of platen fabrication to allow electrode pattern and gas cooling optimization
FR2974251B1 (fr) * 2011-04-18 2013-11-01 Ecole Polytech Dispositif pour la gestion thermique d'un élément optique et procédé de gestion thermique associe.
JP5550602B2 (ja) * 2011-04-28 2014-07-16 パナソニック株式会社 静電チャックおよびこれを備えるドライエッチング装置
KR20140053323A (ko) * 2011-08-19 2014-05-07 울박, 인크 진공 처리 장치 및 진공 처리 방법
JP5505667B2 (ja) * 2011-09-30 2014-05-28 Ｔｏｔｏ株式会社 交流駆動静電チャック
US10032601B2 (en) * 2014-02-21 2018-07-24 Varian Semiconductor Equipment Associates, Inc. Platen support structure
KR101877452B1 (ko) * 2016-05-19 2018-08-09 한국기계연구원 도전 물질의 패터닝 장치 및 방법
JP7020951B2 (ja) * 2018-02-09 2022-02-16 東京エレクトロン株式会社 プラズマ処理システムおよびプラズマ処理方法
KR20210089375A (ko) * 2020-01-08 2021-07-16 주식회사 미코세라믹스 정전척
JP7183223B2 (ja) * 2020-08-28 2022-12-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
US11417557B2 (en) 2020-12-15 2022-08-16 Entegris, Inc. Spiraling polyphase electrodes for electrostatic chuck

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US4261762A (en) 1979-09-14 1981-04-14 Eaton Corporation Method for conducting heat to or from an article being treated under vacuum
US4457359A (en) * 1982-05-25 1984-07-03 Varian Associates, Inc. Apparatus for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer
US4603466A (en) * 1984-02-17 1986-08-05 Gca Corporation Wafer chuck
US5103367A (en) * 1987-05-06 1992-04-07 Unisearch Limited Electrostatic chuck using A.C. field excitation
US4949783A (en) * 1988-05-18 1990-08-21 Veeco Instruments, Inc. Substrate transport and cooling apparatus and method for same
JPH03227554A (ja) * 1990-02-01 1991-10-08 Tokyo Electron Ltd 静電チャック
US5179498A (en) * 1990-05-17 1993-01-12 Tokyo Electron Limited Electrostatic chuck device
US5452177A (en) * 1990-06-08 1995-09-19 Varian Associates, Inc. Electrostatic wafer clamp
EP0460955A1 (en) * 1990-06-08 1991-12-11 Varian Associates, Inc. Clamping a workpiece utilizing polyphase clamping voltage
US5184398A (en) * 1991-08-30 1993-02-09 Texas Instruments Incorporated In-situ real-time sheet resistance measurement method
US5315473A (en) * 1992-01-21 1994-05-24 Applied Materials, Inc. Isolated electrostatic chuck and excitation method
US5460684A (en) * 1992-12-04 1995-10-24 Tokyo Electron Limited Stage having electrostatic chuck and plasma processing apparatus using same
US5444597A (en) * 1993-01-15 1995-08-22 Blake; Julian G. Wafer release method and apparatus
US5436790A (en) * 1993-01-15 1995-07-25 Eaton Corporation Wafer sensing and clamping monitor
US5345999A (en) * 1993-03-17 1994-09-13 Applied Materials, Inc. Method and apparatus for cooling semiconductor wafers
EP0635870A1 (en) * 1993-07-20 1995-01-25 Applied Materials, Inc. An electrostatic chuck having a grooved surface
US5474614A (en) * 1994-06-10 1995-12-12 Texas Instruments Incorporated Method and apparatus for releasing a semiconductor wafer from an electrostatic clamp

Also Published As

Publication number Publication date
WO1996013058A2 (en) 1996-05-02
US5822172A (en) 1998-10-13
JPH11504760A (ja) 1999-04-27
EP0871843A4 (Direct) 1998-10-21
JP4079992B2 (ja) 2008-04-23
EP0871843A2 (en) 1998-10-21
WO1996013058A3 (en) 1996-06-27
DE69530801D1 (de) 2003-06-18
EP0871843B1 (en) 2003-05-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee