DE69516528D1 - Lithografie oder dünnschicht modifizierung - Google Patents

Lithografie oder dünnschicht modifizierung

Info

Publication number
DE69516528D1
DE69516528D1 DE69516528T DE69516528T DE69516528D1 DE 69516528 D1 DE69516528 D1 DE 69516528D1 DE 69516528 T DE69516528 T DE 69516528T DE 69516528 T DE69516528 T DE 69516528T DE 69516528 D1 DE69516528 D1 DE 69516528D1
Authority
DE
Germany
Prior art keywords
lithography
thin film
film modification
modification
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69516528T
Other languages
English (en)
Other versions
DE69516528T2 (de
Inventor
Andre Biebuyck
Bruno Michel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69516528D1 publication Critical patent/DE69516528D1/de
Publication of DE69516528T2 publication Critical patent/DE69516528T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41K—STAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
    • B41K1/00—Portable hand-operated devices without means for supporting or locating the articles to be stamped, i.e. hand stamps; Inking devices or other accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Micromachines (AREA)
DE69516528T 1995-08-04 1995-08-04 Lithografie oder dünnschicht modifizierung Expired - Lifetime DE69516528T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB1995/000610 WO1997006013A1 (en) 1995-08-04 1995-08-04 Lithographic surface or thin layer modification

Publications (2)

Publication Number Publication Date
DE69516528D1 true DE69516528D1 (de) 2000-05-31
DE69516528T2 DE69516528T2 (de) 2000-11-23

Family

ID=11004357

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69516528T Expired - Lifetime DE69516528T2 (de) 1995-08-04 1995-08-04 Lithografie oder dünnschicht modifizierung

Country Status (5)

Country Link
US (1) US5925259A (de)
EP (1) EP0784543B1 (de)
JP (1) JP3415850B2 (de)
DE (1) DE69516528T2 (de)
WO (1) WO1997006013A1 (de)

