DE69123995T2 - Elektrostatischer Substrathalter - Google Patents

Elektrostatischer Substrathalter

Info

Publication number
DE69123995T2
DE69123995T2 DE1991623995 DE69123995T DE69123995T2 DE 69123995 T2 DE69123995 T2 DE 69123995T2 DE 1991623995 DE1991623995 DE 1991623995 DE 69123995 T DE69123995 T DE 69123995T DE 69123995 T2 DE69123995 T2 DE 69123995T2
Authority
DE
Germany
Prior art keywords
substrate holder
electrostatic substrate
electrostatic
holder
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1991623995
Other languages
English (en)
Other versions
DE69123995D1 (de
Inventor
Jean-Francois Daviet
Pierre Jeuch
Louise Peccoud
Pierre Renard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Application granted granted Critical
Publication of DE69123995D1 publication Critical patent/DE69123995D1/de
Publication of DE69123995T2 publication Critical patent/DE69123995T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE1991623995 1990-04-12 1991-04-11 Elektrostatischer Substrathalter Expired - Fee Related DE69123995T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9004728A FR2661039B1 (fr) 1990-04-12 1990-04-12 Porte-substrat electrostatique.

Publications (2)

Publication Number Publication Date
DE69123995D1 DE69123995D1 (de) 1997-02-20
DE69123995T2 true DE69123995T2 (de) 1997-06-26

Family

ID=9395718

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1991623995 Expired - Fee Related DE69123995T2 (de) 1990-04-12 1991-04-11 Elektrostatischer Substrathalter

Country Status (3)

Country Link
EP (1) EP0452222B1 (de)
DE (1) DE69123995T2 (de)
FR (1) FR2661039B1 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3129452B2 (ja) * 1990-03-13 2001-01-29 富士電機株式会社 静電チャック
DE69231299T2 (de) * 1991-11-07 2001-01-18 Varian Semiconductor Equipment Verfahren zur Herstellung einer elektrostatischen Halteplatte
US5539609A (en) * 1992-12-02 1996-07-23 Applied Materials, Inc. Electrostatic chuck usable in high density plasma
IL108893A0 (en) * 1993-03-08 1994-06-24 Wolfowitz Steven Alan Apparatus for non-adhesive and ecologically safe electroadhesion method of clamping and fixing materials
JPH06326175A (ja) * 1993-04-22 1994-11-25 Applied Materials Inc 集積回路処理装置において使用されるウエハサポートの誘電材への保護被覆とその形成方法
EP0634786B1 (de) * 1993-07-15 1997-03-05 Applied Materials, Inc. Verbesserte Suszeptor Ausführung
EP0635870A1 (de) * 1993-07-20 1995-01-25 Applied Materials, Inc. Eine elektrostatische Halteplatte mit einer gerillten Fläche
TW277139B (de) * 1993-09-16 1996-06-01 Hitachi Seisakusyo Kk
US6544379B2 (en) 1993-09-16 2003-04-08 Hitachi, Ltd. Method of holding substrate and substrate holding system
US5535507A (en) * 1993-12-20 1996-07-16 International Business Machines Corporation Method of making electrostatic chuck with oxide insulator
US5801915A (en) * 1994-01-31 1998-09-01 Applied Materials, Inc. Electrostatic chuck having a unidirectionally conducting coupler layer
US5729423A (en) * 1994-01-31 1998-03-17 Applied Materials, Inc. Puncture resistant electrostatic chuck
US5885469B1 (en) * 1996-11-05 2000-08-08 Applied Materials Inc Topographical structure of an electrostatic chuck and method of fabricating same
US6278600B1 (en) 1994-01-31 2001-08-21 Applied Materials, Inc. Electrostatic chuck with improved temperature control and puncture resistance
JPH08507196A (ja) * 1994-01-31 1996-07-30 アプライド マテリアルズ インコーポレイテッド 共形な絶縁体フィルムを有する静電チャック
US5631803A (en) * 1995-01-06 1997-05-20 Applied Materials, Inc. Erosion resistant electrostatic chuck with improved cooling system
US5531835A (en) * 1994-05-18 1996-07-02 Applied Materials, Inc. Patterned susceptor to reduce electrostatic force in a CVD chamber
US5548470A (en) * 1994-07-19 1996-08-20 International Business Machines Corporation Characterization, modeling, and design of an electrostatic chuck with improved wafer temperature uniformity
FR2724269B1 (fr) 1994-09-06 1996-10-18 Commissariat Energie Atomique Porte-substrat electrostatique
US5583736A (en) * 1994-11-17 1996-12-10 The United States Of America As Represented By The Department Of Energy Micromachined silicon electrostatic chuck
US5810933A (en) * 1996-02-16 1998-09-22 Novellus Systems, Inc. Wafer cooling device
US5656093A (en) * 1996-03-08 1997-08-12 Applied Materials, Inc. Wafer spacing mask for a substrate support chuck and method of fabricating same
US5761023A (en) * 1996-04-25 1998-06-02 Applied Materials, Inc. Substrate support with pressure zones having reduced contact area and temperature feedback
US5825607A (en) * 1996-05-08 1998-10-20 Applied Materials, Inc. Insulated wafer spacing mask for a substrate support chuck and method of fabricating same
US5764471A (en) * 1996-05-08 1998-06-09 Applied Materials, Inc. Method and apparatus for balancing an electrostatic force produced by an electrostatic chuck
US5870271A (en) * 1997-02-19 1999-02-09 Applied Materials, Inc. Pressure actuated sealing diaphragm for chucks
US6104596A (en) * 1998-04-21 2000-08-15 Applied Materials, Inc. Apparatus for retaining a subtrate in a semiconductor wafer processing system and a method of fabricating same
JP3983387B2 (ja) * 1998-09-29 2007-09-26 日本碍子株式会社 静電チャック
US6598559B1 (en) 2000-03-24 2003-07-29 Applied Materials, Inc. Temperature controlled chamber
EP1498777A1 (de) 2003-07-15 2005-01-19 ASML Netherlands B.V. Substrathalter und lithographischer Projektionsapparat
US6897945B1 (en) 2003-12-15 2005-05-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4384918A (en) * 1980-09-30 1983-05-24 Fujitsu Limited Method and apparatus for dry etching and electrostatic chucking device used therein
DE3471827D1 (en) * 1983-09-30 1988-07-07 Philips Electronic Associated Electrostatic chuck and loading method
JPS60261377A (ja) * 1984-06-08 1985-12-24 Nippon Telegr & Teleph Corp <Ntt> 静電チャックの製造方法
JPS6131636U (ja) * 1984-07-31 1986-02-26 株式会社 徳田製作所 静電チヤツク
JPS6372877A (ja) * 1986-09-12 1988-04-02 Tokuda Seisakusho Ltd 真空処理装置

Also Published As

Publication number Publication date
FR2661039A1 (fr) 1991-10-18
EP0452222A1 (de) 1991-10-16
EP0452222B1 (de) 1997-01-08
FR2661039B1 (fr) 1997-04-30
DE69123995D1 (de) 1997-02-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee