DE69318663D1 - Thermoelektrische Kühlvorrichtung für thermoelektrischen Kühlschrank und Verfahren zu ihrer Herstellung - Google Patents
Thermoelektrische Kühlvorrichtung für thermoelektrischen Kühlschrank und Verfahren zu ihrer HerstellungInfo
- Publication number
- DE69318663D1 DE69318663D1 DE69318663T DE69318663T DE69318663D1 DE 69318663 D1 DE69318663 D1 DE 69318663D1 DE 69318663 T DE69318663 T DE 69318663T DE 69318663 T DE69318663 T DE 69318663T DE 69318663 D1 DE69318663 D1 DE 69318663D1
- Authority
- DE
- Germany
- Prior art keywords
- thermoelectric
- manufacture
- cooling device
- refrigerator
- thermoelectric cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/855—Thermoelectric active materials comprising inorganic compositions comprising compounds containing boron, carbon, oxygen or nitrogen
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
- F25D19/006—Thermal coupling structure or interface
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26612692 | 1992-10-05 | ||
JP10552693A JP3451107B2 (ja) | 1992-10-05 | 1993-05-06 | 電子冷却装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69318663D1 true DE69318663D1 (de) | 1998-06-25 |
DE69318663T2 DE69318663T2 (de) | 1998-09-10 |
Family
ID=26445798
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69318663T Expired - Fee Related DE69318663T2 (de) | 1992-10-05 | 1993-10-04 | