DE69518938D1 - Lawinenphotodiode mit Übergitter - Google Patents

Lawinenphotodiode mit Übergitter

Info

Publication number
DE69518938D1
DE69518938D1 DE69518938T DE69518938T DE69518938D1 DE 69518938 D1 DE69518938 D1 DE 69518938D1 DE 69518938 T DE69518938 T DE 69518938T DE 69518938 T DE69518938 T DE 69518938T DE 69518938 D1 DE69518938 D1 DE 69518938D1
Authority
DE
Germany
Prior art keywords
superlattice
avalanche photodiode
avalanche
photodiode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69518938T
Other languages
English (en)
Other versions
DE69518938T2 (de
Inventor
Isao Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE69518938D1 publication Critical patent/DE69518938D1/de
Publication of DE69518938T2 publication Critical patent/DE69518938T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
    • H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
    • H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier
    • H01L31/107—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier the potential barrier working in avalanche mode, e.g. avalanche photodiode
    • H01L31/1075—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier the potential barrier working in avalanche mode, e.g. avalanche photodiode in which the active layers, e.g. absorption or multiplication layers, form an heterostructure, e.g. SAM structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
    • H01L31/035236—Superlattices; Multiple quantum well structures
DE69518938T 1994-03-22 1995-03-22 Lawinenphotodiode mit Übergitter Expired - Lifetime DE69518938T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5083694 1994-03-22
JP6299996A JP2762939B2 (ja) 1994-03-22 1994-12-02 超格子アバランシェフォトダイオード

Publications (2)

Publication Number Publication Date
DE69518938D1 true DE69518938D1 (de) 2000-11-02
DE69518938T2 DE69518938T2 (de) 2001-04-26

Family

ID=26391309

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69518938T Expired - Lifetime DE69518938T2 (de) 1994-03-22 1995-03-22 Lawinenphotodiode mit Übergitter

Country Status (4)

