DE69530801D1 - Montageelement und methode zum klemmen eines flachen, dünnen und leitfähigen werkstückes - Google Patents

Montageelement und methode zum klemmen eines flachen, dünnen und leitfähigen werkstückes

Info

Publication number
DE69530801D1
DE69530801D1 DE69530801T DE69530801T DE69530801D1 DE 69530801 D1 DE69530801 D1 DE 69530801D1 DE 69530801 T DE69530801 T DE 69530801T DE 69530801 T DE69530801 T DE 69530801T DE 69530801 D1 DE69530801 D1 DE 69530801D1
Authority
DE
Germany
Prior art keywords
clamping
thin
flat
assembly element
conductive workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69530801T
Other languages
English (en)
Other versions
DE69530801T2 (de
Inventor
R White
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Semiconductor Equipment Associates Inc
Original Assignee
Varian Semiconductor Equipment Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Semiconductor Equipment Associates Inc filed Critical Varian Semiconductor Equipment Associates Inc
Application granted granted Critical
Publication of DE69530801D1 publication Critical patent/DE69530801D1/de
Publication of DE69530801T2 publication Critical patent/DE69530801T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69530801T 1994-10-17 1995-10-17 Montageelement und methode zum klemmen eines flachen, dünnen und leitfähigen werkstückes Expired - Fee Related DE69530801T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US32376494A 1994-10-17 1994-10-17
US323764 1994-10-17
PCT/US1995/013158 WO1996013058A2 (en) 1994-10-17 1995-10-17 Apparatus and method for temperature control of workpieces in vacuum

Publications (2)

Publication Number Publication Date
DE69530801D1 true DE69530801D1 (de) 2003-06-18
DE69530801T2 DE69530801T2 (de) 2004-03-11

Family

ID=23260617

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69530801T Expired - Fee Related DE69530801T2 (de) 1994-10-17 1995-10-17 Montageelement und methode zum klemmen eines flachen, dünnen und leitfähigen werkstückes

Country Status (5)

Country Link
US (1) US5822172A (de)
EP (1) EP0871843B1 (de)
JP (1) JP4079992B2 (de)
DE (1) DE69530801T2 (de)
WO (1) WO1996013058A2 (de)

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US5679404A (en) * 1995-06-07 1997-10-21 Saint-Gobain/Norton Industrial Ceramics Corporation Method for depositing a substance with temperature control
KR100290264B1 (ko) * 1997-01-22 2001-09-22 호소이 쇼지로 정전처크장치 및 그 제조방법
JPH10240356A (ja) * 1997-02-21 1998-09-11 Anelva Corp 基板処理装置の基板温度制御法と基板温度制御性判定法
US6207005B1 (en) 1997-07-29 2001-03-27 Silicon Genesis Corporation Cluster tool apparatus using plasma immersion ion implantation
US6274459B1 (en) 1998-02-17 2001-08-14 Silicon Genesis Corporation Method for non mass selected ion implant profile control
US6113735A (en) * 1998-03-02 2000-09-05 Silicon Genesis Corporation Distributed system and code for control and automation of plasma immersion ion implanter
JP2000021964A (ja) 1998-07-06 2000-01-21 Ngk Insulators Ltd 静電チャックのパーティクル発生低減方法および半導体製造装置
FR2785737B1 (fr) * 1998-11-10 2001-01-05 Semco Engineering Sa Dispositif de maintien electrostatique
US6303411B1 (en) 1999-05-03 2001-10-16 Vortek Industries Ltd. Spatially resolved temperature measurement and irradiance control
US6992876B1 (en) * 1999-07-08 2006-01-31 Lam Research Corporation Electrostatic chuck and its manufacturing method
JP4854056B2 (ja) * 1999-10-01 2012-01-11 バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド 冷却装置及びクランピング装置
US6538873B1 (en) 1999-11-02 2003-03-25 Varian Semiconductor Equipment Associates, Inc. Active electrostatic seal and electrostatic vacuum pump
US6362946B1 (en) * 1999-11-02 2002-03-26 Varian Semiconductor Equipment Associates, Inc. Electrostatic wafer clamp having electrostatic seal for retaining gas
US6583858B2 (en) * 2000-03-16 2003-06-24 Asml Netherlands B.V. Substrate holder for lithographic apparatus
US6736952B2 (en) * 2001-02-12 2004-05-18 Speedfam-Ipec Corporation Method and apparatus for electrochemical planarization of a workpiece
TWI272689B (en) * 2001-02-16 2007-02-01 Tokyo Electron Ltd Method and apparatus for transferring heat from a substrate to a chuck
WO2004061941A1 (ja) * 2002-12-26 2004-07-22 Mitsubishi Heavy Industries, Ltd. 静電チャック
US6998353B2 (en) * 2001-11-05 2006-02-14 Ibis Technology Corporation Active wafer cooling during damage engineering implant to enhance buried oxide formation in SIMOX wafers
US6734117B2 (en) * 2002-03-12 2004-05-11 Nikon Corporation Periodic clamping method and apparatus to reduce thermal stress in a wafer
US20040066601A1 (en) * 2002-10-04 2004-04-08 Varian Semiconductor Equipment Associates, Inc. Electrode configuration for retaining cooling gas on electrostatic wafer clamp
KR101163682B1 (ko) 2002-12-20 2012-07-09 맷슨 테크날러지 캐나다 인코퍼레이티드 피가공물 지지 장치
US6934595B1 (en) * 2003-02-26 2005-08-23 National Semiconductor Corp. Method and system for reducing semiconductor wafer breakage
US7357115B2 (en) * 2003-03-31 2008-04-15 Lam Research Corporation Wafer clamping apparatus and method for operating the same
US7151658B2 (en) * 2003-04-22 2006-12-19 Axcelis Technologies, Inc. High-performance electrostatic clamp comprising a resistive layer, micro-grooves, and dielectric layer
US7352554B2 (en) * 2004-06-30 2008-04-01 Axcelis Technologies, Inc. Method for fabricating a Johnsen-Rahbek electrostatic wafer clamp
US20060060145A1 (en) * 2004-09-17 2006-03-23 Van Den Berg Jannes R Susceptor with surface roughness for high temperature substrate processing
US7126091B1 (en) 2005-03-23 2006-10-24 Eclipse Energy Systems, Inc. Workpiece holder for vacuum processing
US8454356B2 (en) 2006-11-15 2013-06-04 Mattson Technology, Inc. Systems and methods for supporting a workpiece during heat-treating
TWI459851B (zh) * 2007-09-10 2014-11-01 Ngk Insulators Ltd heating equipment
EP2095946A1 (de) * 2008-02-27 2009-09-02 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO System zur Strukturierung von flexiblen Folien
US9036326B2 (en) * 2008-04-30 2015-05-19 Axcelis Technologies, Inc. Gas bearing electrostatic chuck
US9558980B2 (en) 2008-04-30 2017-01-31 Axcelis Technologies, Inc. Vapor compression refrigeration chuck for ion implanters
CN102089873A (zh) 2008-05-16 2011-06-08 加拿大马特森技术有限公司 工件破损防止方法及设备
JP2010123810A (ja) * 2008-11-20 2010-06-03 Ulvac Japan Ltd 基板保持装置及び基板温度制御方法
US8004817B2 (en) * 2009-06-18 2011-08-23 Varian Semiconductor Equipment Associates, Inc. Method of platen fabrication to allow electrode pattern and gas cooling optimization
FR2974251B1 (fr) 2011-04-18 2013-11-01 Ecole Polytech Dispositif pour la gestion thermique d'un élément optique et procédé de gestion thermique associe.
JP5550602B2 (ja) * 2011-04-28 2014-07-16 パナソニック株式会社 静電チャックおよびこれを備えるドライエッチング装置
JPWO2013027584A1 (ja) * 2011-08-19 2015-03-19 株式会社アルバック 真空処理装置及び真空処理方法
JP5505667B2 (ja) * 2011-09-30 2014-05-28 Ｔｏｔｏ株式会社 交流駆動静電チャック
US10032601B2 (en) * 2014-02-21 2018-07-24 Varian Semiconductor Equipment Associates, Inc. Platen support structure
KR101877452B1 (ko) * 2016-05-19 2018-08-09 한국기계연구원 도전 물질의 패터닝 장치 및 방법
KR20210089375A (ko) * 2020-01-08 2021-07-16 주식회사 미코세라믹스 정전척
JP7183223B2 (ja) * 2020-08-28 2022-12-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
US11417557B2 (en) 2020-12-15 2022-08-16 Entegris, Inc. Spiraling polyphase electrodes for electrostatic chuck

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Publication number Priority date Publication date Assignee Title
US4261762A (en) 1979-09-14 1981-04-14 Eaton Corporation Method for conducting heat to or from an article being treated under vacuum
US4457359A (en) * 1982-05-25 1984-07-03 Varian Associates, Inc. Apparatus for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer
US4603466A (en) * 1984-02-17 1986-08-05 Gca Corporation Wafer chuck
US5103367A (en) * 1987-05-06 1992-04-07 Unisearch Limited Electrostatic chuck using A.C. field excitation
US4949783A (en) * 1988-05-18 1990-08-21 Veeco Instruments, Inc. Substrate transport and cooling apparatus and method for same
JPH03227554A (ja) * 1990-02-01 1991-10-08 Tokyo Electron Ltd 静電チャック
US5179498A (en) * 1990-05-17 1993-01-12 Tokyo Electron Limited Electrostatic chuck device
US5452177A (en) * 1990-06-08 1995-09-19 Varian Associates, Inc. Electrostatic wafer clamp
EP0460955A1 (de) * 1990-06-08 1991-12-11 Varian Associates, Inc. Spannen eines Werkstückes unter Verwendung einer mehrphasigen Haltespannung
US5184398A (en) * 1991-08-30 1993-02-09 Texas Instruments Incorporated In-situ real-time sheet resistance measurement method
US5315473A (en) * 1992-01-21 1994-05-24 Applied Materials, Inc. Isolated electrostatic chuck and excitation method
US5460684A (en) * 1992-12-04 1995-10-24 Tokyo Electron Limited Stage having electrostatic chuck and plasma processing apparatus using same
US5444597A (en) * 1993-01-15 1995-08-22 Blake; Julian G. Wafer release method and apparatus
US5436790A (en) * 1993-01-15 1995-07-25 Eaton Corporation Wafer sensing and clamping monitor
US5345999A (en) * 1993-03-17 1994-09-13 Applied Materials, Inc. Method and apparatus for cooling semiconductor wafers
EP0635870A1 (de) * 1993-07-20 1995-01-25 Applied Materials, Inc. Eine elektrostatische Halteplatte mit einer gerillten Fläche
US5474614A (en) * 1994-06-10 1995-12-12 Texas Instruments Incorporated Method and apparatus for releasing a semiconductor wafer from an electrostatic clamp

Also Published As

Publication number Publication date
US5822172A (en) 1998-10-13
WO1996013058A3 (en) 1996-06-27
JPH11504760A (ja) 1999-04-27
JP4079992B2 (ja) 2008-04-23
EP0871843B1 (de) 2003-05-14
DE69530801T2 (de) 2004-03-11
WO1996013058A2 (en) 1996-05-02
EP0871843A4 (de) 1998-10-21
EP0871843A2 (de) 1998-10-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee