DE69401826D1 - Dünnschichtkondensator und Verfahren zu seiner Herstellung - Google Patents
Dünnschichtkondensator und Verfahren zu seiner HerstellungInfo
- Publication number
- DE69401826D1 DE69401826D1 DE69401826T DE69401826T DE69401826D1 DE 69401826 D1 DE69401826 D1 DE 69401826D1 DE 69401826 T DE69401826 T DE 69401826T DE 69401826 T DE69401826 T DE 69401826T DE 69401826 D1 DE69401826 D1 DE 69401826D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- thin film
- film capacitor
- capacitor
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/306—Stacked capacitors made by thin film techniques
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6631693 | 1993-03-25 | ||
JP25268393A JPH07106198A (ja) | 1993-10-08 | 1993-10-08 | 積層薄膜コンデンサの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69401826D1 true DE69401826D1 (de) | 1997-04-10 |
DE69401826T2 DE69401826T2 (de) | 1997-06-12 |
Family
ID=26407515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69401826T Expired - Lifetime DE69401826T2 (de) | 1993-03-25 | 1994-03-19 | Dünnschichtkondensator und Verfahren zu seiner Herstellung |
Country Status (3)
Country | Link |
---|---|
US (2) | US5459635A (de) |
EP (1) | EP0617440B1 (de) |
DE (1) | DE69401826T2 (de) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5600533A (en) * | 1994-06-23 | 1997-02-04 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor having an anti-reducing agent |
JP3470830B2 (ja) * | 1994-09-26 | 2003-11-25 | 株式会社村田製作所 | 積層コンデンサの製造方法 |
US5879812A (en) * | 1995-06-06 | 1999-03-09 | Murata Manufacturing Co., Ltd. | Monolithic ceramic capacitor and method of producing the same |
AUPN363595A0 (en) * | 1995-06-19 | 1995-07-13 | Intag International Limited | Fabrication of capacitors |
JP3094868B2 (ja) * | 1995-09-07 | 2000-10-03 | 三菱マテリアル株式会社 | 高純度誘電体薄膜の作製方法 |
JPH09298289A (ja) * | 1996-04-30 | 1997-11-18 | Fujitsu Ltd | 酸化物誘電体積層構造の製造方法及び電子回路装置 |
UA41477C2 (uk) * | 1996-05-21 | 2001-09-17 | Сіменс Акцієнгезельшафт | Багатошаровий конденсатор тонкошарової конструкції і спосіб його виготовлення |
US5912044A (en) * | 1997-01-10 | 1999-06-15 | International Business Machines Corporation | Method for forming thin film capacitors |
DE19737323A1 (de) * | 1997-08-28 | 1999-03-11 | Philips Patentverwaltung | Dünnschichtkondensator mit Schichtelektrode |
JP3092659B2 (ja) * | 1997-12-10 | 2000-09-25 | 日本電気株式会社 | 薄膜キャパシタ及びその製造方法 |
JP3349092B2 (ja) * | 1998-06-15 | 2002-11-20 | 松下電器産業株式会社 | コンデンサの製造方法 |
US6943392B2 (en) * | 1999-08-30 | 2005-09-13 | Micron Technology, Inc. | Capacitors having a capacitor dielectric layer comprising a metal oxide having multiple different metals bonded with oxygen |
US6444478B1 (en) | 1999-08-31 | 2002-09-03 | Micron Technology, Inc. | Dielectric films and methods of forming same |
US6368514B1 (en) | 1999-09-01 | 2002-04-09 | Luminous Intent, Inc. | Method and apparatus for batch processed capacitors using masking techniques |
US6335049B1 (en) * | 2000-01-03 | 2002-01-01 | Micron Technology, Inc. | Chemical vapor deposition methods of forming a high K dielectric layer and methods of forming a capacitor |
US6558517B2 (en) * | 2000-05-26 | 2003-05-06 | Micron Technology, Inc. | Physical vapor deposition methods |
US6566147B2 (en) | 2001-02-02 | 2003-05-20 | Micron Technology, Inc. | Method for controlling deposition of dielectric films |
US6838122B2 (en) * | 2001-07-13 | 2005-01-04 | Micron Technology, Inc. | Chemical vapor deposition methods of forming barium strontium titanate comprising dielectric layers |
US20030017266A1 (en) * | 2001-07-13 | 2003-01-23 | Cem Basceri | Chemical vapor deposition methods of forming barium strontium titanate comprising dielectric layers, including such layers having a varied concentration of barium and strontium within the layer |
US7011978B2 (en) | 2001-08-17 | 2006-03-14 | Micron Technology, Inc. | Methods of forming capacitor constructions comprising perovskite-type dielectric materials with different amount of crystallinity regions |
TW200302296A (en) * | 2001-11-12 | 2003-08-01 | Toho Titanium Co Ltd | Composite titanium oxide film and method for formation thereof and titanium electrolytic capacitor |
KR100480500B1 (ko) * | 2002-04-25 | 2005-04-06 | 학교법인 포항공과대학교 | 절연막의 저온 증착법 |
WO2004073971A1 (en) * | 2003-02-20 | 2004-09-02 | N.V. Bekaert S.A. | A method of manufacturing a laminated structure |
US6716692B1 (en) * | 2003-05-20 | 2004-04-06 | Via Technologies, Inc. | Fabrication process and structure of laminated capacitor |
US20060157792A1 (en) * | 2005-01-19 | 2006-07-20 | Kyocera Corporation | Laminated thin film capacitor and semiconductor apparatus |
KR101274953B1 (ko) * | 2008-02-05 | 2013-06-13 | 가부시키가이샤 무라타 세이사쿠쇼 | 유전체 세라믹 및 적층 세라믹 콘덴서 |
KR101133327B1 (ko) * | 2010-04-09 | 2012-04-05 | 삼성전기주식회사 | 적층 세라믹 커패시터의 제조방법 |
KR20140020473A (ko) * | 2012-08-08 | 2014-02-19 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 이의 제조방법 |
KR101537717B1 (ko) * | 2013-09-17 | 2015-07-20 | 신유선 | 임베디드용 적층 세라믹 캐패시터 및 임베디드용 적층 세라믹 캐패시터의 제조 방법 |
US10109424B2 (en) * | 2014-04-22 | 2018-10-23 | Industry-Academic Cooperation Foundation Yonsei University | Multilayer ceramic capacitor using poling process for reduction of vibration |
US10847859B2 (en) * | 2017-02-23 | 2020-11-24 | Intel Corporation | Single wire communication arrangement |
US10608311B2 (en) | 2017-02-23 | 2020-03-31 | Intel Corporation | Cable assembly comprising a single wire coupled to a signal launcher and housed in a first cover portion and in a second ferrite cover portion |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3686591A (en) * | 1970-07-24 | 1972-08-22 | Us Army | Anisotropic crystal circuit |
US3740624A (en) * | 1972-06-21 | 1973-06-19 | Sprague Electric Co | Monolithic capacitor having corner internal electrode terminations |
US4017885A (en) * | 1973-10-25 | 1977-04-12 | Texas Instruments Incorporated | Large value capacitor |
US4297773A (en) * | 1978-11-16 | 1981-11-03 | Avx Corporation | Method of manufacturing a monolithic ceramic capacitor |
US4531268A (en) * | 1981-02-27 | 1985-07-30 | Illinois Tool Works Inc. | Method of making capacitive structures |
DE3472420D1 (en) * | 1983-11-29 | 1988-08-04 | Sony Corp | Methods of manufacturing dielectric metal titanates |
US4661884A (en) * | 1986-03-10 | 1987-04-28 | American Technical Ceramics Corp. | Miniature, multiple layer, side mounting high frequency blocking capacitor |
US5350606A (en) * | 1989-03-30 | 1994-09-27 | Kanegafuchi Chemical Industry Co., Ltd. | Single crystal ferroelectric barium titanate films |
JPH0334506A (ja) * | 1989-06-30 | 1991-02-14 | Matsushita Electric Ind Co Ltd | コンデンサ |
JPH03200308A (ja) * | 1989-12-27 | 1991-09-02 | Taiyo Yuden Co Ltd | 積層薄膜誘電体素子およびその製法 |
JPH03284813A (ja) * | 1990-03-14 | 1991-12-16 | Fujikin Sofuto Kk | コンデンサ |
KR920006856B1 (ko) * | 1990-04-07 | 1992-08-20 | 한국과학기술연구원 | 주입전극법에 의한 다층세라믹 축전기의 제조방법 |
US5204314A (en) * | 1990-07-06 | 1993-04-20 | Advanced Technology Materials, Inc. | Method for delivering an involatile reagent in vapor form to a CVD reactor |
JPH0789451B2 (ja) * | 1990-11-30 | 1995-09-27 | 日本電気株式会社 | 誘電体の成膜方法 |
JPH04240197A (ja) * | 1991-01-23 | 1992-08-27 | Asahi Chem Ind Co Ltd | 誘電体薄膜 |
DE69326944T2 (de) * | 1992-04-13 | 2000-03-30 | Virginia Tech Intell Prop | Stapelelektroden für ferroelektrische vorrichtungen |
US5326721A (en) * | 1992-05-01 | 1994-07-05 | Texas Instruments Incorporated | Method of fabricating high-dielectric constant oxides on semiconductors using a GE buffer layer |
JP3102139B2 (ja) * | 1992-05-28 | 2000-10-23 | 株式会社村田製作所 | 積層型電子部品の製造方法 |
US5443688A (en) * | 1993-12-02 | 1995-08-22 | Raytheon Company | Method of manufacturing a ferroelectric device using a plasma etching process |
-
1994
- 1994-03-19 EP EP94104369A patent/EP0617440B1/de not_active Expired - Lifetime
- 1994-03-19 DE DE69401826T patent/DE69401826T2/de not_active Expired - Lifetime
- 1994-03-22 US US08/215,816 patent/US5459635A/en not_active Expired - Lifetime
-
1995
- 1995-06-05 US US08/465,350 patent/US5663089A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0617440A3 (de) | 1995-03-22 |
DE69401826T2 (de) | 1997-06-12 |
US5459635A (en) | 1995-10-17 |
US5663089A (en) | 1997-09-02 |
EP0617440B1 (de) | 1997-03-05 |
EP0617440A2 (de) | 1994-09-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: PANASONIC CORP., KADOMA, OSAKA, JP |