Country Link
US (1) US5552629A (de)
EP (1) EP0675549B1 (de)
JP (1) JP2762939B2 (de)
DE (1) DE69518938T2 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2601231B2 (ja) * 1994-12-22 1997-04-16 日本電気株式会社 超格子アバランシェフォトダイオード
JP3177962B2 (ja) 1998-05-08 2001-06-18 日本電気株式会社 プレーナ型アバランシェフォトダイオード
JP3141847B2 (ja) * 1998-07-03 2001-03-07 日本電気株式会社 アバランシェフォトダイオード
US6228673B1 (en) * 1999-05-13 2001-05-08 Hughes Electronics Corporation Method of fabricating a surface coupled InGaAs photodetector
JP2001267620A (ja) * 2000-03-22 2001-09-28 Sumitomo Electric Ind Ltd 半導体受光素子
US6586718B2 (en) * 2000-05-25 2003-07-01 Matsushita Electric Industrial Co., Ltd. Photodetector and method for fabricating the same
JP3994655B2 (ja) 2000-11-14 2007-10-24 住友電気工業株式会社 半導体受光素子
US6495380B2 (en) * 2000-12-11 2002-12-17 Nortel Networks Limited Epitaxially grown avalanche photodiode
JP4220688B2 (ja) * 2001-02-26 2009-02-04 日本オプネクスト株式会社 アバランシェホトダイオード
JP4861388B2 (ja) * 2001-02-26 2012-01-25 日本オプネクスト株式会社 アバランシェホトダイオード
JP2003168818A (ja) * 2001-09-18 2003-06-13 Anritsu Corp 順メサ型アバランシェフォトダイオード及びその製造方法
US7072557B2 (en) * 2001-12-21 2006-07-04 Infinera Corporation InP-based photonic integrated circuits with Al-containing waveguide cores and InP-based array waveguide gratings (AWGs) and avalanche photodiodes (APDs) and other optical components containing an InAlGaAs waveguide core
WO2003065418A2 (en) * 2002-02-01 2003-08-07 Picometrix, Inc. Planar avalanche photodiode
ES2616248T3 (es) * 2002-02-01 2017-06-12 Picometrix, Llc Fotodiodo PIN de alta velocidad con respuesta incrementada
CN1633699A (zh) * 2002-02-01 2005-06-29 派克米瑞斯公司 电荷控制雪崩光电二极管及其制造方法
KR20050051532A (ko) * 2003-11-27 2005-06-01 삼성에스디아이 주식회사 전계방출 표시장치
WO2005078809A1 (ja) * 2004-02-13 2005-08-25 Nec Corporation 半導体受光素子
JP4306508B2 (ja) * 2004-03-29 2009-08-05 三菱電機株式会社 アバランシェフォトダイオード
JP4611066B2 (ja) * 2004-04-13 2011-01-12 三菱電機株式会社 アバランシェフォトダイオード
US9640703B2 (en) 2004-10-25 2017-05-02 Mitsubishi Electric Corporation Avalanche photodiode
JP4841834B2 (ja) * 2004-12-24 2011-12-21 浜松ホトニクス株式会社 ホトダイオードアレイ
WO2006080153A1 (ja) * 2005-01-28 2006-08-03 Nec Corporation 半導体受光素子及びその製造方法
US20080191240A1 (en) * 2005-05-18 2008-08-14 Mitsubishi Electric Corporation Avalanche Photo Diode
JP5433948B2 (ja) 2006-01-30 2014-03-05 日本電気株式会社 半導体受光素子
US8030684B2 (en) * 2007-07-18 2011-10-04 Jds Uniphase Corporation Mesa-type photodetectors with lateral diffusion junctions
JP2010135360A (ja) * 2008-12-02 2010-06-17 Mitsubishi Electric Corp アバランシェフォトダイオード
JP5631668B2 (ja) 2010-09-02 2014-11-26 Ｎｔｔエレクトロニクス株式会社 アバランシ・フォトダイオード
US10128397B1 (en) * 2012-05-21 2018-11-13 The Boeing Company Low excess noise, high gain avalanche photodiodes
JP6137732B2 (ja) * 2013-05-16 2017-05-31 住友電気工業株式会社 エピタキシャルウエハおよびその製造方法
US10923614B2 (en) * 2014-07-25 2021-02-16 Panasonic Intellectual Property Management Co., Ltd. Photodiode, photodiode array, and solid-state imaging device
JP5844445B2 (ja) * 2014-09-10 2016-01-20 Ｎｔｔエレクトロニクス株式会社 アバランシ・フォトダイオード
US9584744B2 (en) * 2015-06-23 2017-02-28 Semiconductor Components Industries, Llc Image sensors with voltage-biased trench isolation structures
US11101400B2 (en) * 2017-11-28 2021-08-24 Luxtera Llc Method and system for a focused field avalanche photodiode
CN114256374B (zh) * 2021-12-29 2023-12-05 武汉光谷信息光电子创新中心有限公司 雪崩光电探测器及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0824199B2 (ja) * 1984-05-31 1996-03-06 富士通株式会社 半導体受光素子の製造方法
JPH01149486A (ja) * 1987-12-04 1989-06-12 Fujitsu Ltd 半導体受光素子
JPH02248081A (ja) * 1989-03-22 1990-10-03 Toshiba Corp アバランシェフォトダイオード及びその製造方法
JPH03238879A (ja) * 1990-02-16 1991-10-24 Hitachi Ltd 半導体受光装置
JP2934294B2 (ja) * 1990-04-09 1999-08-16 日本電信電話株式会社 アバランシェフォトダイオード
JP2997528B2 (ja) * 1990-10-17 2000-01-11 株式会社日立製作所 超格子アバランシェフォトダイオードの製造方法
JP2978572B2 (ja) * 1991-02-19 1999-11-15 日本電気株式会社 半導体受光素子
JPH05102517A (ja) * 1991-05-30 1993-04-23 Fujitsu Ltd アバランシエフオトダイオードとその製造方法
JP2998375B2 (ja) * 1991-12-20 2000-01-11 日本電気株式会社 アバランシェフォトダイオード
JPH05190889A (ja) * 1992-01-09 1993-07-30 Hitachi Ltd 光半導体装置
US5288989A (en) * 1993-04-02 1994-02-22 General Electric Company Avalanche photodiode with moisture resistant passivation coating disposed to cover the outer periphery of the photodiode body except at a selected top contact area

Also Published As

Publication number Publication date
DE69518938T2 (de) 2001-04-26
EP0675549A1 (de) 1995-10-04
JP2762939B2 (ja) 1998-06-11
US5552629A (en) 1996-09-03
EP0675549B1 (de) 2000-09-27
JPH07312442A (ja) 1995-11-28

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