DE69329239D1 - Gleichspannungsversorgung für plasmareaktor - Google Patents

Gleichspannungsversorgung für plasmareaktor

Info

Publication number
DE69329239D1
DE69329239D1 DE69329239T DE69329239T DE69329239D1 DE 69329239 D1 DE69329239 D1 DE 69329239D1 DE 69329239 T DE69329239 T DE 69329239T DE 69329239 T DE69329239 T DE 69329239T DE 69329239 D1 DE69329239 D1 DE 69329239D1
Authority
DE
Germany
Prior art keywords
voltage supply
plasma reactor
reactor
plasma
voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69329239T
Other languages
English (en)
Other versions
DE69329239T2 (de
Inventor
Geoffrey N Drummond
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Energy Industries Inc
Original Assignee
Advanced Energy Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Energy Industries Inc filed Critical Advanced Energy Industries Inc
Application granted granted Critical
Publication of DE69329239D1 publication Critical patent/DE69329239D1/de
Publication of DE69329239T2 publication Critical patent/DE69329239T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/004Charge control of objects or beams
    • H01J2237/0041Neutralising arrangements
    • H01J2237/0044Neutralising arrangements of objects being observed or treated
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02Details
    • H01J2237/0203Protection arrangements
    • H01J2237/0206Extinguishing, preventing or controlling unwanted discharges

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
DE69329239T 1992-12-30 1993-12-28 Gleichspannungsversorgung für plasmareaktor Expired - Lifetime DE69329239T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/998,513 US5427669A (en) 1992-12-30 1992-12-30 Thin film DC plasma processing system
PCT/US1993/012604 WO1994016458A1 (en) 1992-12-30 1993-12-28 Enhanced thin film dc plasma processing system

Publications (2)

Publication Number Publication Date
DE69329239D1 true DE69329239D1 (de) 2000-09-21
DE69329239T2 DE69329239T2 (de) 2001-01-25

Family

ID=25545314

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69329239T Expired - Lifetime DE69329239T2 (de) 1992-12-30 1993-12-28 Gleichspannungsversorgung für plasmareaktor
DE1001448T Pending DE1001448T1 (de) 1992-12-30 1993-12-28 Dünnfilm-Plasmabehandlungsvorrichtung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE1001448T Pending DE1001448T1 (de) 1992-12-30 1993-12-28 Dünnfilm-Plasmabehandlungsvorrichtung

Country Status (5)

Country Link
US (1) US5427669A (de)
EP (2) EP1001448A3 (de)
JP (2) JP3485924B2 (de)
DE (2) DE69329239T2 (de)
WO (1) WO1994016458A1 (de)

Families Citing this family (111)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH689767A5 (de) * 1992-03-24 1999-10-15 Balzers Hochvakuum Verfahren zur Werkstueckbehandlung in einer Vakuumatmosphaere und Vakuumbehandlungsanlage.
US6217717B1 (en) 1992-12-30 2001-04-17 Advanced Energy Industries, Inc. Periodically clearing thin film plasma processing system
US5718813A (en) * 1992-12-30 1998-02-17 Advanced Energy Industries, Inc. Enhanced reactive DC sputtering system
US5698082A (en) * 1993-08-04 1997-12-16 Balzers Und Leybold Method and apparatus for coating substrates in a vacuum chamber, with a system for the detection and suppression of undesirable arcing
US5651865A (en) * 1994-06-17 1997-07-29 Eni Preferential sputtering of insulators from conductive targets
US5535906A (en) * 1995-01-30 1996-07-16 Advanced Energy Industries, Inc. Multi-phase DC plasma processing system
US5584972A (en) * 1995-02-01 1996-12-17 Sony Corporation Plasma noise and arcing suppressor apparatus and method for sputter deposition
WO1996031899A1 (en) * 1995-04-07 1996-10-10 Advanced Energy Industries, Inc. Adjustable energy quantum thin film plasma processing system
US5616224A (en) * 1995-05-09 1997-04-01 Deposition Sciences, Inc. Apparatus for reducing the intensity and frequency of arcs which occur during a sputtering process
US5584974A (en) * 1995-10-20 1996-12-17 Eni Arc control and switching element protection for pulsed dc cathode sputtering power supply
US5830336A (en) * 1995-12-05 1998-11-03 Minnesota Mining And Manufacturing Company Sputtering of lithium
JP3689524B2 (ja) * 1996-03-22 2005-08-31 キヤノン株式会社 酸化アルミニウム膜及びその形成方法
US5882492A (en) * 1996-06-21 1999-03-16 Sierra Applied Sciences, Inc. A.C. plasma processing system
US5682067A (en) * 1996-06-21 1997-10-28 Sierra Applied Sciences, Inc. Circuit for reversing polarity on electrodes
WO1998013532A1 (en) * 1996-09-24 1998-04-02 Deposition Sciences, Inc. A multiple target arrangement for decreasing the intensity and severity of arcing in dc sputtering
DE19702187C2 (de) * 1997-01-23 2002-06-27 Fraunhofer Ges Forschung Verfahren und Einrichtung zum Betreiben von Magnetronentladungen
ATE468420T1 (de) * 1997-02-20 2010-06-15 Shibaura Mechatronics Corp Stromversorgungseinheit für sputtervorrichtung
US5993615A (en) * 1997-06-19 1999-11-30 International Business Machines Corporation Method and apparatus for detecting arcs
US5993613A (en) * 1997-11-07 1999-11-30 Sierra Applied Sciences, Inc. Method and apparatus for periodic polarity reversal during an active state
US5990668A (en) * 1997-11-07 1999-11-23 Sierra Applied Sciences, Inc. A.C. power supply having combined regulator and pulsing circuits
US6011704A (en) * 1997-11-07 2000-01-04 Sierra Applied Sciences, Inc. Auto-ranging power supply
US5889391A (en) * 1997-11-07 1999-03-30 Sierra Applied Sciences, Inc. Power supply having combined regulator and pulsing circuits
US5910886A (en) * 1997-11-07 1999-06-08 Sierra Applied Sciences, Inc. Phase-shift power supply
US6483678B1 (en) * 1998-03-18 2002-11-19 Shindengen Electric Manufacturing Co., Ltd. Arc-extinguishing circuit and arc-extinguishing method
US6162332A (en) * 1998-05-07 2000-12-19 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for preventing arcing in sputter chamber
US6579805B1 (en) * 1999-01-05 2003-06-17 Ronal Systems Corp. In situ chemical generator and method
US6451389B1 (en) 1999-04-17 2002-09-17 Advanced Energy Industries, Inc. Method for deposition of diamond like carbon
WO2001040540A1 (en) * 1999-12-02 2001-06-07 Tegal Corporation Improved reactor with heated and textured electrodes and surfaces
WO2001053564A1 (en) * 2000-01-21 2001-07-26 Advanced Energy Industries, Inc. Method and apparatus for neutralization of ion beam using ac or dc ion source
US20030209198A1 (en) * 2001-01-18 2003-11-13 Andrew Shabalin Method and apparatus for neutralization of ion beam using ac or dc ion source
US7469558B2 (en) * 2001-07-10 2008-12-30 Springworks, Llc As-deposited planar optical waveguides with low scattering loss and methods for their manufacture
US7196183B2 (en) * 2001-08-31 2007-03-27 Innogenetics N.V. Hepatitis C virus genotype, and its use as prophylactic, therapeutic and diagnostic agent
US7404877B2 (en) * 2001-11-09 2008-07-29 Springworks, Llc Low temperature zirconia based thermal barrier layer by PVD
US6884327B2 (en) 2002-03-16 2005-04-26 Tao Pan Mode size converter for a planar waveguide
US7378356B2 (en) 2002-03-16 2008-05-27 Springworks, Llc Biased pulse DC reactive sputtering of oxide films
US20030175142A1 (en) * 2002-03-16 2003-09-18 Vassiliki Milonopoulou Rare-earth pre-alloyed PVD targets for dielectric planar applications
US20040011290A1 (en) * 2002-06-10 2004-01-22 Takaharu Kondo Apparatus and process for forming deposited film
US20070264564A1 (en) 2006-03-16 2007-11-15 Infinite Power Solutions, Inc. Thin film battery on an integrated circuit or circuit board and method thereof
US8431264B2 (en) 2002-08-09 2013-04-30 Infinite Power Solutions, Inc. Hybrid thin-film battery
US8445130B2 (en) 2002-08-09 2013-05-21 Infinite Power Solutions, Inc. Hybrid thin-film battery
US8394522B2 (en) 2002-08-09 2013-03-12 Infinite Power Solutions, Inc. Robust metal film encapsulation
US8236443B2 (en) 2002-08-09 2012-08-07 Infinite Power Solutions, Inc. Metal film encapsulation
US8404376B2 (en) 2002-08-09 2013-03-26 Infinite Power Solutions, Inc. Metal film encapsulation
US9793523B2 (en) 2002-08-09 2017-10-17 Sapurast Research Llc Electrochemical apparatus with barrier layer protected substrate
US8021778B2 (en) 2002-08-09 2011-09-20 Infinite Power Solutions, Inc. Electrochemical apparatus with barrier layer protected substrate
AU2003261463A1 (en) 2002-08-27 2004-03-19 Symmorphix, Inc. Optically coupling into highly uniform waveguides
US7147759B2 (en) * 2002-09-30 2006-12-12 Zond, Inc. High-power pulsed magnetron sputtering
US6896773B2 (en) * 2002-11-14 2005-05-24 Zond, Inc. High deposition rate sputtering
US20040112735A1 (en) * 2002-12-17 2004-06-17 Applied Materials, Inc. Pulsed magnetron for sputter deposition
US7205662B2 (en) 2003-02-27 2007-04-17 Symmorphix, Inc. Dielectric barrier layer films
US7375035B2 (en) 2003-04-29 2008-05-20 Ronal Systems Corporation Host and ancillary tool interface methodology for distributed processing
US8728285B2 (en) 2003-05-23 2014-05-20 Demaray, Llc Transparent conductive oxides
US7238628B2 (en) * 2003-05-23 2007-07-03 Symmorphix, Inc. Energy conversion and storage films and devices by physical vapor deposition of titanium and titanium oxides and sub-oxides
US7429714B2 (en) * 2003-06-20 2008-09-30 Ronal Systems Corporation Modular ICP torch assembly
WO2005015964A1 (ja) 2003-08-07 2005-02-17 Hitachi Kokusai Electric Inc. 基板処理装置及び基板処理方法
US9771648B2 (en) * 2004-08-13 2017-09-26 Zond, Inc. Method of ionized physical vapor deposition sputter coating high aspect-ratio structures
US20050103620A1 (en) * 2003-11-19 2005-05-19 Zond, Inc. Plasma source with segmented magnetron cathode
US7095179B2 (en) * 2004-02-22 2006-08-22 Zond, Inc. Methods and apparatus for generating strongly-ionized plasmas with ionizational instabilities
US9123508B2 (en) * 2004-02-22 2015-09-01 Zond, Llc Apparatus and method for sputtering hard coatings
US20060066248A1 (en) * 2004-09-24 2006-03-30 Zond, Inc. Apparatus for generating high current electrical discharges
US7081598B2 (en) * 2004-08-24 2006-07-25 Advanced Energy Industries, Inc. DC-DC converter with over-voltage protection circuit
ATE447777T1 (de) 2004-12-08 2009-11-15 Symmorphix Inc Abscheidung von licoo2
US7959769B2 (en) 2004-12-08 2011-06-14 Infinite Power Solutions, Inc. Deposition of LiCoO2
EP1675155B1 (de) * 2004-12-24 2012-01-25 HÜTTINGER Elektronik GmbH + Co. KG Plasmaanregungssystem
US7372610B2 (en) 2005-02-23 2008-05-13 Sage Electrochromics, Inc. Electrochromic devices and methods
EP1710324B1 (de) 2005-04-08 2008-12-03 STMicroelectronics S.r.l. Gepulste PVD-Verfahren und -kammer für die Abscheidung von Chalkogenidschichten
US7305311B2 (en) * 2005-04-22 2007-12-04 Advanced Energy Industries, Inc. Arc detection and handling in radio frequency power applications
US7838133B2 (en) * 2005-09-02 2010-11-23 Springworks, Llc Deposition of perovskite and other compound ceramic films for dielectric applications
US7250195B1 (en) 2006-02-27 2007-07-31 Ionic Fusion Corporation Molecular plasma deposition of colloidal materials
US20080138374A1 (en) * 2006-02-27 2008-06-12 Storey Daniel M Molecular Plasma Deposition of Bioactive Small Molecules
US7514935B2 (en) * 2006-09-13 2009-04-07 Advanced Energy Industries, Inc. System and method for managing power supplied to a plasma chamber
CN101523571A (zh) 2006-09-29 2009-09-02 无穷动力解决方案股份有限公司 柔性基板上沉积的电池层的掩模和材料限制
JP4755567B2 (ja) * 2006-10-26 2011-08-24 学校法人同志社 プラズマ誘起電解による微粒子の製造方法およびその装置
US8197781B2 (en) 2006-11-07 2012-06-12 Infinite Power Solutions, Inc. Sputtering target of Li3PO4 and method for producing same
US8217299B2 (en) * 2007-02-22 2012-07-10 Advanced Energy Industries, Inc. Arc recovery without over-voltage for plasma chamber power supplies using a shunt switch
EP1995818A1 (de) * 2007-05-12 2008-11-26 Huettinger Electronic Sp. z o. o Schaltung und Verfahren zur Reduzierung der in einer Zuleitungsinduktivität gespeicherten elektrischen Energie zur schnellen Plasmalichtbogenlöschung
WO2009040406A2 (de) * 2007-09-25 2009-04-02 Von Ardenne Anlagentechnik Gmbh Verfahren und anordnung zum redundanten anoden-sputtern mit einer dual-anoden-anordnung
US9039871B2 (en) 2007-11-16 2015-05-26 Advanced Energy Industries, Inc. Methods and apparatus for applying periodic voltage using direct current
US8133359B2 (en) 2007-11-16 2012-03-13 Advanced Energy Industries, Inc. Methods and apparatus for sputtering deposition using direct current
US9334557B2 (en) 2007-12-21 2016-05-10 Sapurast Research Llc Method for sputter targets for electrolyte films
US8268488B2 (en) 2007-12-21 2012-09-18 Infinite Power Solutions, Inc. Thin film electrolyte for thin film batteries
WO2009089417A1 (en) 2008-01-11 2009-07-16 Infinite Power Solutions, Inc. Thin film encapsulation for thin film batteries and other devices
CN101983469B (zh) 2008-04-02 2014-06-04 无穷动力解决方案股份有限公司 与能量采集关联的储能装置的无源过电压/欠电压控制和保护
US9782949B2 (en) 2008-05-30 2017-10-10 Corning Incorporated Glass laminated articles and layered articles
US8044594B2 (en) * 2008-07-31 2011-10-25 Advanced Energy Industries, Inc. Power supply ignition system and method
JP2012500610A (ja) 2008-08-11 2012-01-05 インフィニット パワー ソリューションズ, インコーポレイテッド 電磁エネルギー獲得ための統合コレクタ表面を有するエネルギーデバイスおよびその方法
WO2010030743A1 (en) 2008-09-12 2010-03-18 Infinite Power Solutions, Inc. Energy device with integral conductive surface for data communication via electromagnetic energy and method thereof
WO2010042594A1 (en) 2008-10-08 2010-04-15 Infinite Power Solutions, Inc. Environmentally-powered wireless sensor module
US8395078B2 (en) 2008-12-05 2013-03-12 Advanced Energy Industries, Inc Arc recovery with over-voltage protection for plasma-chamber power supplies
EP2790205B1 (de) * 2009-02-17 2018-04-04 Solvix GmbH Stromversorgungsvorrichtung zur Plasmabearbeitung
KR20120014571A (ko) 2009-04-27 2012-02-17 오씨 외를리콘 발처스 악티엔게젤샤프트 복수의 스퍼터 소스를 구비한 반응성 스퍼터링
DE102009002684B4 (de) * 2009-04-28 2013-12-24 TRUMPF Hüttinger GmbH + Co. KG Verfahren zur Leistungsversorgung einer Plasmalast und Plasmaversorgungseinrichtung zu seiner Durchführung
US11615941B2 (en) 2009-05-01 2023-03-28 Advanced Energy Industries, Inc. System, method, and apparatus for controlling ion energy distribution in plasma processing systems
US9767988B2 (en) * 2010-08-29 2017-09-19 Advanced Energy Industries, Inc. Method of controlling the switched mode ion energy distribution system
US11978611B2 (en) * 2009-05-01 2024-05-07 Advanced Energy Industries, Inc. Apparatus with switches to produce a waveform
US9287092B2 (en) * 2009-05-01 2016-03-15 Advanced Energy Industries, Inc. Method and apparatus for controlling ion energy distribution
CN102576828B (zh) 2009-09-01 2016-04-20 萨普拉斯特研究有限责任公司 具有集成薄膜电池的印刷电路板
EP2577777B1 (de) 2010-06-07 2016-12-28 Sapurast Research LLC Wiederaufladbare elektrochemische vorrichtung von hoher dichte
US8552665B2 (en) 2010-08-20 2013-10-08 Advanced Energy Industries, Inc. Proactive arc management of a plasma load
EP2463890A1 (de) 2010-12-08 2012-06-13 Applied Materials, Inc. Erzeugung von Plasmen in gepulsten Stromversorgungssystemen
US11049702B2 (en) 2015-04-27 2021-06-29 Advanced Energy Industries, Inc. Rate enhanced pulsed DC sputtering system
US9812305B2 (en) 2015-04-27 2017-11-07 Advanced Energy Industries, Inc. Rate enhanced pulsed DC sputtering system
CN109256759B (zh) 2017-07-14 2021-04-16 台达电子工业股份有限公司 电弧抑制装置与电弧抑制方法
TWI726258B (zh) 2017-11-17 2021-05-01 新加坡商Aes全球公司 用於電漿處理之方法和系統以及相關的非暫時性電腦可讀取媒體
WO2019099937A1 (en) 2017-11-17 2019-05-23 Advanced Energy Industries, Inc. Improved application of modulating supplies in a plasma processing system
TWI744566B (zh) 2017-11-17 2021-11-01 新加坡商Aes全球公司 用於在空間域和時間域上控制基板上的電漿處理之系統和方法,及相關的電腦可讀取媒體
KR20220031713A (ko) 2019-07-12 2022-03-11 에이이에스 글로벌 홀딩스 피티이 리미티드 단일 제어식 스위치를 갖는 바이어스 공급부
US11942309B2 (en) 2022-01-26 2024-03-26 Advanced Energy Industries, Inc. Bias supply with resonant switching
US12046448B2 (en) 2022-01-26 2024-07-23 Advanced Energy Industries, Inc. Active switch on time control for bias supply
US11670487B1 (en) 2022-01-26 2023-06-06 Advanced Energy Industries, Inc. Bias supply control and data processing
US11978613B2 (en) 2022-09-01 2024-05-07 Advanced Energy Industries, Inc. Transition control in a bias supply

