DE69416656T2 - Verfahren zum Herstellen einer elektrostatischer Spannvorrichtung mit Oxyd-Isolator - Google Patents

Verfahren zum Herstellen einer elektrostatischer Spannvorrichtung mit Oxyd-Isolator

Info

Publication number
DE69416656T2
DE69416656T2 DE69416656T DE69416656T DE69416656T2 DE 69416656 T2 DE69416656 T2 DE 69416656T2 DE 69416656 T DE69416656 T DE 69416656T DE 69416656 T DE69416656 T DE 69416656T DE 69416656 T2 DE69416656 T2 DE 69416656T2
Authority
DE
Germany
Prior art keywords
manufacturing
electrostatic chuck
oxide insulator
insulator
oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69416656T
Other languages
English (en)
Other versions
DE69416656D1 (de
Inventor
Michael Scott Barnes
Robert Peter Westerfield
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DOREEY GAGE CO.INC., POUGHKEEPSIE, N.Y., US
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69416656D1 publication Critical patent/DE69416656D1/de
Publication of DE69416656T2 publication Critical patent/DE69416656T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49885—Assembling or joining with coating before or during assembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49888—Subsequently coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4998—Combined manufacture including applying or shaping of fluent material
    • Y10T29/49982—Coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4998—Combined manufacture including applying or shaping of fluent material
    • Y10T29/49982—Coating
    • Y10T29/49986—Subsequent to metal working
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4998—Combined manufacture including applying or shaping of fluent material
    • Y10T29/49993—Filling of opening

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
DE69416656T 1993-12-20 1994-11-08 Verfahren zum Herstellen einer elektrostatischer Spannvorrichtung mit Oxyd-Isolator Expired - Lifetime DE69416656T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/169,910 US5452510A (en) 1993-12-20 1993-12-20 Method of making an electrostatic chuck with oxide insulator

Publications (2)

Publication Number Publication Date
DE69416656D1 DE69416656D1 (de) 1999-04-01
DE69416656T2 true DE69416656T2 (de) 1999-09-30

Family

ID=22617719

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69416656T Expired - Lifetime DE69416656T2 (de) 1993-12-20 1994-11-08 Verfahren zum Herstellen einer elektrostatischer Spannvorrichtung mit Oxyd-Isolator

Country Status (4)

Country Link
US (1) US5452510A (de)
EP (1) EP0660388B1 (de)
JP (1) JP2614421B2 (de)
DE (1) DE69416656T2 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5745331A (en) * 1994-01-31 1998-04-28 Applied Materials, Inc. Electrostatic chuck with conformal insulator film
US5883778A (en) * 1994-02-28 1999-03-16 Applied Materials, Inc. Electrostatic chuck with fluid flow regulator
EP0669644B1 (de) * 1994-02-28 1997-08-20 Applied Materials, Inc. Elektrostatische Halteplatte
US5581874A (en) * 1994-03-28 1996-12-10 Tokyo Electron Limited Method of forming a bonding portion
US5592358A (en) * 1994-07-18 1997-01-07 Applied Materials, Inc. Electrostatic chuck for magnetic flux processing
TW283250B (en) 1995-07-10 1996-08-11 Watkins Johnson Co Plasma enhanced chemical processing reactor and method
TW286414B (en) * 1995-07-10 1996-09-21 Watkins Johnson Co Electrostatic chuck assembly
US5764484A (en) * 1996-11-15 1998-06-09 Olin Corporation Ground ring for a metal electronic package
US6176667B1 (en) 1996-04-30 2001-01-23 Applied Materials, Inc. Multideck wafer processing system
US5754391A (en) * 1996-05-17 1998-05-19 Saphikon Inc. Electrostatic chuck
US5748434A (en) * 1996-06-14 1998-05-05 Applied Materials, Inc. Shield for an electrostatic chuck
US6132517A (en) * 1997-02-21 2000-10-17 Applied Materials, Inc. Multiple substrate processing apparatus for enhanced throughput
US5986874A (en) * 1997-06-03 1999-11-16 Watkins-Johnson Company Electrostatic support assembly having an integral ion focus ring
JP4130255B2 (ja) * 1998-04-08 2008-08-06 キヤノンアネルバ株式会社 プラズマ処理装置
EP1635388A4 (de) 2003-06-17 2009-10-21 Creative Tech Corp Dipolare elektrostatische einspannvorrichtung
US20050016465A1 (en) * 2003-07-23 2005-01-27 Applied Materials, Inc. Electrostatic chuck having electrode with rounded edge
US7264676B2 (en) * 2003-09-11 2007-09-04 United Microelectronics Corp. Plasma apparatus and method capable of adaptive impedance matching
JP5458050B2 (ja) 2011-03-30 2014-04-02 日本碍子株式会社 静電チャックの製法
TW201334213A (zh) * 2011-11-01 2013-08-16 Intevac Inc 處理太陽能電池晶圓的靜電吸盤
US11229968B2 (en) * 2011-11-30 2022-01-25 Watlow Electric Manufacturing Company Semiconductor substrate support with multiple electrodes and method for making same
JP5819895B2 (ja) * 2013-09-05 2015-11-24 日本碍子株式会社 静電チャック
KR102450476B1 (ko) * 2018-02-28 2022-10-05 주식회사 미코세라믹스 정전척 히터 및 그 제조 방법
JP7020238B2 (ja) * 2018-03-29 2022-02-16 住友大阪セメント株式会社 静電チャック装置
US20220130705A1 (en) * 2019-02-22 2022-04-28 Lam Research Corporation Electrostatic chuck with powder coating
KR102472864B1 (ko) 2019-08-06 2022-12-02 주식회사 미코세라믹스 정전척 히터 및 그 제조방법
CN112864079B (zh) * 2021-01-25 2024-02-27 北京北方华创微电子装备有限公司 静电卡盘及半导体加工设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58190037A (ja) * 1982-04-28 1983-11-05 Toshiba Corp 静電チヤツク装置およびその製造方法
JPS6131636U (ja) * 1984-07-31 1986-02-26 株式会社 徳田製作所 静電チヤツク
JP2678381B2 (ja) * 1987-05-06 1997-11-17 ユニサーチ・リミテッド 交流電界励振を利用した静電チャック
US5055964A (en) * 1990-09-07 1991-10-08 International Business Machines Corporation Electrostatic chuck having tapered electrodes
US5099571A (en) * 1990-09-07 1992-03-31 International Business Machines Corporation Method for fabricating a split-ring electrostatic chuck
US5166856A (en) * 1991-01-31 1992-11-24 International Business Machines Corporation Electrostatic chuck with diamond coating
US5184398A (en) * 1991-08-30 1993-02-09 Texas Instruments Incorporated In-situ real-time sheet resistance measurement method
US5213349A (en) * 1991-12-18 1993-05-25 Elliott Joe C Electrostatic chuck

Also Published As

Publication number Publication date
US5452510A (en) 1995-09-26
EP0660388B1 (de) 1999-02-24
DE69416656D1 (de) 1999-04-01
EP0660388A1 (de) 1995-06-28
JP2614421B2 (ja) 1997-05-28
JPH07201961A (ja) 1995-08-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: DOREEY GAGE CO.INC., POUGHKEEPSIE, N.Y., US

8328 Change in the person/name/address of the agent

Free format text: SCHWAN SCHWAN SCHORER, 81739 MUENCHEN