JPS535034A - Neutral electroplating bath for tin or tin alloy - Google Patents
Neutral electroplating bath for tin or tin alloyInfo
- Publication number
- JPS535034A JPS535034A JP7953876A JP7953876A JPS535034A JP S535034 A JPS535034 A JP S535034A JP 7953876 A JP7953876 A JP 7953876A JP 7953876 A JP7953876 A JP 7953876A JP S535034 A JPS535034 A JP S535034A
- Authority
- JP
- Japan
- Prior art keywords
- tin
- neutral
- electroplating bath
- alloy
- tin alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7953876A JPS535034A (en) | 1976-07-06 | 1976-07-06 | Neutral electroplating bath for tin or tin alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7953876A JPS535034A (en) | 1976-07-06 | 1976-07-06 | Neutral electroplating bath for tin or tin alloy |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS535034A true JPS535034A (en) | 1978-01-18 |
Family
ID=13692761
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7953876A Pending JPS535034A (en) | 1976-07-06 | 1976-07-06 | Neutral electroplating bath for tin or tin alloy |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS535034A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0288789A (en) * | 1988-09-22 | 1990-03-28 | C Uyemura & Co Ltd | Bismuth-tin alloy electroplating bath and plating method |
EP0770711A1 (en) * | 1995-09-07 | 1997-05-02 | Dipsol Chemical Co., Ltd | Sn-Bi alloy-plating bath and method for forming plated Sn-Bi alloy film |
US5674374A (en) * | 1993-06-01 | 1997-10-07 | Dipsol Chemicals Co., Ltd. | Sn-Bi alloy-plating bath and plating method using the same |
EP0803592A1 (en) * | 1996-04-26 | 1997-10-29 | International Business Machines Corporation | Electrodeposition bath |
CN104060309A (en) * | 2014-06-13 | 2014-09-24 | 安徽省宁国天成电工有限公司 | Surface tinning method of metallic copper wire |
-
1976
- 1976-07-06 JP JP7953876A patent/JPS535034A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0288789A (en) * | 1988-09-22 | 1990-03-28 | C Uyemura & Co Ltd | Bismuth-tin alloy electroplating bath and plating method |
US5674374A (en) * | 1993-06-01 | 1997-10-07 | Dipsol Chemicals Co., Ltd. | Sn-Bi alloy-plating bath and plating method using the same |
EP0770711A1 (en) * | 1995-09-07 | 1997-05-02 | Dipsol Chemical Co., Ltd | Sn-Bi alloy-plating bath and method for forming plated Sn-Bi alloy film |
EP0803592A1 (en) * | 1996-04-26 | 1997-10-29 | International Business Machines Corporation | Electrodeposition bath |
US5783059A (en) * | 1996-04-26 | 1998-07-21 | International Business Machines Corporation | Electrodeposition bath |
CN104060309A (en) * | 2014-06-13 | 2014-09-24 | 安徽省宁国天成电工有限公司 | Surface tinning method of metallic copper wire |
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