DE69501528D1 - Nichtelektrolytische Goldplattierlösung - Google Patents
Nichtelektrolytische GoldplattierlösungInfo
- Publication number
- DE69501528D1 DE69501528D1 DE69501528T DE69501528T DE69501528D1 DE 69501528 D1 DE69501528 D1 DE 69501528D1 DE 69501528 T DE69501528 T DE 69501528T DE 69501528 T DE69501528 T DE 69501528T DE 69501528 D1 DE69501528 D1 DE 69501528D1
- Authority
- DE
- Germany
- Prior art keywords
- plating solution
- electrolytic plating
- gold non
- gold
- electrolytic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000009713 electroplating Methods 0.000 title 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title 1
- 239000010931 gold Substances 0.000 title 1
- 229910052737 gold Inorganic materials 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19535094A JP3302512B2 (ja) | 1994-08-19 | 1994-08-19 | 無電解金めっき液 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69501528D1 true DE69501528D1 (de) | 1998-03-05 |
DE69501528T2 DE69501528T2 (de) | 1998-06-04 |
Family
ID=16339714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69501528T Expired - Lifetime DE69501528T2 (de) | 1994-08-19 | 1995-08-14 | Nichtelektrolytische Goldplattierlösung |
Country Status (5)
Country | Link |
---|---|
US (1) | US5560764A (de) |
EP (1) | EP0697469B1 (de) |
JP (1) | JP3302512B2 (de) |
DE (1) | DE69501528T2 (de) |
ES (1) | ES2112015T3 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3331261B2 (ja) * | 1994-08-19 | 2002-10-07 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 無電解金めっき液 |
JP3466521B2 (ja) * | 1999-10-04 | 2003-11-10 | 新光電気工業株式会社 | 置換型無電解金めっき液及び無電解金めっき方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3700469A (en) * | 1971-03-08 | 1972-10-24 | Bell Telephone Labor Inc | Electroless gold plating baths |
JPS52124428A (en) * | 1976-04-13 | 1977-10-19 | Hideji Sasaki | Nonnelectrolytic gold plating bath |
JPS5948951B2 (ja) * | 1978-08-05 | 1984-11-29 | 日本特殊陶業株式会社 | 無電解金メッキ液 |
FR2441666A1 (fr) * | 1978-11-16 | 1980-06-13 | Prost Tournier Patrick | Procede de depot chimique d'or par reduction autocatalytique |
JPS56152958A (en) * | 1980-04-30 | 1981-11-26 | Mitsubishi Electric Corp | Electroless gold plating solution |
US4337091A (en) * | 1981-03-23 | 1982-06-29 | Hooker Chemicals & Plastics Corp. | Electroless gold plating |
JPS59229478A (ja) * | 1983-06-09 | 1984-12-22 | Noritoshi Honma | 無電解金めつき液の安定剤 |
JPS60121274A (ja) * | 1983-12-06 | 1985-06-28 | Electroplating Eng Of Japan Co | 自己触媒型無電解金めっき液 |
JPS6299477A (ja) * | 1985-10-25 | 1987-05-08 | C Uyemura & Co Ltd | 無電解金めつき液 |
JPH032471A (ja) * | 1989-05-30 | 1991-01-08 | Matsushita Electric Ind Co Ltd | 浴室装置 |
DE4021681A1 (de) * | 1989-07-12 | 1991-03-14 | Kojima Chemicals Co Ltd | Nichtelektrolytische goldplattierloesung |
US4978559A (en) * | 1989-11-03 | 1990-12-18 | General Electric Company | Autocatalytic electroless gold plating composition |
US4985076A (en) * | 1989-11-03 | 1991-01-15 | General Electric Company | Autocatalytic electroless gold plating composition |
JPH0539580A (ja) * | 1991-08-02 | 1993-02-19 | Okuno Seiyaku Kogyo Kk | 無電解パラジウムめつき液 |
-
1994
- 1994-08-19 JP JP19535094A patent/JP3302512B2/ja not_active Expired - Fee Related
-
1995
- 1995-08-14 DE DE69501528T patent/DE69501528T2/de not_active Expired - Lifetime
- 1995-08-14 US US08/514,763 patent/US5560764A/en not_active Expired - Lifetime
- 1995-08-14 EP EP95305654A patent/EP0697469B1/de not_active Expired - Lifetime
- 1995-08-14 ES ES95305654T patent/ES2112015T3/es not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ES2112015T3 (es) | 1998-03-16 |
US5560764A (en) | 1996-10-01 |
JP3302512B2 (ja) | 2002-07-15 |
EP0697469A1 (de) | 1996-02-21 |
DE69501528T2 (de) | 1998-06-04 |
EP0697469B1 (de) | 1998-01-28 |
JPH0860378A (ja) | 1996-03-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |