DE69526811D1 - Integrierte Halbleiterschaltung mit zwei Versorgungsspannungen - Google Patents

Integrierte Halbleiterschaltung mit zwei Versorgungsspannungen

Info

Publication number
DE69526811D1
DE69526811D1 DE69526811T DE69526811T DE69526811D1 DE 69526811 D1 DE69526811 D1 DE 69526811D1 DE 69526811 T DE69526811 T DE 69526811T DE 69526811 T DE69526811 T DE 69526811T DE 69526811 D1 DE69526811 D1 DE 69526811D1
Authority
DE
Germany
Prior art keywords
semiconductor circuit
supply voltages
integrated semiconductor
integrated
voltages
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69526811T
Other languages
English (en)
Other versions
DE69526811T2 (de
Inventor
Kazutake Ohara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69526811D1 publication Critical patent/DE69526811D1/de
Publication of DE69526811T2 publication Critical patent/DE69526811T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/30Circuit design
    • G06F30/32Circuit design at the digital level
    • G06F30/327Logic synthesis; Behaviour synthesis, e.g. mapping logic, HDL to netlist, high-level language to RTL or netlist

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Evolutionary Computation (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Logic Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
DE69526811T 1994-01-19 1995-01-18 Integrierte Halbleiterschaltung mit zwei Versorgungsspannungen Expired - Lifetime DE69526811T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP402494 1994-01-19

Publications (2)

Publication Number Publication Date
DE69526811D1 true DE69526811D1 (de) 2002-07-04
DE69526811T2 DE69526811T2 (de) 2002-09-12

Family

ID=11573400

Family Applications (4)

Application Number Title Priority Date Filing Date
DE69528085T Expired - Lifetime DE69528085T2 (de) 1994-01-19 1995-01-18 Intergrierte Halbleiterschaltung mit zwei Versorgungsspannungen
DE69528084T Expired - Lifetime DE69528084T2 (de) 1994-01-19 1995-01-18 Verfahren zum Entwurf einer integrierten Halbleiter-Schaltung
DE69526811T Expired - Lifetime DE69526811T2 (de) 1994-01-19 1995-01-18 Integrierte Halbleiterschaltung mit zwei Versorgungsspannungen
DE69527814T Expired - Lifetime DE69527814T2 (de) 1994-01-19 1995-01-18 Integrierte Halbleiterschaltung mit zwei Versorgungsspannungen

Family Applications Before (2)

Application Number Title Priority Date Filing Date
DE69528085T Expired - Lifetime DE69528085T2 (de) 1994-01-19 1995-01-18 Intergrierte Halbleiterschaltung mit zwei Versorgungsspannungen
DE69528084T Expired - Lifetime DE69528084T2 (de) 1994-01-19 1995-01-18 Verfahren zum Entwurf einer integrierten Halbleiter-Schaltung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69527814T Expired - Lifetime DE69527814T2 (de) 1994-01-19 1995-01-18 Integrierte Halbleiterschaltung mit zwei Versorgungsspannungen

Country Status (5)

Country Link
US (3) US5517132A (de)
EP (4) EP0863471B1 (de)
KR (1) KR0181550B1 (de)
CN (3) CN1170242C (de)
DE (4) DE69528085T2 (de)

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US5612892A (en) * 1993-12-16 1997-03-18 Intel Corporation Method and structure for improving power consumption on a component while maintaining high operating frequency
DE69528085T2 (de) 1994-01-19 2003-01-02 Matsushita Electric Industrial Co., Ltd. Intergrierte Halbleiterschaltung mit zwei Versorgungsspannungen
JP2776262B2 (ja) * 1994-08-18 1998-07-16 日本電気株式会社 論理回路合成方法及び装置
TW305958B (de) * 1995-05-26 1997-05-21 Matsushita Electric Ind Co Ltd
US5963730A (en) * 1995-09-26 1999-10-05 Matsushita Electric Industrial Co., Ltd. Method for automating top-down design processing for the design of LSI functions and LSI mask layouts
US5815004A (en) * 1995-10-16 1998-09-29 Xilinx, Inc. Multi-buffered configurable logic block output lines in a field programmable gate array
US5923569A (en) 1995-10-17 1999-07-13 Matsushita Electric Industrial Co., Ltd. Method for designing layout of semiconductor integrated circuit semiconductor integrated circuit obtained by the same method and method for verifying timing thereof
US6750527B1 (en) * 1996-05-30 2004-06-15 Kabushiki Kaisha Toshiba Semiconductor integrated circuit device having a plurality of wells, test method of testing the semiconductor integrated circuit device, and test device which executes the test method
US5798938A (en) * 1996-07-02 1998-08-25 Hewlett-Packard Co. System and method for verification of a precharge critical path for a system of cascaded dynamic logic gates
JPH1063703A (ja) * 1996-08-26 1998-03-06 Toshiba Corp 低消費電力回路設計方法
US6151568A (en) * 1996-09-13 2000-11-21 Sente, Inc. Power estimation software system
JPH10163843A (ja) * 1996-12-04 1998-06-19 Toshiba Corp 組み合わせ論理回路及びその設計方法
US6269468B1 (en) 1999-03-02 2001-07-31 International Business Machines Corporation Split I/O circuit for performance optimization of digital circuits
WO2001056159A1 (fr) * 2000-01-27 2001-08-02 Hitachi, Ltd. Dispositif a semiconducteur
US6539534B1 (en) * 2000-08-25 2003-03-25 Xilinx, Inc. Apparatus and method for automatically generating circuit designs that meet user output requirements
US6792582B1 (en) * 2000-11-15 2004-09-14 International Business Machines Corporation Concurrent logical and physical construction of voltage islands for mixed supply voltage designs
JP2002190572A (ja) * 2000-12-20 2002-07-05 Fujitsu Ltd 半導体装置、レイアウトデータ設計装置、及び記録媒体
US6728939B2 (en) * 2001-01-08 2004-04-27 Siemens Aktiengesellschaft Method of circuit verification in digital design
JP4082653B2 (ja) * 2001-11-15 2008-04-30 松下電器産業株式会社 高位合成方法および高位合成装置
US7205684B2 (en) * 2002-11-18 2007-04-17 Matsushita Electric Industrial Co., Ltd. Semiconductor integrated circuit device and method for designing the same
US7089510B2 (en) * 2003-11-24 2006-08-08 International Business Machines Corp. Method and program product of level converter optimization
US7111266B2 (en) * 2003-11-24 2006-09-19 International Business Machines Corp. Multiple voltage integrated circuit and design method therefor
US7146471B2 (en) * 2003-12-31 2006-12-05 International Business Machines Corp. System and method for variable array architecture for memories
US9220180B2 (en) 2010-12-09 2015-12-22 Richard Anthony Dunn, JR. System and methods for scalable parallel data processing and process control
CN102859680A (zh) 2011-02-21 2013-01-02 松下电器产业株式会社 集成电路
JP5772492B2 (ja) 2011-10-21 2015-09-02 富士通株式会社 演算処理装置
CN102611431B (zh) * 2012-03-08 2014-12-24 无锡华大国奇科技有限公司 带组合逻辑通路的寄存器
JP6056632B2 (ja) 2013-04-22 2017-01-11 富士通株式会社 データ保持回路、及び、半導体集積回路装置
DE102019208983A1 (de) * 2019-06-19 2020-12-24 Robert Bosch Gmbh Speichervorrichtung zur Speicherung mindestens einer Information in einem bestimmten logischen Zustand
KR102691279B1 (ko) 2019-10-16 2024-08-01 삼성전자주식회사 반도체 장치

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US3950636A (en) 1974-01-16 1976-04-13 Signetics Corporation High speed multiplier logic circuit
US4080539A (en) * 1976-11-10 1978-03-21 Rca Corporation Level shift circuit
JPS57162838A (en) * 1981-03-31 1982-10-06 Fujitsu Ltd Emitter coupling type logical circuit
JPS59116790A (ja) * 1982-12-24 1984-07-05 シチズン時計株式会社 マトリクス型表示装置の駆動回路
US5245224A (en) * 1983-01-31 1993-09-14 Hitachi, Ltd. Level conversion circuitry for a semiconductor integrated circuit
JPH0795395B2 (ja) 1984-02-13 1995-10-11 株式会社日立製作所 半導体集積回路
WO1986002792A1 (en) * 1984-11-02 1986-05-09 Advanced Micro Devices, Inc. Integrated circuit device accepting inputs and providing outputs at the levels of different logic families
JPS62189739A (ja) * 1986-02-17 1987-08-19 Hitachi Ltd 半導体集積回路装置
US5187385A (en) * 1986-08-29 1993-02-16 Kabushiki Kaisha Toshiba Latch circuit including filter for metastable prevention
US5115408A (en) 1988-01-29 1992-05-19 Texas Instruments Incorporated High speed multiplier
US5175693A (en) * 1989-06-01 1992-12-29 Kabushiki Kaisha Toshiba Method of designing semiconductor integrated circuit device
US4978633A (en) * 1989-08-22 1990-12-18 Harris Corporation Hierarchical variable die size gate array architecture
US5541849A (en) 1990-04-06 1996-07-30 Lsi Logic Corporation Method and system for creating and validating low level description of electronic design from higher level, behavior-oriented description, including estimation and comparison of timing parameters
US5218551A (en) * 1990-04-30 1993-06-08 International Business Machines Corporation Timing driven placement
JPH0496369A (ja) * 1990-08-13 1992-03-27 Kawasaki Steel Corp ゲートアレー型lsi
JP3079515B2 (ja) * 1991-01-29 2000-08-21 株式会社東芝 ゲ−トアレイ装置及び入力回路及び出力回路及び降圧回路
JPH04288865A (ja) 1991-03-06 1992-10-13 Mitsubishi Electric Corp 半導体集積回路装置
JP2674353B2 (ja) * 1991-04-04 1997-11-12 日本電気株式会社 概略配線処理方式
US5132577A (en) 1991-04-11 1992-07-21 National Semiconductor Corporation High speed passgate, latch and flip-flop circuits
JP3172211B2 (ja) * 1991-09-05 2001-06-04 富士通株式会社 回路合成システム
JPH0567963A (ja) * 1991-09-06 1993-03-19 Hitachi Ltd 論理集積回路
JPH05299624A (ja) * 1992-04-23 1993-11-12 Mitsubishi Electric Corp 半導体集積回路装置
JP2739013B2 (ja) * 1992-09-01 1998-04-08 三菱電機株式会社 論理合成装置
US5311083A (en) 1993-01-25 1994-05-10 Standard Microsystems Corporation Very low voltage inter-chip CMOS logic signaling for large numbers of high-speed output lines each associated with large capacitive loads
US5300835A (en) 1993-02-10 1994-04-05 Cirrus Logic, Inc. CMOS low power mixed voltage bidirectional I/O buffer
JP3335700B2 (ja) * 1993-03-30 2002-10-21 富士通株式会社 レベルコンバータ及び半導体集積回路
US5432467A (en) * 1993-05-07 1995-07-11 Altera Corporation Programmable logic device with low power voltage level translator
US5408138A (en) * 1993-10-04 1995-04-18 Motorola, Inc. Flip flop circuit and method therefor
DE69528085T2 (de) 1994-01-19 2003-01-02 Matsushita Electric Industrial Co., Ltd. Intergrierte Halbleiterschaltung mit zwei Versorgungsspannungen
US5557533A (en) 1994-04-19 1996-09-17 Lsi Logic Corporation Cell placement alteration apparatus for integrated circuit chip physical design automation system
TW265489B (en) * 1994-07-20 1995-12-11 Micron Technology Inc Low-to-high voltage cmos driver circuit for driving capacitive loads
US5594368A (en) 1995-04-19 1997-01-14 Kabushiki Kaisha Toshiba Low power combinational logic circuit

Also Published As

Publication number Publication date
EP0863472A2 (de) 1998-09-09
KR950024305A (ko) 1995-08-21
DE69526811T2 (de) 2002-09-12
EP0862127A3 (de) 1999-02-17
EP0862127A2 (de) 1998-09-02
EP0863471B1 (de) 2002-09-04
CN1113037A (zh) 1995-12-06
DE69528085T2 (de) 2003-01-02
CN1221984A (zh) 1999-07-07
EP0863471A2 (de) 1998-09-09
CN1099704C (zh) 2003-01-22
DE69528084T2 (de) 2003-01-02
EP0863472B1 (de) 2002-08-14
DE69528084D1 (de) 2002-10-10
EP0862127B1 (de) 2002-09-04
DE69527814T2 (de) 2002-12-12
USRE38152E1 (en) 2003-06-24
US5517132A (en) 1996-05-14
CN1170242C (zh) 2004-10-06
CN1221923A (zh) 1999-07-07
DE69527814D1 (de) 2002-09-19
EP0863472A3 (de) 1999-02-10
EP0664517A3 (de) 1996-07-24
CN1172256C (zh) 2004-10-20
USRE37475E1 (en) 2001-12-18
KR0181550B1 (ko) 1999-04-15
EP0664517B1 (de) 2002-05-29
DE69528085D1 (de) 2002-10-10
EP0664517A2 (de) 1995-07-26
EP0863471A3 (de) 1999-02-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP