ZA941587B - Non-adhesive ecologically-pure electroadhesion method of clamping and fixing materials - Google Patents

Non-adhesive ecologically-pure electroadhesion method of clamping and fixing materials

Info

Publication number
ZA941587B
ZA941587B ZA941587A ZA941587A ZA941587B ZA 941587 B ZA941587 B ZA 941587B ZA 941587 A ZA941587 A ZA 941587A ZA 941587 A ZA941587 A ZA 941587A ZA 941587 B ZA941587 B ZA 941587B
Authority
ZA
South Africa
Prior art keywords
electroadhesion
ecologically
pure
clamping
adhesive
Prior art date
Application number
ZA941587A
Inventor
Vagiz Nurgalievitch Abrarov
Original Assignee
Steven Alan Wolfowitz
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steven Alan Wolfowitz filed Critical Steven Alan Wolfowitz
Publication of ZA941587B publication Critical patent/ZA941587B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
ZA941587A 1993-03-08 1994-03-08 Non-adhesive ecologically-pure electroadhesion method of clamping and fixing materials ZA941587B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ZA931623 1993-03-08
ZA936179 1993-08-24

Publications (1)

Publication Number Publication Date
ZA941587B true ZA941587B (en) 1995-03-28

Family

ID=27142239

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA941587A ZA941587B (en) 1993-03-08 1994-03-08 Non-adhesive ecologically-pure electroadhesion method of clamping and fixing materials

Country Status (8)

Country Link
CN (1) CN1105740A (en)
AU (1) AU6158094A (en)
CA (1) CA2157875A1 (en)
FI (2) FI941079A0 (en)
IL (1) IL108893A0 (en)
NO (1) NO953558L (en)
WO (1) WO1994020984A1 (en)
ZA (1) ZA941587B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7598651B2 (en) 2004-03-12 2009-10-06 Sri International Mechanical meta-materials
US7551419B2 (en) 2006-06-05 2009-06-23 Sri International Electroadhesion
US7554787B2 (en) 2006-06-05 2009-06-30 Sri International Wall crawling devices
US8515510B2 (en) 2009-03-31 2013-08-20 Covidien Lp Electroadhesive medical devices
CA2819828A1 (en) 2010-12-01 2012-06-07 Mattel, Inc. Play modeling dough
US9261336B2 (en) 2013-03-15 2016-02-16 Mattel, Inc. Toy projectile and method of making

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL56224A (en) * 1978-01-16 1982-08-31 Veeco Instr Inc Substrate clamp for use in semiconductor fabrication
US4384918A (en) * 1980-09-30 1983-05-24 Fujitsu Limited Method and apparatus for dry etching and electrostatic chucking device used therein
JPS6156843A (en) * 1984-08-27 1986-03-22 Kokusai Electric Co Ltd Electrostatic attractive plate
JP2525593Y2 (en) * 1988-02-05 1997-02-12 株式会社 アビサレ Electrostatic suction sheet
EP0439000B1 (en) * 1990-01-25 1994-09-14 Applied Materials, Inc. Electrostatic clamp and method
FR2661039B1 (en) * 1990-04-12 1997-04-30 Commissariat Energie Atomique ELECTROSTATIC SUBSTRATE HOLDER.
JPH04342155A (en) * 1991-05-20 1992-11-27 Fujitsu Ltd Semiconductor manufacturing device

Also Published As

Publication number Publication date
CN1105740A (en) 1995-07-26
FI941079A0 (en) 1994-03-08
AU6158094A (en) 1994-09-26
NO953558D0 (en) 1995-09-08
FI954226A0 (en) 1995-09-08
CA2157875A1 (en) 1994-09-15
FI954226A (en) 1995-10-30
IL108893A0 (en) 1994-06-24
WO1994020984A1 (en) 1994-09-15
NO953558L (en) 1995-10-25

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