GB9519925D0 - Electrostatic chuck and method of manufacturing the same - Google Patents

Electrostatic chuck and method of manufacturing the same

Info

Publication number
GB9519925D0
GB9519925D0 GBGB9519925.3A GB9519925A GB9519925D0 GB 9519925 D0 GB9519925 D0 GB 9519925D0 GB 9519925 A GB9519925 A GB 9519925A GB 9519925 D0 GB9519925 D0 GB 9519925D0
Authority
GB
United Kingdom
Prior art keywords
manufacturing
same
electrostatic chuck
chuck
electrostatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB9519925.3A
Other versions
GB2293689A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of GB9519925D0 publication Critical patent/GB9519925D0/en
Publication of GB2293689A publication Critical patent/GB2293689A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Jigs For Machine Tools (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
GB9519925A 1994-09-30 1995-09-29 Electrostatic chuck Withdrawn GB2293689A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23723194 1994-09-30

Publications (2)

Publication Number Publication Date
GB9519925D0 true GB9519925D0 (en) 1995-11-29
GB2293689A GB2293689A (en) 1996-04-03

Family

ID=17012333

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9519925A Withdrawn GB2293689A (en) 1994-09-30 1995-09-29 Electrostatic chuck

Country Status (2)

Country Link
KR (1) KR960012283A (en)
GB (1) GB2293689A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5933314A (en) * 1997-06-27 1999-08-03 Lam Research Corp. Method and an apparatus for offsetting plasma bias voltage in bi-polar electro-static chucks
US5880924A (en) * 1997-12-01 1999-03-09 Applied Materials, Inc. Electrostatic chuck capable of rapidly dechucking a substrate
TW432580B (en) * 1998-09-29 2001-05-01 Applied Materials Inc Piezoelectric method and apparatus for semiconductor wafer detection
US6790375B1 (en) * 1998-09-30 2004-09-14 Lam Research Corporation Dechucking method and apparatus for workpieces in vacuum processors
US6965506B2 (en) 1998-09-30 2005-11-15 Lam Research Corporation System and method for dechucking a workpiece from an electrostatic chuck
US6215640B1 (en) * 1998-12-10 2001-04-10 Applied Materials, Inc. Apparatus and method for actively controlling surface potential of an electrostatic chuck
JP2003060018A (en) * 2001-08-13 2003-02-28 Nissin Electric Co Ltd Method and apparatus for attraction of substrate
DE102012109073A1 (en) * 2012-09-26 2014-03-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for operating a gripping device and electrostatic gripping device
MY174723A (en) * 2014-02-07 2020-05-10 Trek Inc System and method for clamping a work piece
CN111954852A (en) * 2018-04-12 2020-11-17 Asml荷兰有限公司 Apparatus comprising an electrostatic chuck and method for operating the apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2106325A (en) * 1981-09-14 1983-04-07 Philips Electronic Associated Electrostatic chuck
JPH06103683B2 (en) * 1990-08-07 1994-12-14 株式会社東芝 Electrostatic adsorption method
EP0506537A1 (en) * 1991-03-28 1992-09-30 Shin-Etsu Chemical Co., Ltd. Electrostatic chuck
US5325261A (en) * 1991-05-17 1994-06-28 Unisearch Limited Electrostatic chuck with improved release
US5436790A (en) * 1993-01-15 1995-07-25 Eaton Corporation Wafer sensing and clamping monitor

Also Published As

Publication number Publication date
GB2293689A (en) 1996-04-03
KR960012283A (en) 1996-04-20

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)