DE69524804T2 - Basiszelle für BICMOS und CMOS-Gate-Arrays - Google Patents

Basiszelle für BICMOS und CMOS-Gate-Arrays

Info

Publication number
DE69524804T2
DE69524804T2 DE69524804T DE69524804T DE69524804T2 DE 69524804 T2 DE69524804 T2 DE 69524804T2 DE 69524804 T DE69524804 T DE 69524804T DE 69524804 T DE69524804 T DE 69524804T DE 69524804 T2 DE69524804 T2 DE 69524804T2
Authority
DE
Germany
Prior art keywords
bicmos
gate arrays
basic cell
cmos gate
cmos
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69524804T
Other languages
English (en)
Other versions
DE69524804D1 (de
Inventor
Ching-Hao Shaw
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of DE69524804D1 publication Critical patent/DE69524804D1/de
Application granted granted Critical
Publication of DE69524804T2 publication Critical patent/DE69524804T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits
    • H01L27/11896—Masterslice integrated circuits using combined field effect/bipolar technology
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits
    • H01L27/11803—Masterslice integrated circuits using field effect technology
    • H01L27/11807—CMOS gate arrays

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Logic Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
DE69524804T 1994-05-10 1995-05-04 Basiszelle für BICMOS und CMOS-Gate-Arrays Expired - Lifetime DE69524804T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/240,411 US5591995A (en) 1994-05-10 1994-05-10 Base cell for BiCMOS and CMOS gate arrays

Publications (2)

Publication Number Publication Date
DE69524804D1 DE69524804D1 (de) 2002-02-07
DE69524804T2 true DE69524804T2 (de) 2002-08-22

Family

ID=22906407

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69524804T Expired - Lifetime DE69524804T2 (de) 1994-05-10 1995-05-04 Basiszelle für BICMOS und CMOS-Gate-Arrays

Country Status (6)

