DE69422344T2 - Schleifmittelzusammensetzung mit elektrolytischem Wasser und Polierverfahren unter Anwendung derselben - Google Patents

Schleifmittelzusammensetzung mit elektrolytischem Wasser und Polierverfahren unter Anwendung derselben

Info

Publication number
DE69422344T2
DE69422344T2 DE69422344T DE69422344T DE69422344T2 DE 69422344 T2 DE69422344 T2 DE 69422344T2 DE 69422344 T DE69422344 T DE 69422344T DE 69422344 T DE69422344 T DE 69422344T DE 69422344 T2 DE69422344 T2 DE 69422344T2
Authority
DE
Germany
Prior art keywords
abrasive composition
electrolytic water
same
polishing process
abrasive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69422344T
Other languages
English (en)
Other versions
DE69422344D1 (de
Inventor
Masatsume Kobayashi
Koji Takemasa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE69422344D1 publication Critical patent/DE69422344D1/de
Application granted granted Critical
Publication of DE69422344T2 publication Critical patent/DE69422344T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C11/00—Selection of abrasive materials or additives for abrasive blasts
    • B24C11/005—Selection of abrasive materials or additives for abrasive blasts of additives, e.g. anti-corrosive or disinfecting agents in solid, liquid or gaseous form
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
DE69422344T 1993-07-28 1994-07-26 Schleifmittelzusammensetzung mit elektrolytischem Wasser und Polierverfahren unter Anwendung derselben Expired - Fee Related DE69422344T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20447893A JP3098661B2 (ja) 1993-07-28 1993-07-28 研磨剤組成物及びそれを用いる研磨方法

Publications (2)

Publication Number Publication Date
DE69422344D1 DE69422344D1 (de) 2000-02-03
DE69422344T2 true DE69422344T2 (de) 2000-05-18

Family

ID=16491194

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69422344T Expired - Fee Related DE69422344T2 (de) 1993-07-28 1994-07-26 Schleifmittelzusammensetzung mit elektrolytischem Wasser und Polierverfahren unter Anwendung derselben

Country Status (6)

Country Link
US (1) US5735729A (de)
EP (1) EP0637619B1 (de)
JP (1) JP3098661B2 (de)
AT (1) ATE188233T1 (de)
DE (1) DE69422344T2 (de)
TW (1) TW337535B (de)

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JPH09186116A (ja) * 1995-12-27 1997-07-15 Toshiba Corp 半導体装置の製造方法及び半導体製造装置
US5962343A (en) * 1996-07-30 1999-10-05 Nissan Chemical Industries, Ltd. Process for producing crystalline ceric oxide particles and abrasive
US6290735B1 (en) 1997-10-31 2001-09-18 Nanogram Corporation Abrasive particles for surface polishing
US6099798A (en) 1997-10-31 2000-08-08 Nanogram Corp. Ultraviolet light block and photocatalytic materials
JP4113282B2 (ja) * 1998-05-07 2008-07-09 スピードファム株式会社 研磨組成物及びそれを用いたエッジポリッシング方法
FR2781922B1 (fr) 1998-07-31 2001-11-23 Clariant France Sa Procede de polissage mecano-chimique d'une couche en un materiau a base de cuivre
JP3693847B2 (ja) * 1999-03-26 2005-09-14 Ｎｅｃエレクトロニクス株式会社 研磨後ウェハの保管方法および装置
US6251150B1 (en) * 1999-05-27 2001-06-26 Ekc Technology, Inc. Slurry composition and method of chemical mechanical polishing using same
US6722950B1 (en) 2000-11-07 2004-04-20 Planar Labs Corporation Method and apparatus for electrodialytic chemical mechanical polishing and deposition
US6905526B1 (en) 2000-11-07 2005-06-14 Planar Labs Corporation Fabrication of an ion exchange polish pad
US6773337B1 (en) 2000-11-07 2004-08-10 Planar Labs Corporation Method and apparatus to recondition an ion exchange polish pad
JP4919446B2 (ja) * 2001-08-09 2012-04-18 学校法人東京電機大学 微細溝加工方法及びその装置
JP4598328B2 (ja) * 2001-09-10 2010-12-15 新日本製鐵株式会社 不定形耐火物の混練方法
JP2003234473A (ja) * 2002-02-06 2003-08-22 Canon Inc 有機半導体素子の製造方法
WO2004036678A1 (en) * 2002-10-16 2004-04-29 Canon Kabushiki Kaisha Manufacturing process for fuel cell, and fuel cell apparatus
JP2005149796A (ja) * 2003-11-12 2005-06-09 Canon Inc 固体高分子電解質膜および固体高分子型燃料電池
JP2005255770A (ja) * 2004-03-10 2005-09-22 Shinko Electric Ind Co Ltd 機械加工用クーラント及び金属材の機械加工方法
JP2007160496A (ja) * 2005-11-15 2007-06-28 Shinshu Univ ワーク研磨装置およびワーク研磨方法
US9744645B2 (en) * 2012-09-25 2017-08-29 G.D.O. Inc. Abrasive entrainment waterjet cutting
WO2014052407A1 (en) * 2012-09-25 2014-04-03 G.D.O. Inc. Underwater abrasive entrainment waterjet cutting
US9815175B2 (en) * 2012-09-25 2017-11-14 G.D.O. Inc Abrasive entrainment waterjet cutting
KR20160141805A (ko) * 2014-04-04 2016-12-09 가부시키가이샤 후지미인코퍼레이티드 경질 재료의 연마용 조성물
JP6522377B2 (ja) 2015-03-12 2019-05-29 Ntn株式会社 研削クーラント供給装置・研削設備・研削方法
US10076821B2 (en) * 2016-08-15 2018-09-18 G.D.O. Inc Abrasive entrainment waterjet cutting
US10077966B2 (en) * 2016-08-15 2018-09-18 G.D.O. Inc. Abrasive entrainment waterjet cutting
KR102384497B1 (ko) * 2020-03-14 2022-04-07 이인상 하이드로늄이온 용존수를 이용한 나노필터 제조방법 및 이에 따라 제조된 나노필터
CN115245866A (zh) * 2022-08-16 2022-10-28 西安建筑科技大学 一种电解改性水强化生石膏超细磨效果的方法

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SU1712393A1 (ru) * 1989-10-26 1992-02-15 Институт сверхтвердых материалов АН УССР Смазочно-охлаждающа жидкость дл механической обработки металлов
JP2903166B2 (ja) * 1990-02-14 1999-06-07 清水建設株式会社 健康飲用水の製造方法及びその製造装置
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EP0605882B1 (de) * 1993-01-08 1996-12-11 Nec Corporation Verfahren und Vorrichtung zur Nassbehandlung von festen Oberflächen
CN1100982A (zh) * 1993-06-24 1995-04-05 株式会社今桥制作所 桶式磁精整机
JP2914166B2 (ja) * 1994-03-16 1999-06-28 日本電気株式会社 研磨布の表面処理方法および研磨装置
US5599438A (en) * 1994-03-25 1997-02-04 Nec Corporation Method for producing electrolyzed water
JP2830733B2 (ja) * 1994-03-25 1998-12-02 日本電気株式会社 電解水生成方法および電解水生成機構
JP3311203B2 (ja) * 1995-06-13 2002-08-05 株式会社東芝 半導体装置の製造方法及び半導体製造装置、半導体ウェーハの化学的機械的ポリッシング方法

Also Published As

Publication number Publication date
ATE188233T1 (de) 2000-01-15
DE69422344D1 (de) 2000-02-03
JPH0741754A (ja) 1995-02-10
EP0637619B1 (de) 1999-12-29
TW337535B (en) 1998-08-01
US5735729A (en) 1998-04-07
EP0637619A1 (de) 1995-02-08
JP3098661B2 (ja) 2000-10-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee