JPS535034A - Neutral electroplating bath for tin or tin alloy - Google Patents

Neutral electroplating bath for tin or tin alloy

Info

Publication number
JPS535034A
JPS535034A JP7953876A JP7953876A JPS535034A JP S535034 A JPS535034 A JP S535034A JP 7953876 A JP7953876 A JP 7953876A JP 7953876 A JP7953876 A JP 7953876A JP S535034 A JPS535034 A JP S535034A
Authority
JP
Japan
Prior art keywords
tin
neutral
electroplating bath
alloy
tin alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7953876A
Other languages
Japanese (ja)
Inventor
Akio Takahashi
Shiyuuji Igarashi
Toshio Igarashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dipsol Chemicals Co Ltd
Original Assignee
Dipsol Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dipsol Chemicals Co Ltd filed Critical Dipsol Chemicals Co Ltd
Priority to JP7953876A priority Critical patent/JPS535034A/en
Publication of JPS535034A publication Critical patent/JPS535034A/en
Pending legal-status Critical Current

Links

JP7953876A 1976-07-06 1976-07-06 Neutral electroplating bath for tin or tin alloy Pending JPS535034A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7953876A JPS535034A (en) 1976-07-06 1976-07-06 Neutral electroplating bath for tin or tin alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7953876A JPS535034A (en) 1976-07-06 1976-07-06 Neutral electroplating bath for tin or tin alloy

Publications (1)

Publication Number Publication Date
JPS535034A true JPS535034A (en) 1978-01-18

Family

ID=13692761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7953876A Pending JPS535034A (en) 1976-07-06 1976-07-06 Neutral electroplating bath for tin or tin alloy

Country Status (1)

Country Link
JP (1) JPS535034A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0288789A (en) * 1988-09-22 1990-03-28 C Uyemura & Co Ltd Bismuth-tin alloy electroplating bath and plating method
EP0770711A1 (en) * 1995-09-07 1997-05-02 Dipsol Chemical Co., Ltd Sn-Bi alloy-plating bath and method for forming plated Sn-Bi alloy film
US5674374A (en) * 1993-06-01 1997-10-07 Dipsol Chemicals Co., Ltd. Sn-Bi alloy-plating bath and plating method using the same
EP0803592A1 (en) * 1996-04-26 1997-10-29 International Business Machines Corporation Electrodeposition bath
CN104060309A (en) * 2014-06-13 2014-09-24 安徽省宁国天成电工有限公司 Surface tinning method of metallic copper wire

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0288789A (en) * 1988-09-22 1990-03-28 C Uyemura & Co Ltd Bismuth-tin alloy electroplating bath and plating method
US5674374A (en) * 1993-06-01 1997-10-07 Dipsol Chemicals Co., Ltd. Sn-Bi alloy-plating bath and plating method using the same
EP0770711A1 (en) * 1995-09-07 1997-05-02 Dipsol Chemical Co., Ltd Sn-Bi alloy-plating bath and method for forming plated Sn-Bi alloy film
EP0803592A1 (en) * 1996-04-26 1997-10-29 International Business Machines Corporation Electrodeposition bath
US5783059A (en) * 1996-04-26 1998-07-21 International Business Machines Corporation Electrodeposition bath
CN104060309A (en) * 2014-06-13 2014-09-24 安徽省宁国天成电工有限公司 Surface tinning method of metallic copper wire

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