DE69324003D1 - Bipolar-Leistungstransistor mit hoher Kollektor-Durchbrucksspannung und Verfahren zu seiner Herstellung - Google Patents
Bipolar-Leistungstransistor mit hoher Kollektor-Durchbrucksspannung und Verfahren zu seiner HerstellungInfo
- Publication number
- DE69324003D1 DE69324003D1 DE69324003T DE69324003T DE69324003D1 DE 69324003 D1 DE69324003 D1 DE 69324003D1 DE 69324003 T DE69324003 T DE 69324003T DE 69324003 T DE69324003 T DE 69324003T DE 69324003 D1 DE69324003 D1 DE 69324003D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- breakdown voltage
- power transistor
- bipolar power
- high collector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000015556 catabolic process Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66272—Silicon vertical transistors
- H01L29/66295—Silicon vertical transistors with main current going through the whole silicon substrate, e.g. power bipolar transistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/167—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System further characterised by the doping material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/01—Bipolar transistors-ion implantation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/965—Shaped junction formation
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP93830276A EP0632502B1 (de) | 1993-06-28 | 1993-06-28 | Bipolar-Leistungstransistor mit hoher Kollektor-Durchbrucksspannung und Verfahren zu seiner Herstellung |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69324003D1 true DE69324003D1 (de) | 1999-04-22 |
DE69324003T2 DE69324003T2 (de) | 1999-07-15 |
Family
ID=8215188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69324003T Expired - Fee Related DE69324003T2 (de) | 1993-06-28 | 1993-06-28 | Bipolar-Leistungstransistor mit hoher Kollektor-Durchbrucksspannung und Verfahren zu seiner Herstellung |
Country Status (4)
Country | Link |
---|---|
US (2) | US5569612A (de) |
EP (1) | EP0632502B1 (de) |
JP (1) | JPH0729914A (de) |
DE (1) | DE69324003T2 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3008154B2 (ja) * | 1994-12-19 | 2000-02-14 | セイコーインスツルメンツ株式会社 | 半導体装置の製造方法 |
KR970024275A (ko) * | 1995-10-10 | 1997-05-30 | 김광호 | 안전 동작 영역을 증가시킨 트랜지스터 및 그 제조 방법 |
DE19741167C2 (de) * | 1997-09-18 | 1999-08-12 | Siemens Ag | Randstruktur für ein Halbleiterbauelement |
GB9804177D0 (en) * | 1998-02-28 | 1998-04-22 | Philips Electronics Nv | Semiconductor switch devices and their manufacture |
US6211028B1 (en) | 1999-02-05 | 2001-04-03 | Taiwan Semiconductor Manufacturing Company | Twin current bipolar device with hi-lo base profile |
US6437421B1 (en) * | 1999-12-03 | 2002-08-20 | Legerity, Inc. | Self-aligned dual-base semiconductor process and structure incorporating multiple bipolar device types |
US6506656B2 (en) | 2001-03-19 | 2003-01-14 | International Business Machines Corporation | Stepped collector implant and method for fabrication |
FR2828767B1 (fr) * | 2001-08-14 | 2003-12-12 | Thales Sa | Transistor bipolaire a tension de claquage elevee |
US7037799B2 (en) * | 2002-10-24 | 2006-05-02 | Texas Instruments Incorporated | Breakdown voltage adjustment for bipolar transistors |
DE10302632B4 (de) * | 2003-01-23 | 2004-11-11 | Austriamicrosystems Ag | Verfahren zum Erzeugen eines definierten Dotierungsgebietes in einem Halbleitermaterial |
US20060049464A1 (en) * | 2004-09-03 | 2006-03-09 | Rao G R Mohan | Semiconductor devices with graded dopant regions |
EP1635397A1 (de) * | 2004-09-14 | 2006-03-15 | STMicroelectronics S.r.l. | Integriertes Leistungsbauelement mit verbessertem Randabschluss |
DE102007001108B4 (de) * | 2007-01-04 | 2012-03-22 | Infineon Technologies Ag | Diode und Verfahren zu ihrer Herstellung |
CN113437133B (zh) * | 2021-06-22 | 2022-07-22 | 弘大芯源(深圳)半导体有限公司 | 一种耐二次击穿的功率双极晶体管 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2241600A1 (de) * | 1971-08-26 | 1973-03-01 | Dionics Inc | Hochspannungs-p-n-uebergang und seine anwendung in halbleiterschaltelementen, sowie verfahren zu seiner herstellung |
IN141922B (de) * | 1974-08-19 | 1977-05-07 | Rca Corp | |
JPS5833693B2 (ja) * | 1977-08-12 | 1983-07-21 | 株式会社日立製作所 | 半導体装置の製造方法 |
US4416708A (en) * | 1982-01-15 | 1983-11-22 | International Rectifier Corporation | Method of manufacture of high speed, high power bipolar transistor |
US4559696A (en) * | 1984-07-11 | 1985-12-24 | Fairchild Camera & Instrument Corporation | Ion implantation to increase emitter energy gap in bipolar transistors |
IT1214805B (it) * | 1984-08-21 | 1990-01-18 | Ates Componenti Elettron | Spositivi a semiconduttore con giunprocesso per la fabbricazione di dizioni planari a concentrazione di carica variabile e ad altissima tensione di breakdown |
IT1202311B (it) * | 1985-12-11 | 1989-02-02 | Sgs Microelettronica Spa | Dispositivo a semiconduttore con una giunzione piana a terminazione auto passivante |
DE3782608D1 (de) * | 1986-09-30 | 1992-12-17 | Siemens Ag | Verfahren zum erzeugen eines p-dotierten halbleitergebiets in einem n-leitenden halbleiterkoerper. |
IT1215024B (it) * | 1986-10-01 | 1990-01-31 | Sgs Microelettronica Spa | Processo per la formazione di un dispositivo monolitico a semiconduttore di alta tensione |
JPH0744186B2 (ja) * | 1989-03-13 | 1995-05-15 | 株式会社東芝 | 半導体装置の製造方法 |
EP0439753A1 (de) * | 1990-01-31 | 1991-08-07 | International Business Machines Corporation | Bipolartransistor mit verbesserter Niedertemperatur-Stromverstärkung |
US4999309A (en) * | 1990-07-12 | 1991-03-12 | National Semiconductor Corporation | Aluminum-implant leakage reduction |
WO1993019490A1 (en) * | 1992-03-23 | 1993-09-30 | Rohm Co., Ltd. | Voltage regulating diode |
US5192712A (en) * | 1992-04-15 | 1993-03-09 | National Semiconductor Corporation | Control and moderation of aluminum in silicon using germanium and germanium with boron |
US5436179A (en) * | 1994-01-05 | 1995-07-25 | Texas Instruments Incorporated | Semiconductor process for manufacturing semiconductor devices with increased operating voltages |
-
1993
- 1993-06-28 EP EP93830276A patent/EP0632502B1/de not_active Expired - Lifetime
- 1993-06-28 DE DE69324003T patent/DE69324003T2/de not_active Expired - Fee Related
-
1994
- 1994-06-22 JP JP6140126A patent/JPH0729914A/ja active Pending
-
1995
- 1995-06-07 US US08/481,890 patent/US5569612A/en not_active Expired - Lifetime
-
1997
- 1997-07-31 US US08/904,257 patent/US5939769A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5939769A (en) | 1999-08-17 |
DE69324003T2 (de) | 1999-07-15 |
US5569612A (en) | 1996-10-29 |
JPH0729914A (ja) | 1995-01-31 |
EP0632502B1 (de) | 1999-03-17 |
EP0632502A1 (de) | 1995-01-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8339 | Ceased/non-payment of the annual fee |