CN104502715B - 阻抗板的阻抗测试方法 - Google Patents
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- CN104502715B CN104502715B CN201410856507.7A CN201410856507A CN104502715B CN 104502715 B CN104502715 B CN 104502715B CN 201410856507 A CN201410856507 A CN 201410856507A CN 104502715 B CN104502715 B CN 104502715B
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- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 claims abstract description 87
- 238000010586 diagram Methods 0.000 claims abstract description 33
- 238000012360 testing method Methods 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 14
- 238000003801 milling Methods 0.000 claims description 18
- 238000013461 design Methods 0.000 claims description 6
- 230000002457 bidirectional effect Effects 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 claims description 3
- 238000005070 sampling Methods 0.000 claims description 3
- 235000012550 Pimpinella anisum Nutrition 0.000 description 1
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CN201410856507.7A CN104502715B (zh) | 2014-12-31 | 2014-12-31 | 阻抗板的阻抗测试方法 |
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Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105813374B (zh) * | 2016-04-11 | 2018-09-25 | 广州兴森快捷电路科技有限公司 | 一种外层阻抗的管控方法 |
CN106855590A (zh) * | 2016-11-18 | 2017-06-16 | 深圳崇达多层线路板有限公司 | 一种pcb阻抗模块结构及其检测方法 |
CN107479414A (zh) * | 2017-08-14 | 2017-12-15 | 奥士康科技股份有限公司 | 一种阻抗条的制作方法 |
CN109870641B (zh) * | 2019-02-26 | 2021-11-09 | 广州兴森快捷电路科技有限公司 | 印刷电路板生产方法及其半成品阻抗检测方法 |
CN111475996B (zh) * | 2020-04-10 | 2023-02-28 | 苏州浪潮智能科技有限公司 | 一种coupon单元的设置方法、装置以及设备 |
CN112770502B (zh) * | 2020-11-07 | 2022-11-15 | 龙南骏亚电子科技有限公司 | 一种电路板阻抗一致性控制技术制作方法 |
CN112946365B (zh) * | 2021-03-01 | 2024-05-28 | 广州广合科技股份有限公司 | 自动制作阻抗测试文件的方法、电子设备及存储介质 |
CN114966210A (zh) * | 2022-05-26 | 2022-08-30 | 欣强电子(清远)有限公司 | 光模块连片板阻抗测试方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2157587C (en) * | 1993-03-05 | 2004-12-07 | D. Eric Seip | Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture |
CN101413973A (zh) * | 2008-11-26 | 2009-04-22 | 电子科技大学 | 一种线路板特性阻抗测试系统和方法 |
CN101672874A (zh) * | 2009-09-23 | 2010-03-17 | 深圳市博敏电子有限公司 | 微带传输线阻抗参数测试方法 |
CN101930030A (zh) * | 2009-06-26 | 2010-12-29 | 鸿富锦精密工业(深圳)有限公司 | 电子信号走线特性阻抗测试系统及方法 |
CN201854500U (zh) * | 2010-11-03 | 2011-06-01 | 竞陆电子(昆山)有限公司 | 电路板的拼板阻抗条改良结构 |
CN102331527A (zh) * | 2010-07-12 | 2012-01-25 | 英业达股份有限公司 | 一种在印刷电路板中用于自动检测阻抗特性的方法 |
CN202230136U (zh) * | 2011-09-28 | 2012-05-23 | 北大方正集团有限公司 | 一种印刷电路板pcb阻抗测试板以及pcb在制板 |
CN202396086U (zh) * | 2011-12-31 | 2012-08-22 | 昆山旭发电子有限公司 | 线路板阻抗条以及线路板 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000357180A (ja) * | 1999-06-15 | 2000-12-26 | Nec Corp | プリント配線板の製造方法 |
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- 2014-12-31 CN CN201410856507.7A patent/CN104502715B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2157587C (en) * | 1993-03-05 | 2004-12-07 | D. Eric Seip | Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture |
CN101413973A (zh) * | 2008-11-26 | 2009-04-22 | 电子科技大学 | 一种线路板特性阻抗测试系统和方法 |
CN101930030A (zh) * | 2009-06-26 | 2010-12-29 | 鸿富锦精密工业(深圳)有限公司 | 电子信号走线特性阻抗测试系统及方法 |
CN101672874A (zh) * | 2009-09-23 | 2010-03-17 | 深圳市博敏电子有限公司 | 微带传输线阻抗参数测试方法 |
CN102331527A (zh) * | 2010-07-12 | 2012-01-25 | 英业达股份有限公司 | 一种在印刷电路板中用于自动检测阻抗特性的方法 |
CN201854500U (zh) * | 2010-11-03 | 2011-06-01 | 竞陆电子(昆山)有限公司 | 电路板的拼板阻抗条改良结构 |
CN202230136U (zh) * | 2011-09-28 | 2012-05-23 | 北大方正集团有限公司 | 一种印刷电路板pcb阻抗测试板以及pcb在制板 |
CN202396086U (zh) * | 2011-12-31 | 2012-08-22 | 昆山旭发电子有限公司 | 线路板阻抗条以及线路板 |
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Application publication date: 20150408 Assignee: Guangzhou Kaide Finance Leasing Co.,Ltd. Assignor: SHENZHEN FASTPRINT CIRCUIT TECH Co.,Ltd.|GUANGZHOU FASTPRINT CIRCUIT TECH Co.,Ltd.|YIXING SILICON VALLEY ELECTRONICS TECH Co.,Ltd.|GUANGZHOU XINGSEN ELECTRONIC Co.,Ltd. Contract record no.: 2019990000235 Denomination of invention: Impedance testing method of impedance board Granted publication date: 20170704 License type: Exclusive License Record date: 20190716 |
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Denomination of invention: Impedance testing method of impedance board Effective date of registration: 20190807 Granted publication date: 20170704 Pledgee: Guangzhou Kaide Finance Leasing Co.,Ltd. Pledgor: GUANGZHOU FASTPRINT CIRCUIT TECH Co.,Ltd.|YIXING SILICON VALLEY ELECTRONICS TECH Co.,Ltd.|SHENZHEN FASTPRINT CIRCUIT TECH Co.,Ltd. Registration number: Y2019990000032 |
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Assignee: Guangzhou Kaide Finance Leasing Co.,Ltd. Assignor: GUANGZHOU FASTPRINT CIRCUIT TECH Co.,Ltd.|SHENZHEN FASTPRINT CIRCUIT TECH Co.,Ltd.|YIXING SILICON VALLEY ELECTRONICS TECH Co.,Ltd.|GUANGZHOU XINGSEN ELECTRONIC Co.,Ltd. Contract record no.: 2019990000235 Date of cancellation: 20220922 |
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Date of cancellation: 20220922 Granted publication date: 20170704 Pledgee: Guangzhou Kaide Finance Leasing Co.,Ltd. Pledgor: GUANGZHOU FASTPRINT CIRCUIT TECH Co.,Ltd.|YIXING SILICON VALLEY ELECTRONICS TECH Co.,Ltd.|SHENZHEN FASTPRINT CIRCUIT TECH Co.,Ltd. Registration number: Y2019990000032 |
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