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE221202C (de) *
DE229160C (de) *
US4103324A (en) * 1976-12-22 1978-07-25 Airco, Inc. Saturable reactor-type power supply
BG29362A1 (en) * 1979-03-11 1980-11-14 Minchev Apparatus for chemical- thermal processing of matal articles in the condition of electrical smouldering charge
JPS5769324A (en) * 1980-10-11 1982-04-28 Daiwa Dengiyou Kk Monitor device of dc power supply
DE3121389A1 (de) * 1980-12-03 1982-08-19 Kombinat Veb Keramische Werke Hermsdorf, Ddr 6530 Hermsdorf Verfahren zum vorsputtern von targets in plasmatron-zerstaeubungsanlagen
JPS6130665A (ja) * 1984-07-20 1986-02-12 Anelva Corp スパツタ装置
US4610775A (en) 1985-07-26 1986-09-09 Westinghouse Electric Corp. Method and apparatus for clearing short-circuited, high-voltage cathodes in a sputtering chamber
JPS63190168A (ja) * 1987-01-30 1988-08-05 Sumitomo Electric Ind Ltd 薄膜製造装置の電源装置
DE3821207A1 (de) * 1988-06-23 1989-12-28 Leybold Ag Anordnung zum beschichten eines substrats mit dielektrika
US4936960A (en) * 1989-01-03 1990-06-26 Advanced Energy Industries, Inc. Method and apparatus for recovery from low impedance condition during cathodic arc processes
US5009764A (en) * 1989-01-13 1991-04-23 Advanced Energy Industries, Inc. Apparatus for removal of electrical shorts in a sputtering system
US4963238A (en) * 1989-01-13 1990-10-16 Siefkes Jerry D Method for removal of electrical shorts in a sputtering system
FR2648001B1 (fr) * 1989-05-31 1991-09-27 Breda Jean Pierre Alimentation en courant continu d'electrodes a plasma et procede pour regenerer un plasma
DE3919147C2 (de) * 1989-06-12 1998-01-15 Leybold Ag Verfahren zum Beschichten eines Kunststoffsubstrats mit Aluminium
DE3919145A1 (de) * 1989-06-12 1990-12-13 Leybold Ag Verfahren und vorrichtung zum beschichten eines substrats mit elektrisch leitenden werkstoffen
JPH0356671A (ja) * 1989-07-21 1991-03-12 Fujitsu Ltd スパッタリング装置
JPH0361368A (ja) * 1989-07-28 1991-03-18 Hitachi Nakaseiki Ltd イオンスパッタリング方法およびその装置
DE3925536A1 (de) * 1989-08-02 1991-02-07 Leybold Ag Anordnung zur dickenmessung von duennschichten
DE3926877A1 (de) * 1989-08-16 1991-02-21 Leybold Ag Verfahren zum beschichten eines dielektrischen substrats mit kupfer
DE3934092A1 (de) * 1989-10-12 1991-04-18 Leybold Ag Vorrichtung zum beschichten eines kunststoffsubstrats, vorzugsweise eines polymethylmethacrylat-substrats mit aluminium
US5241152A (en) * 1990-03-23 1993-08-31 Anderson Glen L Circuit for detecting and diverting an electrical arc in a glow discharge apparatus
DE4042288A1 (de) * 1990-12-31 1992-07-02 Leybold Ag Verfahren und vorrichtung zum reaktiven beschichten eines substrats
DE4113704A1 (de) * 1991-04-26 1992-10-29 Physikalisch Tech I Schaltungsanordnung zur vermeidung der einfluesse von bogenentladungen bei reaktiven dc-hochratezerstaeuben
DE4127504A1 (de) * 1991-08-20 1993-02-25 Leybold Ag Einrichtung zur unterdrueckung von lichtboegen
DE4202425C2 (de) * 1992-01-29 1997-07-17 Leybold Ag Verfahren und Vorrichtung zum Beschichten eines Substrats, insbesondere mit elektrisch nichtleitenden Schichten
DE4233720C2 (de) * 1992-10-07 2001-05-17 Leybold Ag Einrichtung für die Verhinderung von Überschlägen in Vakuum-Zerstäubungsanlagen

Also Published As

Publication number Publication date
JPH07503577A (ja) 1995-04-13
DE1001448T1 (de) 2000-10-05
JP3485924B2 (ja) 2004-01-13
JP2004006230A (ja) 2004-01-08
EP1001448A2 (de) 2000-05-17
US5427669A (en) 1995-06-27
EP0628212A1 (de) 1994-12-14
EP0628212B1 (de) 2000-08-16
WO1994016458A1 (en) 1994-07-21
EP1001448A3 (de) 2008-01-09
JP3671177B2 (ja) 2005-07-13
DE69329239T2 (de) 2001-01-25

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