TW337535B - An abrasive composition with an electrolytic water - Google Patents

An abrasive composition with an electrolytic water

Info

Publication number
TW337535B
TW337535B TW083106909A TW83106909A TW337535B TW 337535 B TW337535 B TW 337535B TW 083106909 A TW083106909 A TW 083106909A TW 83106909 A TW83106909 A TW 83106909A TW 337535 B TW337535 B TW 337535B
Authority
TW
Taiwan
Prior art keywords
electrolytic water
abrasive composition
media
dispersed
abrasive
Prior art date
Application number
TW083106909A
Other languages
English (en)
Inventor
Masatsune Kobayashi
Yasuji Takemasa
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Application granted granted Critical
Publication of TW337535B publication Critical patent/TW337535B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C11/00—Selection of abrasive materials or additives for abrasive blasts
    • B24C11/005—Selection of abrasive materials or additives for abrasive blasts of additives, e.g. anti-corrosive or disinfecting agents in solid, liquid or gaseous form
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW083106909A 1993-07-28 1994-07-28 An abrasive composition with an electrolytic water TW337535B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20447893A JP3098661B2 (ja) 1993-07-28 1993-07-28 研磨剤組成物及びそれを用いる研磨方法

Publications (1)

Publication Number Publication Date
TW337535B true TW337535B (en) 1998-08-01

Family

ID=16491194

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083106909A TW337535B (en) 1993-07-28 1994-07-28 An abrasive composition with an electrolytic water

Country Status (6)

Country Link
US (1) US5735729A (zh)
EP (1) EP0637619B1 (zh)
JP (1) JP3098661B2 (zh)
AT (1) ATE188233T1 (zh)
DE (1) DE69422344T2 (zh)
TW (1) TW337535B (zh)

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JPH09186116A (ja) * 1995-12-27 1997-07-15 Toshiba Corp 半導体装置の製造方法及び半導体製造装置
US5962343A (en) * 1996-07-30 1999-10-05 Nissan Chemical Industries, Ltd. Process for producing crystalline ceric oxide particles and abrasive
US6099798A (en) 1997-10-31 2000-08-08 Nanogram Corp. Ultraviolet light block and photocatalytic materials
US6290735B1 (en) 1997-10-31 2001-09-18 Nanogram Corporation Abrasive particles for surface polishing
JP4113282B2 (ja) * 1998-05-07 2008-07-09 スピードファム株式会社 研磨組成物及びそれを用いたエッジポリッシング方法
FR2781922B1 (fr) * 1998-07-31 2001-11-23 Clariant France Sa Procede de polissage mecano-chimique d'une couche en un materiau a base de cuivre
JP3693847B2 (ja) * 1999-03-26 2005-09-14 Ｎｅｃエレクトロニクス株式会社 研磨後ウェハの保管方法および装置
US6251150B1 (en) * 1999-05-27 2001-06-26 Ekc Technology, Inc. Slurry composition and method of chemical mechanical polishing using same
US6905526B1 (en) 2000-11-07 2005-06-14 Planar Labs Corporation Fabrication of an ion exchange polish pad
US6722950B1 (en) 2000-11-07 2004-04-20 Planar Labs Corporation Method and apparatus for electrodialytic chemical mechanical polishing and deposition
US6773337B1 (en) 2000-11-07 2004-08-10 Planar Labs Corporation Method and apparatus to recondition an ion exchange polish pad
JP4919446B2 (ja) * 2001-08-09 2012-04-18 学校法人東京電機大学 微細溝加工方法及びその装置
JP4598328B2 (ja) * 2001-09-10 2010-12-15 新日本製鐵株式会社 不定形耐火物の混練方法
JP2003234473A (ja) * 2002-02-06 2003-08-22 Canon Inc 有機半導体素子の製造方法
AU2003274733A1 (en) * 2002-10-16 2004-05-04 Canon Kabushiki Kaisha Manufacturing process for fuel cell, and fuel cell apparatus
JP2005149796A (ja) * 2003-11-12 2005-06-09 Canon Inc 固体高分子電解質膜および固体高分子型燃料電池
JP2005255770A (ja) * 2004-03-10 2005-09-22 Shinko Electric Ind Co Ltd 機械加工用クーラント及び金属材の機械加工方法
JP2007160496A (ja) 2005-11-15 2007-06-28 Shinshu Univ ワーク研磨装置およびワーク研磨方法
US9744645B2 (en) * 2012-09-25 2017-08-29 G.D.O. Inc. Abrasive entrainment waterjet cutting
US9815175B2 (en) * 2012-09-25 2017-11-14 G.D.O. Inc Abrasive entrainment waterjet cutting
US20140087637A1 (en) * 2012-09-25 2014-03-27 Paul L. Miller Abrasive Waterjet Cutting System For Subsea Operations
US20170022392A1 (en) * 2014-04-04 2017-01-26 Fujimi Incorporated Polishing composition for hard materials
JP6522377B2 (ja) * 2015-03-12 2019-05-29 Ntn株式会社 研削クーラント供給装置・研削設備・研削方法
US10077966B2 (en) * 2016-08-15 2018-09-18 G.D.O. Inc. Abrasive entrainment waterjet cutting
US10076821B2 (en) * 2016-08-15 2018-09-18 G.D.O. Inc Abrasive entrainment waterjet cutting
KR102384497B1 (ko) * 2020-03-14 2022-04-07 이인상 하이드로늄이온 용존수를 이용한 나노필터 제조방법 및 이에 따라 제조된 나노필터
CN115245866A (zh) * 2022-08-16 2022-10-28 西安建筑科技大学 一种电解改性水强化生石膏超细磨效果的方法

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JP2909645B2 (ja) * 1990-05-28 1999-06-23 コニカ株式会社 ハロゲン化銀カラー写真感光材料
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DE69306542T2 (de) * 1993-01-08 1997-05-15 Nippon Electric Co Verfahren und Vorrichtung zur Nassbehandlung von festen Oberflächen
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Also Published As

Publication number Publication date
JPH0741754A (ja) 1995-02-10
DE69422344T2 (de) 2000-05-18
JP3098661B2 (ja) 2000-10-16
ATE188233T1 (de) 2000-01-15
EP0637619A1 (en) 1995-02-08
DE69422344D1 (de) 2000-02-03
EP0637619B1 (en) 1999-12-29
US5735729A (en) 1998-04-07

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