DE69231299D1 - Verfahren zur Herstellung einer elektrostatischen Halteplatte - Google Patents
Verfahren zur Herstellung einer elektrostatischen HalteplatteInfo
- Publication number
- DE69231299D1 DE69231299D1 DE69231299T DE69231299T DE69231299D1 DE 69231299 D1 DE69231299 D1 DE 69231299D1 DE 69231299 T DE69231299 T DE 69231299T DE 69231299 T DE69231299 T DE 69231299T DE 69231299 D1 DE69231299 D1 DE 69231299D1
- Authority
- DE
- Germany
- Prior art keywords
- making
- electrostatic chuck
- chuck
- electrostatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S269/00—Work holders
- Y10S269/903—Work holder for electrical circuit assemblages or wiring systems
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/23—Chucks or sockets with magnetic or electrostatic means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US78922291A | 1991-11-07 | 1991-11-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69231299D1 true DE69231299D1 (de) | 2000-08-31 |
DE69231299T2 DE69231299T2 (de) | 2001-01-18 |
Family
ID=25146963
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69231299T Expired - Fee Related DE69231299T2 (de) | 1991-11-07 | 1992-11-09 | Verfahren zur Herstellung einer elektrostatischen Halteplatte |
DE69224791T Expired - Fee Related DE69224791T2 (de) | 1991-11-07 | 1992-11-09 | Elektrostatische antiklebe Halteplatte für eine Niederdruckumgebung |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69224791T Expired - Fee Related DE69224791T2 (de) | 1991-11-07 | 1992-11-09 | Elektrostatische antiklebe Halteplatte für eine Niederdruckumgebung |
Country Status (4)
Country | Link |
---|---|
US (1) | US5426558A (de) |
EP (2) | EP0734055B1 (de) |
JP (1) | JP3332251B2 (de) |
DE (2) | DE69231299T2 (de) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5600530A (en) * | 1992-08-04 | 1997-02-04 | The Morgan Crucible Company Plc | Electrostatic chuck |
US5631803A (en) * | 1995-01-06 | 1997-05-20 | Applied Materials, Inc. | Erosion resistant electrostatic chuck with improved cooling system |
DE69500566T2 (de) * | 1994-02-28 | 1998-01-29 | Applied Materials Inc | Elektrostatische Halteplatte |
US5883778A (en) * | 1994-02-28 | 1999-03-16 | Applied Materials, Inc. | Electrostatic chuck with fluid flow regulator |
US5535090A (en) * | 1994-03-03 | 1996-07-09 | Sherman; Arthur | Electrostatic chuck |
JPH09213777A (ja) * | 1996-01-31 | 1997-08-15 | Kyocera Corp | 静電チャック |
US5754391A (en) * | 1996-05-17 | 1998-05-19 | Saphikon Inc. | Electrostatic chuck |
JP3455026B2 (ja) * | 1996-09-30 | 2003-10-06 | 京セラ株式会社 | 静電チャック |
US6529362B2 (en) * | 1997-03-06 | 2003-03-04 | Applied Materials Inc. | Monocrystalline ceramic electrostatic chuck |
US5833073A (en) * | 1997-06-02 | 1998-11-10 | Fluoroware, Inc. | Tacky film frame for electronic device |
US5978202A (en) * | 1997-06-27 | 1999-11-02 | Applied Materials, Inc. | Electrostatic chuck having a thermal transfer regulator pad |
JPH11157953A (ja) * | 1997-12-02 | 1999-06-15 | Nhk Spring Co Ltd | セラミックスと金属との構造体及びそれを用いた静電チャック装置 |
JP3356115B2 (ja) * | 1999-05-20 | 2002-12-09 | ウシオ電機株式会社 | レジスト硬化装置 |
US6248642B1 (en) | 1999-06-24 | 2001-06-19 | Ibis Technology Corporation | SIMOX using controlled water vapor for oxygen implants |
US6452195B1 (en) | 1999-08-18 | 2002-09-17 | Ibis Technology Corporation | Wafer holding pin |
US6155436A (en) * | 1999-08-18 | 2000-12-05 | Ibis Technology Corporation | Arc inhibiting wafer holder assembly |
US6423975B1 (en) | 1999-08-18 | 2002-07-23 | Ibis Technology, Inc. | Wafer holder for simox processing |
US6433342B1 (en) | 1999-08-18 | 2002-08-13 | Ibis Technology Corporation | Coated wafer holding pin |
JP3492325B2 (ja) * | 2000-03-06 | 2004-02-03 | キヤノン株式会社 | 画像表示装置の製造方法 |
JP3851489B2 (ja) * | 2000-04-27 | 2006-11-29 | 日本発条株式会社 | 静電チャック |
TWI254403B (en) * | 2000-05-19 | 2006-05-01 | Ngk Insulators Ltd | Electrostatic clamper, and electrostatic attracting structures |
US6583980B1 (en) * | 2000-08-18 | 2003-06-24 | Applied Materials Inc. | Substrate support tolerant to thermal expansion stresses |
DE10330901B4 (de) * | 2002-07-08 | 2010-02-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Elektrostatisches Fixierelement und Verfahren zu seiner Herstellung |
