DE69705349D1 - Elektroplattierungsbad - Google Patents

Elektroplattierungsbad

Info

Publication number
DE69705349D1
DE69705349D1 DE69705349T DE69705349T DE69705349D1 DE 69705349 D1 DE69705349 D1 DE 69705349D1 DE 69705349 T DE69705349 T DE 69705349T DE 69705349 T DE69705349 T DE 69705349T DE 69705349 D1 DE69705349 D1 DE 69705349D1
Authority
DE
Germany
Prior art keywords
electroplating bath
electroplating
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69705349T
Other languages
English (en)
Other versions
DE69705349T2 (de
Inventor
Pietro Luigi Cavallotti
Vittorio Sirtori
Giovanni Zangari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69705349D1 publication Critical patent/DE69705349D1/de
Publication of DE69705349T2 publication Critical patent/DE69705349T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
DE69705349T 1996-04-26 1997-04-01 Elektroplattierungsbad Expired - Lifetime DE69705349T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9608665A GB2312438A (en) 1996-04-26 1996-04-26 Electrodeposition bath containing zinc salt

Publications (2)

Publication Number Publication Date
DE69705349D1 true DE69705349D1 (de) 2001-08-02
DE69705349T2 DE69705349T2 (de) 2002-05-02

Family

ID=10792694

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69705349T Expired - Lifetime DE69705349T2 (de) 1996-04-26 1997-04-01 Elektroplattierungsbad

Country Status (5)

Country Link
US (2) US5783059A (de)
EP (1) EP0803592B1 (de)
JP (1) JP3229239B2 (de)
DE (1) DE69705349T2 (de)
GB (1) GB2312438A (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3592486B2 (ja) * 1997-06-18 2004-11-24 株式会社東芝 ハンダ付け装置
GB2331999B (en) * 1997-10-28 2003-01-22 Ibm Copper preservative treatment
US6204490B1 (en) * 1998-06-04 2001-03-20 Hitachi, Ltd. Method and apparatus of manufacturing an electronic circuit board
DE19908144C1 (de) * 1999-02-25 2000-03-16 Herberts Gmbh & Co Kg Kathodisch abscheidbare Tauchlacke, deren Herstellung und Verwendung
US7452486B2 (en) 2003-05-19 2008-11-18 Arkema Inc. Zinc lanthanide sulfonic acid electrolytes
US20060104855A1 (en) * 2004-11-15 2006-05-18 Metallic Resources, Inc. Lead-free solder alloy
CN103624374B (zh) * 2013-10-29 2017-02-01 洛阳万基金属钠有限公司 一种电解槽基座底部与铜排的焊接方法
CN108866353B (zh) * 2017-05-15 2020-11-17 中南大学 一种从甲基磺酸铋溶液中回收铋的方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2907702A (en) * 1954-04-27 1959-10-06 Sylvania Electric Prod Anodes for electroplating bath
US3966564A (en) * 1974-01-07 1976-06-29 Whyco Chromium Company Inc. Method of electrodepositing an alloy of tin, cobalt and a third metal and electrolyte therefor
GB1497522A (en) * 1975-06-10 1978-01-12 Oxy Metal Industries Corp Electrodeposition of bright coatings on substrates
JPS535034A (en) * 1976-07-06 1978-01-18 Dipsol Chem Neutral electroplating bath for tin or tin alloy
SE415577B (sv) * 1977-09-15 1980-10-13 Magnusson H H Produkter Sett och elektrolyt for att fobereda en stalyta for lackering
JPS6015716B2 (ja) * 1977-10-21 1985-04-20 デイツプソ−ル株式会社 錫または錫合金電気めつき用浴の安定化方法
GB2013241B (en) * 1977-11-16 1982-03-24 Dipsol Chem Electroplating bath for depositing tin or tin alloy with brightness
CA1193222A (en) * 1981-02-25 1985-09-10 Wim M.J.C. Verberne Electroplating cobalt alloy with zinc or tin from amine bath
SU1191492A1 (ru) * 1984-05-08 1985-11-15 Харьковский Ордена Ленина Политехнический Институт Им.В.И.Ленина Электролит дл нанесени блест щих покрытий сплавом олово-висмут
US4699696A (en) * 1986-04-15 1987-10-13 Omi International Corporation Zinc-nickel alloy electrolyte and process
US5039576A (en) * 1989-05-22 1991-08-13 Atochem North America, Inc. Electrodeposited eutectic tin-bismuth alloy on a conductive substrate
US5341980A (en) * 1990-02-19 1994-08-30 Hitachi, Ltd. Method of fabricating electronic circuit device and apparatus for performing the same method
JP3135915B2 (ja) * 1990-08-31 2001-02-19 バリー，ベレズフォド トマス キングカム 錫−亜鉛合金の電着のためのシアン化物を含まないめっき浴
US5200057A (en) * 1991-11-05 1993-04-06 Mcgean-Rohco, Inc. Additive composition, acid zinc and zinc-alloy plating baths and methods for electrodedepositing zinc and zinc alloys
US5698087A (en) * 1992-03-11 1997-12-16 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
JPH0818950B2 (ja) * 1992-05-01 1996-02-28 花王株式会社 化粧料
JP3279353B2 (ja) * 1992-09-25 2002-04-30 ディップソール株式会社 錫−亜鉛合金電気めっき浴
US5368814A (en) * 1993-06-16 1994-11-29 International Business Machines, Inc. Lead free, tin-bismuth solder alloys

Also Published As

Publication number Publication date
JPH1053891A (ja) 1998-02-24
GB2312438A (en) 1997-10-29
US5783059A (en) 1998-07-21
DE69705349T2 (de) 2002-05-02
EP0803592B1 (de) 2001-06-27
EP0803592A1 (de) 1997-10-29
JP3229239B2 (ja) 2001-11-19
US6048629A (en) 2000-04-11
GB9608665D0 (en) 1996-07-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8328 Change in the person/name/address of the agent

Representative=s name: DUSCHER, R., DIPL.-PHYS. DR.RER.NAT., PAT.-ANW., 7