Families Citing this family (82)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6176962B1 (en) 1990-02-28 2001-01-23 Aclara Biosciences, Inc. Methods for fabricating enclosed microchannel structures
US6507989B1 (en) * 1997-03-13 2003-01-21 President And Fellows Of Harvard College Self-assembly of mesoscale objects
JP3372466B2 (ja) * 1997-12-22 2003-02-04 ティーディーケイ株式会社 偏光板の製造方法
JP2000065718A (ja) * 1998-06-09 2000-03-03 Seiko Instruments Inc 走査型プロ―ブ顕微鏡（ｓｐｍ）プロ―ブ及びｓｐｍ装置
US6555408B1 (en) * 1999-02-05 2003-04-29 Alien Technology Corporation Methods for transferring elements from a template to a substrate
US6736985B1 (en) * 1999-05-05 2004-05-18 Agere Systems Inc. High-resolution method for patterning a substrate with micro-printing
US6294398B1 (en) 1999-11-23 2001-09-25 The Trustees Of Princeton University Method for patterning devices
TW562755B (en) * 1999-12-31 2003-11-21 Ibm Stamp device for printing a pattern on a surface of a substrate
WO2001059523A1 (en) * 2000-02-07 2001-08-16 Koninklijke Philips Electronics N.V. Stamp for use in a lithographic process, method of manufacturing a stamp, and method of manufacturing a patterned layer on a substrate
US7163712B2 (en) 2000-03-03 2007-01-16 Duke University Microstamping activated polymer surfaces
US6444254B1 (en) 2000-03-03 2002-09-03 Duke University Microstamping activated polymer surfaces
SE516194C2 (sv) * 2000-04-18 2001-12-03 Obducat Ab Substrat för samt process vid tillverkning av strukturer
AU2001275984A1 (en) * 2000-07-20 2002-02-05 President And Fellows Of Harvard College Self-assembled electrical networks
US7476523B2 (en) 2000-08-14 2009-01-13 Surface Logix, Inc. Method of patterning a surface using a deformable stamp
US6596346B2 (en) 2000-09-29 2003-07-22 International Business Machines Corporation Silicone elastomer stamp with hydrophilic surfaces and method of making same
US6884093B2 (en) * 2000-10-03 2005-04-26 The Trustees Of Princeton University Organic triodes with novel grid structures and method of production
US6655286B2 (en) * 2001-01-19 2003-12-02 Lucent Technologies Inc. Method for preventing distortions in a flexibly transferred feature pattern
US6517977B2 (en) * 2001-03-28 2003-02-11 Motorola, Inc. Lithographic template and method of formation and use
US6895667B2 (en) * 2001-04-13 2005-05-24 The Trustees Of Princeton University Transfer of patterned metal by cold-welding
US6798464B2 (en) 2001-05-11 2004-09-28 International Business Machines Corporation Liquid crystal display
US6673287B2 (en) * 2001-05-16 2004-01-06 International Business Machines Corporation Vapor phase surface modification of composite substrates to form a molecularly thin release layer
DE10125545A1 (de) 2001-05-23 2002-11-28 Heidelberger Druckmasch Ag Druckverfahren und Vorrichtung
DE10126859A1 (de) * 2001-06-01 2002-12-12 Siemens Ag Verfahren zur Erzeugung von leitfähigen Strukturen mittels Drucktechnik sowie daraus hergestellte aktive Bauelemente für integrierte Schaltungen
US7338613B2 (en) * 2001-09-10 2008-03-04 Surface Logix, Inc. System and process for automated microcontact printing
US6849558B2 (en) 2002-05-22 2005-02-01 The Board Of Trustees Of The Leland Stanford Junior University Replication and transfer of microstructures and nanostructures
JP4639081B2 (ja) * 2002-05-27 2011-02-23 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ スタンプから基板にパターンを転写する方法及び装置
US6971813B2 (en) * 2002-09-27 2005-12-06 Labcoat, Ltd. Contact coating of prostheses
EP1445098A1 (de) * 2003-02-04 2004-08-11 Kba-Giori S.A. Gummituchzylinder für eine Tiefdruckmaschine
US7410904B2 (en) * 2003-04-24 2008-08-12 Hewlett-Packard Development Company, L.P. Sensor produced using imprint lithography
US7244326B2 (en) * 2003-05-16 2007-07-17 Alien Technology Corporation Transfer assembly for manufacturing electronic devices
DE10330456B9 (de) * 2003-07-05 2007-11-08 Erich Thallner Vorrichtung zum Erstellen einer Oberflächenstruktur auf einem Wafer
GB0325748D0 (en) * 2003-11-05 2003-12-10 Koninkl Philips Electronics Nv A method of forming a patterned layer on a substrate
US7632087B2 (en) * 2003-12-19 2009-12-15 Wd Media, Inc. Composite stamper for imprint lithography
ES2244317B1 (es) * 2004-03-05 2007-02-16 Antonio Vallecillo Mora Procedimiento de impresion fotografica sobre metales preciosos y objetos de joyeria fabricados a partir del mismo.
EP1763704A2 (de) * 2004-06-30 2007-03-21 Koninklijke Philips Electronics N.V. Weicher lithographischer stempel mit einer chemisch strukturierten oberfläche
EP1669196B1 (de) * 2004-12-10 2008-05-21 ESSILOR INTERNATIONAL (Compagnie Générale d'Optique) Stempel zum Auftragen eines Motivs, Verfahren zur Stempelherstellung und Verfahren zur Herstellung eines Objekts anhand von diesem Stempel
DE102005005121A1 (de) * 2005-02-04 2006-08-17 Forschungszentrum Jülich GmbH Verfahren zur Herstellung eines Elastomers und Elastomer
JP5180820B2 (ja) * 2005-05-03 2013-04-10 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ スタンプから基板にパターンを転写する方法及び装置
US7968253B2 (en) * 2006-06-20 2011-06-28 Samsung Electronics Co., Ltd. Nano imprint master and method of manufacturing the same
CN101578520B (zh) * 2006-10-18 2015-09-16 哈佛学院院长等 基于形成图案的多孔介质的横向流动和穿过生物测定装置、及其制备方法和使用方法
US20080110363A1 (en) * 2006-11-14 2008-05-15 National Chung Cheng University Physisorption-based microcontact printing process capable of controlling film thickness
US8608972B2 (en) * 2006-12-05 2013-12-17 Nano Terra Inc. Method for patterning a surface
KR20090107494A (ko) * 2006-12-05 2009-10-13 나노 테라 인코포레이티드 표면을 패턴화하는 방법
US8394483B2 (en) 2007-01-24 2013-03-12 Micron Technology, Inc. Two-dimensional arrays of holes with sub-lithographic diameters formed by block copolymer self-assembly
US8083953B2 (en) 2007-03-06 2011-12-27 Micron Technology, Inc. Registered structure formation via the application of directed thermal energy to diblock copolymer films
US8557128B2 (en) 2007-03-22 2013-10-15 Micron Technology, Inc. Sub-10 nm line features via rapid graphoepitaxial self-assembly of amphiphilic monolayers
US7959975B2 (en) 2007-04-18 2011-06-14 Micron Technology, Inc. Methods of patterning a substrate
US8097175B2 (en) 2008-10-28 2012-01-17 Micron Technology, Inc. Method for selectively permeating a self-assembled block copolymer, method for forming metal oxide structures, method for forming a metal oxide pattern, and method for patterning a semiconductor structure
US8294139B2 (en) 2007-06-21 2012-10-23 Micron Technology, Inc. Multilayer antireflection coatings, structures and devices including the same and methods of making the same
US8372295B2 (en) 2007-04-20 2013-02-12 Micron Technology, Inc. Extensions of self-assembled structures to increased dimensions via a “bootstrap” self-templating method
US8404124B2 (en) 2007-06-12 2013-03-26 Micron Technology, Inc. Alternating self-assembling morphologies of diblock copolymers controlled by variations in surfaces
US8080615B2 (en) 2007-06-19 2011-12-20 Micron Technology, Inc. Crosslinkable graft polymer non-preferentially wetted by polystyrene and polyethylene oxide
US8283258B2 (en) 2007-08-16 2012-10-09 Micron Technology, Inc. Selective wet etching of hafnium aluminum oxide films
US8182982B2 (en) * 2008-04-19 2012-05-22 Rolith Inc Method and device for patterning a disk
US8518633B2 (en) 2008-01-22 2013-08-27 Rolith Inc. Large area nanopatterning method and apparatus
US8999492B2 (en) 2008-02-05 2015-04-07 Micron Technology, Inc. Method to produce nanometer-sized features with directed assembly of block copolymers
US8101261B2 (en) 2008-02-13 2012-01-24 Micron Technology, Inc. One-dimensional arrays of block copolymer cylinders and applications thereof
JP5435879B2 (ja) 2008-02-14 2014-03-05 株式会社ダイセル ナノインプリント用硬化性樹脂組成物
JP5101343B2 (ja) * 2008-03-03 2012-12-19 株式会社ダイセル 微細構造物の製造方法
US8580344B2 (en) * 2008-03-17 2013-11-12 Intermolecular, Inc. Stamp usage to enhance surface layer functionalization and selectivity
US8426313B2 (en) 2008-03-21 2013-04-23 Micron Technology, Inc. Thermal anneal of block copolymer films with top interface constrained to wet both blocks with equal preference
US8425982B2 (en) 2008-03-21 2013-04-23 Micron Technology, Inc. Methods of improving long range order in self-assembly of block copolymer films with ionic liquids
CN102016596B (zh) * 2008-03-27 2014-09-17 哈佛学院院长等 纸基微流体系统
WO2009120963A2 (en) * 2008-03-27 2009-10-01 President And Fellows Of Harvard College Paper-based cellular arrays
WO2009121037A2 (en) 2008-03-27 2009-10-01 President And Fellows Of Harvard College Three-dimensional microfluidic devices
US8206992B2 (en) * 2008-03-27 2012-06-26 President And Fellows Of Harvard College Cotton thread as a low-cost multi-assay diagnostic platform
US8114300B2 (en) 2008-04-21 2012-02-14 Micron Technology, Inc. Multi-layer method for formation of registered arrays of cylindrical pores in polymer films
US8192920B2 (en) * 2008-04-26 2012-06-05 Rolith Inc. Lithography method
US8114301B2 (en) 2008-05-02 2012-02-14 Micron Technology, Inc. Graphoepitaxial self-assembly of arrays of downward facing half-cylinders
US20110210480A1 (en) * 2008-11-18 2011-09-01 Rolith, Inc Nanostructures with anti-counterefeiting features and methods of fabricating the same
PL2403645T3 (pl) 2009-03-06 2017-05-31 President And Fellows Of Harvard College Mikroprzepływowe, elektrochemiczne urządzenia
DE102009034532A1 (de) * 2009-07-23 2011-02-03 Msg Lithoglas Ag Verfahren zum Herstellen einer strukturierten Beschichtung auf einem Substrat, beschichtetes Substrat sowie Halbzeug mit einem beschichteten Substrat
US8821810B2 (en) 2010-02-03 2014-09-02 President And Fellows Of Harvard College Devices and methods for multiplexed assays
US8304493B2 (en) 2010-08-20 2012-11-06 Micron Technology, Inc. Methods of forming block copolymers
EP2609467A4 (de) 2010-08-23 2014-07-30 Rolith Inc Maske für nahfeldlithographie und herstellung davon
US8900963B2 (en) 2011-11-02 2014-12-02 Micron Technology, Inc. Methods of forming semiconductor device structures, and related structures
US9087699B2 (en) 2012-10-05 2015-07-21 Micron Technology, Inc. Methods of forming an array of openings in a substrate, and related methods of forming a semiconductor device structure
US9229328B2 (en) 2013-05-02 2016-01-05 Micron Technology, Inc. Methods of forming semiconductor device structures, and related semiconductor device structures
US9177795B2 (en) 2013-09-27 2015-11-03 Micron Technology, Inc. Methods of forming nanostructures including metal oxides
CN104681743B (zh) * 2013-11-29 2017-02-15 清华大学 有机发光二极管的制备方法
KR101645533B1 (ko) * 2014-07-18 2016-08-08 연세대학교 산학협력단 기판 식각 방법 및 장치, 기판 식각용 스탬프 및 이의 제조 방법
US9802195B2 (en) 2014-12-15 2017-10-31 Stmicroelectronics S.R.L. Rigid mask for protecting selective portions of a chip, and use of the rigid mask

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2897066A (en) * 1956-10-12 1959-07-28 Hunt Capacitors Ltd A Electrical capacitors
US3647508A (en) * 1968-08-27 1972-03-07 King Seeley Thermos Co Method of making patterned metal coatings by selective etching of metal
CH507590A (de) * 1969-06-20 1971-05-15 Siemens Ag Verfahren zum Herstellen von kleinflächigen Halbleiterbauelementen
US4021279A (en) * 1972-04-20 1977-05-03 Stichting Reactor Centrum Nederland Method of forming groove pattern
DE2253944C2 (de) * 1972-11-03 1983-02-24 Agfa-Gevaert Ag, 5090 Leverkusen Verfahren zur Herstellung eines Reliefbildes
GB2110162B (en) * 1981-11-17 1985-08-21 Bosch Gmbh Robert A method of producing electrically conductive areas
FR2663760A1 (fr) * 1990-06-26 1991-12-27 Amri Dahbia Procede de fabrication d'un tampon marqueur portatif permettant de reproduire manuellement une photographie d'identite en demi-teinte sur tout document et en nombre illimite.
JPH0580530A (ja) * 1991-09-24 1993-04-02 Hitachi Ltd 薄膜パターン製造方法
US5270078A (en) * 1992-08-14 1993-12-14 E. I. Du Pont De Nemours And Company Method for preparing high resolution wash-off images
US5512131A (en) * 1993-10-04 1996-04-30 President And Fellows Of Harvard College Formation of microstamped patterns on surfaces and derivative articles
SG52730A1 (en) * 1993-11-03 1998-09-28 Corning Inc Color filter and method of printing
US5772905A (en) * 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
US5725788A (en) * 1996-03-04 1998-03-10 Motorola Apparatus and method for patterning a surface

Also Published As

Publication number Publication date
EP0784543A1 (de) 1997-07-23
US5925259A (en) 1999-07-20
JP3415850B2 (ja) 2003-06-09
JPH09511711A (ja) 1997-11-25
EP0784543B1 (de) 2000-04-26
WO1997006013A1 (en) 1997-02-20
DE69516528T2 (de) 2000-11-23

Similar Documents

Publication Publication Date Title
DE69516528D1 (de) Lithografie oder dünnschicht modifizierung
DE69606811T2 (de) Mehrschichtfolie
BR9609314A (pt) Película de multicamadas
DE69429273D1 (de) Dipergierbarer film
DE69637390D1 (de) Poröser film
DE69637811D1 (de) Magnetowiderstandseffekt-Film
DE69612609T2 (de) Polymerischer film
BR9400241A (pt) Película de cobertura
DE69620338D1 (de) Antibeschlagfilm
DE69606195T2 (de) Klebefilm
DE69413272D1 (de) Filmblatt
DE69604199D1 (de) Trennfolie
DE69610452D1 (de) Mehrschichtfolie
DE59400281D1 (de) Antikopierfilm
DE69632972D1 (de) Behandlungsgerät für fotografischen Film
DE69620950T2 (de) Filmkassette
DE9410017U1 (de) Antikopierfilm
DE69620938D1 (de) Schichtfolie
DE69626925T2 (de) Mehrschichtfolie
KR970006839U (ko) 필름투영기
ITTO950678A0 (it) Pellicola fotografica
KR970045357U (ko) 필름 카세트
DE9409532U1 (de) Antikopierfilm
DE69628260D1 (de) Negativmaske
DE59605110D1 (de) Abdeckfolie

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)