US20070139855A1 (en) * | 2005-12-21 | 2007-06-21 | Asml Netherlands B.V. | Lithographic apparatus and method of manufacturing an electrostatic clamp for a lithographic apparatus |
CN101221893B (zh) * | 2007-01-12 | 2010-05-19 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种促进半导体晶片上静电电荷消散的方法 |
US7667944B2 (en) * | 2007-06-29 | 2010-02-23 | Praxair Technology, Inc. | Polyceramic e-chuck |
US20090075012A1 (en) * | 2007-09-13 | 2009-03-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9194189B2 (en) | 2011-09-19 | 2015-11-24 | Baker Hughes Incorporated | Methods of forming a cutting element for an earth-boring tool, a related cutting element, and an earth-boring tool including such a cutting element |
US8789743B2 (en) * | 2011-11-30 | 2014-07-29 | Component Re-Engineering Company, Inc. | Hermetically joined ceramic assemblies and low temperature method for hermetically joining ceramic materials |
US9105492B2 (en) | 2012-05-08 | 2015-08-11 | LuxVue Technology Corporation | Compliant micro device transfer head |
US9034754B2 (en) | 2012-05-25 | 2015-05-19 | LuxVue Technology Corporation | Method of forming a micro device transfer head with silicon electrode |
US8569115B1 (en) | 2012-07-06 | 2013-10-29 | LuxVue Technology Corporation | Method of forming a compliant bipolar micro device transfer head with silicon electrodes |
CN103578899B (zh) * | 2012-08-06 | 2016-08-24 | 中微半导体设备(上海)有限公司 | 等离子体处理设备及其静电卡盘 |
US9255001B2 (en) | 2012-12-10 | 2016-02-09 | LuxVue Technology Corporation | Micro device transfer head array with metal electrodes |
US9236815B2 (en) * | 2012-12-10 | 2016-01-12 | LuxVue Technology Corporation | Compliant micro device transfer head array with metal electrodes |
JP6854643B2 (ja) | 2013-06-12 | 2021-04-07 | ロヒンニ リミテッド ライアビリティ カンパニー | 付着された光発生源を用いたキーボードバックライティング |
EP3408728A4 (de) | 2016-01-15 | 2019-03-13 | Rohinni, LLC | Vorrichtung und verfahren für rückseitige beleuchtung durch eine abdeckung auf der vorrichtung |
JP6924618B2 (ja) * | 2017-05-30 | 2021-08-25 | 東京エレクトロン株式会社 | 静電チャック及びプラズマ処理装置 |
JP7059064B2 (ja) * | 2018-03-26 | 2022-04-25 | 株式会社日立ハイテク | プラズマ処理装置 |
JP6583897B1 (ja) * | 2018-05-25 | 2019-10-02 | ▲らん▼海精研股▲ふん▼有限公司 | セラミック製静電チャックの製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6059104B2 (ja) * | 1982-02-03 | 1985-12-23 | 株式会社東芝 | 静電チヤツク板 |
JPS59124140A (ja) * | 1982-12-29 | 1984-07-18 | Fujitsu Ltd | 静電吸着装置 |
JPS61192435A (ja) * | 1985-02-21 | 1986-08-27 | Canon Inc | 静電吸着保持装置 |
WO1988009054A1 (en) * | 1987-05-06 | 1988-11-17 | Labtam Limited | Electrostatic chuck using ac field excitation |
JP2665242B2 (ja) * | 1988-09-19 | 1997-10-22 | 東陶機器株式会社 | 静電チャック |
US5001594A (en) * | 1989-09-06 | 1991-03-19 | Mcnc | Electrostatic handling device |
EP0439000B1 (de) * | 1990-01-25 | 1994-09-14 | Applied Materials, Inc. | Elektrostatische Klemmvorrichtung und Verfahren |
FR2661039B1 (fr) * | 1990-04-12 | 1997-04-30 | Commissariat Energie Atomique | Porte-substrat electrostatique. |
US5166856A (en) * | 1991-01-31 | 1992-11-24 | International Business Machines Corporation | Electrostatic chuck with diamond coating |
US5155652A (en) * | 1991-05-02 | 1992-10-13 | International Business Machines Corporation | Temperature cycling ceramic electrostatic chuck |
-
1992
- 1992-11-09 JP JP32221892A patent/JP3332251B2/ja not_active Expired - Fee Related
- 1992-11-09 DE DE69231299T patent/DE69231299T2/de not_active Expired - Fee Related
- 1992-11-09 DE DE69224791T patent/DE69224791T2/de not_active Expired - Fee Related
- 1992-11-09 EP EP96107414A patent/EP0734055B1/de not_active Expired - Lifetime
- 1992-11-09 EP EP92310212A patent/EP0541400B1/de not_active Expired - Lifetime
-
1994
- 1994-03-14 US US08/213,459 patent/US5426558A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0541400B1 (de) | 1998-03-18 |
DE69231299T2 (de) | 2001-01-18 |
EP0541400A3 (en) | 1993-06-30 |
EP0541400A2 (de) | 1993-05-12 |
DE69224791D1 (de) | 1998-04-23 |
JP3332251B2 (ja) | 2002-10-07 |
EP0734055A3 (de) | 1996-11-27 |
EP0734055B1 (de) | 2000-07-26 |
EP0734055A2 (de) | 1996-09-25 |
DE69224791T2 (de) | 1998-07-09 |
US5426558A (en) | 1995-06-20 |
JPH05245734A (ja) | 1993-09-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |