IL108893A0 - Apparatus for non-adhesive and ecologically safe electroadhesion method of clamping and fixing materials - Google Patents
Apparatus for non-adhesive and ecologically safe electroadhesion method of clamping and fixing materialsInfo
- Publication number
- IL108893A0 IL108893A0 IL10889394A IL10889394A IL108893A0 IL 108893 A0 IL108893 A0 IL 108893A0 IL 10889394 A IL10889394 A IL 10889394A IL 10889394 A IL10889394 A IL 10889394A IL 108893 A0 IL108893 A0 IL 108893A0
- Authority
- IL
- Israel
- Prior art keywords
- electroadhesion
- clamping
- adhesive
- fixing materials
- ecologically safe
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ZA931623 | 1993-03-08 | ||
| ZA936179 | 1993-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IL108893A0 true IL108893A0 (en) | 1994-06-24 |
Family
ID=27142239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL10889394A IL108893A0 (en) | 1993-03-08 | 1994-03-08 | Apparatus for non-adhesive and ecologically safe electroadhesion method of clamping and fixing materials |
Country Status (8)
| Country | Link |
|---|---|
| CN (1) | CN1105740A (en) |
| AU (1) | AU6158094A (en) |
| CA (1) | CA2157875A1 (en) |
| FI (2) | FI941079A0 (en) |
| IL (1) | IL108893A0 (en) |
| NO (1) | NO953558L (en) |
| WO (1) | WO1994020984A1 (en) |
| ZA (1) | ZA941587B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7598651B2 (en) | 2004-03-12 | 2009-10-06 | Sri International | Mechanical meta-materials |
| US7551419B2 (en) | 2006-06-05 | 2009-06-23 | Sri International | Electroadhesion |
| US7554787B2 (en) | 2006-06-05 | 2009-06-30 | Sri International | Wall crawling devices |
| US8515510B2 (en) | 2009-03-31 | 2013-08-20 | Covidien Lp | Electroadhesive medical devices |
| CA2819828A1 (en) | 2010-12-01 | 2012-06-07 | Mattel, Inc. | Play modeling dough |
| US9261336B2 (en) | 2013-03-15 | 2016-02-16 | Mattel, Inc. | Toy projectile and method of making |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IL56224A (en) * | 1978-01-16 | 1982-08-31 | Veeco Instr Inc | Substrate clamp for use in semiconductor fabrication |
| US4384918A (en) * | 1980-09-30 | 1983-05-24 | Fujitsu Limited | Method and apparatus for dry etching and electrostatic chucking device used therein |
| JPS6156843A (en) * | 1984-08-27 | 1986-03-22 | Kokusai Electric Co Ltd | Electrostatic attractive plate |
| JP2525593Y2 (en) * | 1988-02-05 | 1997-02-12 | 株式会社 アビサレ | Electrostatic suction sheet |
| EP0439000B1 (en) * | 1990-01-25 | 1994-09-14 | Applied Materials, Inc. | Electrostatic clamp and method |
| FR2661039B1 (en) * | 1990-04-12 | 1997-04-30 | Commissariat Energie Atomique | ELECTROSTATIC SUBSTRATE HOLDER. |
| JPH04342155A (en) * | 1991-05-20 | 1992-11-27 | Fujitsu Ltd | Semiconductor manufacturing device |
-
1994
- 1994-03-08 IL IL10889394A patent/IL108893A0/en unknown
- 1994-03-08 WO PCT/NZ1994/000016 patent/WO1994020984A1/en active Application Filing
- 1994-03-08 AU AU61580/94A patent/AU6158094A/en not_active Abandoned
- 1994-03-08 CN CN94104274A patent/CN1105740A/en active Pending
- 1994-03-08 FI FI941079A patent/FI941079A0/en unknown
- 1994-03-08 ZA ZA941587A patent/ZA941587B/en unknown
- 1994-03-08 CA CA002157875A patent/CA2157875A1/en not_active Abandoned
-
1995
- 1995-09-08 FI FI954226A patent/FI954226A/en not_active Application Discontinuation
- 1995-09-08 NO NO953558A patent/NO953558L/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN1105740A (en) | 1995-07-26 |
| FI941079A0 (en) | 1994-03-08 |
| AU6158094A (en) | 1994-09-26 |
| NO953558D0 (en) | 1995-09-08 |
| FI954226A0 (en) | 1995-09-08 |
| CA2157875A1 (en) | 1994-09-15 |
| FI954226A (en) | 1995-10-30 |
| ZA941587B (en) | 1995-03-28 |
| WO1994020984A1 (en) | 1994-09-15 |
| NO953558L (en) | 1995-10-25 |
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