DE69424535D1 - Trommelseite-behandelte metallfolie und laminat zur verwendung in leiterplatten und verfahren zur herstellung - Google Patents

Trommelseite-behandelte metallfolie und laminat zur verwendung in leiterplatten und verfahren zur herstellung

Info

Publication number
DE69424535D1
DE69424535D1 DE69424535T DE69424535T DE69424535D1 DE 69424535 D1 DE69424535 D1 DE 69424535D1 DE 69424535 T DE69424535 T DE 69424535T DE 69424535 T DE69424535 T DE 69424535T DE 69424535 D1 DE69424535 D1 DE 69424535D1
Authority
DE
Germany
Prior art keywords
laminate
foil
drum
printed circuit
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69424535T
Other languages
English (en)
Other versions
DE69424535T2 (de
Inventor
Eric Seip
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polyclad Laminates Inc
Original Assignee
Polyclad Laminates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyclad Laminates Inc filed Critical Polyclad Laminates Inc
Publication of DE69424535D1 publication Critical patent/DE69424535D1/de
Application granted granted Critical
Publication of DE69424535T2 publication Critical patent/DE69424535T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0147Carriers and holders
    • H05K2203/0152Temporary metallic carrier, e.g. for transferring material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0307Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0315Oxidising metal
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0502Patterning and lithography
    • H05K2203/0522Using an adhesive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/068Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703Plating
    • H05K2203/0723Electroplating, e.g. finish plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703Plating
    • H05K2203/0726Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • H05K3/064Photoresists
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE69424535T 1993-03-05 1994-03-02 Trommelseite-behandelte metallfolie und laminat zur verwendung in leiterplatten und verfahren zur herstellung Expired - Lifetime DE69424535T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US2762093A 1993-03-05 1993-03-05
US17675094A 1994-01-03 1994-01-03
PCT/US1994/002309 WO1994021097A2 (en) 1993-03-05 1994-03-02 Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture

Publications (2)

Publication Number Publication Date
DE69424535D1 true DE69424535D1 (de) 2000-06-21
DE69424535T2 DE69424535T2 (de) 2001-01-18

Family

ID=26702704

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69424535T Expired - Lifetime DE69424535T2 (de) 1993-03-05 1994-03-02 Trommelseite-behandelte metallfolie und laminat zur verwendung in leiterplatten und verfahren zur herstellung

Country Status (9)

Country Link
EP (1) EP0687405B1 (de)
JP (1) JPH08511654A (de)
KR (1) KR960701581A (de)
AT (1) ATE193176T1 (de)
AU (1) AU6941394A (de)
CA (1) CA2157587C (de)
DE (1) DE69424535T2 (de)
SG (1) SG52528A1 (de)
WO (1) WO1994021097A2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5779870A (en) * 1993-03-05 1998-07-14 Polyclad Laminates, Inc. Method of manufacturing laminates and printed circuit boards
US5679230A (en) * 1995-08-21 1997-10-21 Oak-Mitsui, Inc. Copper foil for printed circuit boards
US6584820B1 (en) 1999-09-23 2003-07-01 Polyclad Laminates, Inc. Surface enhanced metal press plates for use in manufacture of laminates and multilayer materials and method of making same
DE10048243A1 (de) * 2000-09-29 2002-04-18 Bosch Gmbh Robert Substrat mit geglätteter Oberfläche und Verfahren zu seiner Herstellung
US7148566B2 (en) * 2001-03-26 2006-12-12 International Business Machines Corporation Method and structure for an organic package with improved BGA life
JP4379854B2 (ja) 2001-10-30 2009-12-09 日鉱金属株式会社 表面処理銅箔
CN104502715B (zh) * 2014-12-31 2017-07-04 广州兴森快捷电路科技有限公司 阻抗板的阻抗测试方法
JP7034946B2 (ja) * 2016-05-18 2022-03-14 イソラ・ユーエスエイ・コーポレイション 回路基板の製造方法
CN110312370A (zh) * 2019-06-11 2019-10-08 江西弘高科技有限公司 一种印制线路板内存条的制作方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3585010A (en) * 1968-10-03 1971-06-15 Clevite Corp Printed circuit board and method of making same
AU579517B2 (en) * 1986-06-20 1988-11-24 Gould Inc. Double matte finish copper foil
US4997516A (en) * 1989-07-10 1991-03-05 Edward Adler Method for improving adherence of copper foil to resinous substrates
US5153050A (en) * 1991-08-27 1992-10-06 Johnston James A Component of printed circuit boards
JPH0766933B2 (ja) * 1991-09-18 1995-07-19 三井金属鉱業株式会社 Tabテープの製造方法

Also Published As

Publication number Publication date
SG52528A1 (en) 1998-09-28
KR960701581A (ko) 1996-02-24
AU6941394A (en) 1994-09-26
CA2157587A1 (en) 1994-09-15
WO1994021097A3 (en) 1994-10-27
EP0687405B1 (de) 2000-05-17
WO1994021097A2 (en) 1994-09-15
JPH08511654A (ja) 1996-12-03
EP0687405A1 (de) 1995-12-20
CA2157587C (en) 2004-12-07
DE69424535T2 (de) 2001-01-18
ATE193176T1 (de) 2000-06-15

Similar Documents

Publication Publication Date Title
MY119781A (en) Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture
ATE94328T1 (de) Verfahren zur herstellung einer starre und flexible bereiche aufweisenden leiterplatte.
DE69424535D1 (de) Trommelseite-behandelte metallfolie und laminat zur verwendung in leiterplatten und verfahren zur herstellung
KR101087357B1 (ko) 도전체-피복 적층체, 배선 회로판 및 이의 제조 프로세스
US4421608A (en) Method for stripping peel apart conductive structures
JP2022008960A5 (de)
KR100584956B1 (ko) 경연성 다층 인쇄회로기판의 제조방법
JPH0493093A (ja) 配線基板の電子部品収納用凹部形成方法
JPH07176837A (ja) リジッドフレックスプリント配線板及びその製造方法
WO1999057949A1 (en) Intermediate layer to improve peel strength of copper foils
TH28011B (th) วิธีการของการผลิตชั้นบางและแผงวงจรพิมพ์
JPH0750455A (ja) リジッドフレックスプリント配線板およびその製造方法
JPH08148836A (ja) 多層フレックスリジット配線板
JPH043119B2 (de)
JPH0320917B2 (de)
JPS61120736A (ja) 多層プリント配線板の製法
JP3241504B2 (ja) リジッドフレックスプリント配線板及びその製造方法
JP2007095769A (ja) 多層印刷配線用銅張積層板の製造方法
JPH06350207A (ja) リジッドフレックスプリント配線板およびその製造方法
JPH01143294A (ja) 多層プリント配線板の製造法
JPH03128238A (ja) 金属複合積層体の製造方法
JPS63107092A (ja) 金属ベ−スプリント基板の製造方法
KR20020086455A (ko) 구리 호일의 제조방법
KR20000055033A (ko) 다층 금속인쇄회로기판의 제조방법
JPH0262095A (ja) 多層プリント配線板の製造方法

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee
8370 Indication related to discontinuation of the patent is to be deleted