DE69411060D1 - Nichtelektrolytische Goldplattierlösung - Google Patents

Nichtelektrolytische Goldplattierlösung

Info

Publication number
DE69411060D1
DE69411060D1 DE69411060T DE69411060T DE69411060D1 DE 69411060 D1 DE69411060 D1 DE 69411060D1 DE 69411060 T DE69411060 T DE 69411060T DE 69411060 T DE69411060 T DE 69411060T DE 69411060 D1 DE69411060 D1 DE 69411060D1
Authority
DE
Germany
Prior art keywords
plating solution
electrolytic plating
gold non
gold
electrolytic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69411060T
Other languages
English (en)
Other versions
DE69411060T2 (de
Inventor
Masanobu Tsujimoto
Keizin Morimoto
Isamu Yanada
Tooru Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
C Uyemura and Co Ltd
Original Assignee
C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by C Uyemura and Co Ltd filed Critical C Uyemura and Co Ltd
Application granted granted Critical
Publication of DE69411060D1 publication Critical patent/DE69411060D1/de
Publication of DE69411060T2 publication Critical patent/DE69411060T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE1994611060 1993-03-26 1994-03-25 Nichtelektrolytische Goldplattierlösung Expired - Fee Related DE69411060T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9220293A JP2927142B2 (ja) 1993-03-26 1993-03-26 無電解金めっき浴及び無電解金めっき方法

Publications (2)

Publication Number Publication Date
DE69411060D1 true DE69411060D1 (de) 1998-07-23
DE69411060T2 DE69411060T2 (de) 1998-12-10

Family

ID=14047867

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1994611060 Expired - Fee Related DE69411060T2 (de) 1993-03-26 1994-03-25 Nichtelektrolytische Goldplattierlösung

Country Status (3)

Country Link
EP (1) EP0618308B1 (de)
JP (1) JP2927142B2 (de)
DE (1) DE69411060T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19651900A1 (de) * 1996-12-13 1998-06-18 Albert Thorp Gmbh Elektrolyt für eine reduktive Goldabscheidung
WO1999018255A1 (en) * 1997-10-03 1999-04-15 Massachusetts Institute Of Technology Selective substrate metallization
TW554348B (en) * 1999-05-13 2003-09-21 Shinetsu Chemical Co Conductive powder and making process
JP4839509B2 (ja) * 2000-12-25 2011-12-21 株式会社村田製作所 セラミック電子部品
JP3482402B2 (ja) * 2001-06-29 2003-12-22 日本エレクトロプレイテイング・エンジニヤース株式会社 置換金メッキ液
JP4932094B2 (ja) * 2001-07-02 2012-05-16 日本リーロナール有限会社 無電解金めっき液および無電解金めっき方法
TWI224120B (en) * 2001-09-11 2004-11-21 Daicel Polymer Ltd Process for manufacturing plated resin molded article
JP4375702B2 (ja) * 2001-10-25 2009-12-02 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． めっき組成物
SG116489A1 (en) * 2003-04-21 2005-11-28 Shipley Co Llc Plating composition.
JP4713289B2 (ja) * 2005-09-30 2011-06-29 エヌ・イーケムキャット株式会社 バンプ形成用非シアン系電解金めっき浴
JP2008174796A (ja) * 2007-01-18 2008-07-31 Mitsubishi Chemicals Corp 金メッキ液および金メッキ方法
JP5370886B2 (ja) 2009-03-10 2013-12-18 関東化学株式会社 金微細構造体形成用無電解金めっき液およびこれを用いた金微細構造体形成方法ならびにこれを用いた金微細構造体
CN105745355B (zh) * 2014-08-25 2018-03-30 小岛化学药品株式会社 还原型化学镀金液及使用该镀金液的化学镀金方法
JP2023058312A (ja) 2021-10-13 2023-04-25 上村工業株式会社 無電解金めっき浴

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2441666A1 (fr) * 1978-11-16 1980-06-13 Prost Tournier Patrick Procede de depot chimique d'or par reduction autocatalytique
US4999054A (en) * 1986-12-19 1991-03-12 Lamerie, N.V. Gold plating solutions, creams and baths
DE3707817A1 (de) * 1987-03-09 1988-09-22 Schering Ag Stabilisiertes alkalisches goldbad zur stromlosen abscheidung von gold
DE630991T1 (de) * 1992-11-25 1995-07-13 Kanto Kagaku Stromloses goldbeschichtungsbad.

Also Published As

Publication number Publication date
DE69411060T2 (de) 1998-12-10
JPH06280039A (ja) 1994-10-04
EP0618308A1 (de) 1994-10-05
JP2927142B2 (ja) 1999-07-28
EP0618308B1 (de) 1998-06-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee