FI941079A0 - Limloest ekologiskt rent elektroadhesionsfoerfarande foer att hopfoga ochfaesta material - Google Patents

Limloest ekologiskt rent elektroadhesionsfoerfarande foer att hopfoga ochfaesta material

Info

Publication number
FI941079A0
FI941079A0 FI941079A FI941079A FI941079A0 FI 941079 A0 FI941079 A0 FI 941079A0 FI 941079 A FI941079 A FI 941079A FI 941079 A FI941079 A FI 941079A FI 941079 A0 FI941079 A0 FI 941079A0
Authority
FI
Finland
Prior art keywords
supply
limloest
ecological
materials
production
Prior art date
Application number
FI941079A
Other languages
English (en)
Inventor
Vagiz Nurgalievitch Abrarov
Original Assignee
Wolfowitz Steven Alan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wolfowitz Steven Alan filed Critical Wolfowitz Steven Alan
Publication of FI941079A0 publication Critical patent/FI941079A0/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Adhesives Or Adhesive Processes (AREA)
FI941079A 1993-03-08 1994-03-08 Limloest ekologiskt rent elektroadhesionsfoerfarande foer att hopfoga ochfaesta material FI941079A0 (fi)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ZA931623 1993-03-08
ZA936179 1993-08-24

Publications (1)

Publication Number Publication Date
FI941079A0 true FI941079A0 (fi) 1994-03-08

Family

ID=27142239

Family Applications (2)

Application Number Title Priority Date Filing Date
FI941079A FI941079A0 (fi) 1993-03-08 1994-03-08 Limloest ekologiskt rent elektroadhesionsfoerfarande foer att hopfoga ochfaesta material
FI954226A FI954226A (fi) 1993-03-08 1995-09-08 Liimaton ekologisesti puhdas sähköadheesiomenetelmä materiaalien liittämiseksi ja kiinnittämiseksi

Family Applications After (1)

Application Number Title Priority Date Filing Date
FI954226A FI954226A (fi) 1993-03-08 1995-09-08 Liimaton ekologisesti puhdas sähköadheesiomenetelmä materiaalien liittämiseksi ja kiinnittämiseksi

Country Status (8)

Country Link
CN (1) CN1105740A (fi)
AU (1) AU6158094A (fi)
CA (1) CA2157875A1 (fi)
FI (2) FI941079A0 (fi)
IL (1) IL108893A0 (fi)
NO (1) NO953558L (fi)
WO (1) WO1994020984A1 (fi)
ZA (1) ZA941587B (fi)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7598651B2 (en) 2004-03-12 2009-10-06 Sri International Mechanical meta-materials
US7551419B2 (en) 2006-06-05 2009-06-23 Sri International Electroadhesion
US7554787B2 (en) * 2006-06-05 2009-06-30 Sri International Wall crawling devices
US8515510B2 (en) 2009-03-31 2013-08-20 Covidien Lp Electroadhesive medical devices
US8633269B2 (en) 2010-12-01 2014-01-21 Mattel, Inc. Play modeling dough
US9261336B2 (en) 2013-03-15 2016-02-16 Mattel, Inc. Toy projectile and method of making

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL56224A (en) * 1978-01-16 1982-08-31 Veeco Instr Inc Substrate clamp for use in semiconductor fabrication
US4384918A (en) * 1980-09-30 1983-05-24 Fujitsu Limited Method and apparatus for dry etching and electrostatic chucking device used therein
JPS6156843A (ja) * 1984-08-27 1986-03-22 Kokusai Electric Co Ltd 静電吸着板
JP2525593Y2 (ja) * 1988-02-05 1997-02-12 株式会社 アビサレ 静電吸着シート
DE69103915T2 (de) * 1990-01-25 1995-05-11 Applied Materials Inc Elektrostatische Klemmvorrichtung und Verfahren.
FR2661039B1 (fr) * 1990-04-12 1997-04-30 Commissariat Energie Atomique Porte-substrat electrostatique.
JPH04342155A (ja) * 1991-05-20 1992-11-27 Fujitsu Ltd 半導体製造装置

Also Published As

Publication number Publication date
AU6158094A (en) 1994-09-26
CN1105740A (zh) 1995-07-26
WO1994020984A1 (en) 1994-09-15
NO953558L (no) 1995-10-25
NO953558D0 (no) 1995-09-08
FI954226A (fi) 1995-10-30
FI954226A0 (fi) 1995-09-08
IL108893A0 (en) 1994-06-24
CA2157875A1 (en) 1994-09-15
ZA941587B (en) 1995-03-28

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