Country Link
US (2) US5591995A (de)
EP (1) EP0683524B1 (de)
JP (1) JP3577131B2 (de)
KR (1) KR100377892B1 (de)
DE (1) DE69524804T2 (de)
TW (1) TW268167B (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2720816B2 (ja) * 1995-03-31 1998-03-04 日本電気株式会社 ＢｉＭＯＳ集積回路
JP3008892B2 (ja) * 1997-05-28 2000-02-14 日本電気株式会社 半導体装置
US6218225B1 (en) * 1998-05-14 2001-04-17 Texas Instruments Incorporated Apparatus and method for high density CMOS gate arrays
US6974978B1 (en) * 1999-03-04 2005-12-13 Intel Corporation Gate array architecture
US6480032B1 (en) * 1999-03-04 2002-11-12 Intel Corporation Gate array architecture
JP3313668B2 (ja) * 1999-07-07 2002-08-12 エヌイーシーマイクロシステム株式会社 データ処理装置、情報記憶媒体
US6703641B2 (en) * 2001-11-16 2004-03-09 International Business Machines Corporation Structure for detecting charging effects in device processing
US6650563B2 (en) * 2002-04-23 2003-11-18 Broadcom Corporation Compact and highly efficient DRAM cell
US7454892B2 (en) * 2002-10-30 2008-11-25 Georgia Tech Research Corporation Systems and methods for detection and control of blowout precursors in combustors using acoustical and optical sensing
DE102004059673B4 (de) 2004-12-10 2011-02-03 Infineon Technologies Ag System on Chip, Belichtungsmaskenanordnung und entsprechendes Herstellungsverfahren
JP2007173474A (ja) * 2005-12-21 2007-07-05 Oki Electric Ind Co Ltd ゲートアレイ
US8245180B2 (en) 2006-03-09 2012-08-14 Tela Innovations, Inc. Methods for defining and using co-optimized nanopatterns for integrated circuit design and apparatus implementing same
US8658542B2 (en) 2006-03-09 2014-02-25 Tela Innovations, Inc. Coarse grid design methods and structures
US7956421B2 (en) 2008-03-13 2011-06-07 Tela Innovations, Inc. Cross-coupled transistor layouts in restricted gate level layout architecture
US8653857B2 (en) 2006-03-09 2014-02-18 Tela Innovations, Inc. Circuitry and layouts for XOR and XNOR logic
US9563733B2 (en) 2009-05-06 2017-02-07 Tela Innovations, Inc. Cell circuit and layout with linear finfet structures
US8541879B2 (en) 2007-12-13 2013-09-24 Tela Innovations, Inc. Super-self-aligned contacts and method for making the same
US8448102B2 (en) 2006-03-09 2013-05-21 Tela Innovations, Inc. Optimizing layout of irregular structures in regular layout context
US8839175B2 (en) 2006-03-09 2014-09-16 Tela Innovations, Inc. Scalable meta-data objects
US9035359B2 (en) 2006-03-09 2015-05-19 Tela Innovations, Inc. Semiconductor chip including region including linear-shaped conductive structures forming gate electrodes and having electrical connection areas arranged relative to inner region between transistors of different types and associated methods
US7763534B2 (en) 2007-10-26 2010-07-27 Tela Innovations, Inc. Methods, structures and designs for self-aligning local interconnects used in integrated circuits
US9009641B2 (en) 2006-03-09 2015-04-14 Tela Innovations, Inc. Circuits with linear finfet structures
US8247846B2 (en) 2006-03-09 2012-08-21 Tela Innovations, Inc. Oversized contacts and vias in semiconductor chip defined by linearly constrained topology
US7917879B2 (en) 2007-08-02 2011-03-29 Tela Innovations, Inc. Semiconductor device with dynamic array section
US9230910B2 (en) 2006-03-09 2016-01-05 Tela Innovations, Inc. Oversized contacts and vias in layout defined by linearly constrained topology
US7446352B2 (en) 2006-03-09 2008-11-04 Tela Innovations, Inc. Dynamic array architecture
US8286107B2 (en) 2007-02-20 2012-10-09 Tela Innovations, Inc. Methods and systems for process compensation technique acceleration
US8667443B2 (en) 2007-03-05 2014-03-04 Tela Innovations, Inc. Integrated circuit cell library for multiple patterning
US8453094B2 (en) 2008-01-31 2013-05-28 Tela Innovations, Inc. Enforcement of semiconductor structure regularity for localized transistors and interconnect
US7939443B2 (en) 2008-03-27 2011-05-10 Tela Innovations, Inc. Methods for multi-wire routing and apparatus implementing same
MY152456A (en) 2008-07-16 2014-09-30 Tela Innovations Inc Methods for cell phasing and placement in dynamic array architecture and implementation of the same
US9122832B2 (en) 2008-08-01 2015-09-01 Tela Innovations, Inc. Methods for controlling microloading variation in semiconductor wafer layout and fabrication
US7960759B2 (en) * 2008-10-14 2011-06-14 Arm Limited Integrated circuit layout pattern for cross-coupled circuits
US8661392B2 (en) 2009-10-13 2014-02-25 Tela Innovations, Inc. Methods for cell boundary encroachment and layouts implementing the Same
US9159627B2 (en) 2010-11-12 2015-10-13 Tela Innovations, Inc. Methods for linewidth modification and apparatus implementing the same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0394598B1 (de) * 1989-04-28 1996-03-06 International Business Machines Corporation Gate-Array-Zelle, bestehend aus FET's von verschiedener und optimierter Grösse
US5107147A (en) * 1989-05-15 1992-04-21 Texas Instruments Incorporated Base cell for semi-custom circuit with merged technology
JPH0360072A (ja) * 1989-07-27 1991-03-15 Nec Corp ゲートアレイ方式の半導体集積回路装置
JP2621529B2 (ja) * 1990-01-19 1997-06-18 日本電気株式会社 バイポーラｃｍｏｓ半導体装置
DE4002780C2 (de) * 1990-01-31 1995-01-19 Fraunhofer Ges Forschung Basiszelle für eine kanallose Gate-Array-Anordnung
US5289021A (en) * 1990-05-15 1994-02-22 Siarc Basic cell architecture for mask programmable gate array with 3 or more size transistors
US5068548A (en) * 1990-05-15 1991-11-26 Siarc Bicmos logic circuit for basic applications
US5055716A (en) * 1990-05-15 1991-10-08 Siarc Basic cell for bicmos gate array
US5187556A (en) * 1990-08-13 1993-02-16 Kawasaki Steel Corporation Cmos master slice
US5217915A (en) * 1991-04-08 1993-06-08 Texas Instruments Incorporated Method of making gate array base cell
JP2674378B2 (ja) * 1991-08-26 1997-11-12 株式会社日立製作所 半導体集積回路装置

Also Published As

Publication number Publication date
KR100377892B1 (ko) 2003-06-27
TW268167B (de) 1996-01-11
US5684311A (en) 1997-11-04
JP3577131B2 (ja) 2004-10-13
JPH0851353A (ja) 1996-02-20
US5591995A (en) 1997-01-07
KR950034686A (ko) 1995-12-28
DE69524804D1 (de) 2002-02-07
EP0683524B1 (de) 2002-01-02
EP0683524A1 (de) 1995-11-22

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Legal Events

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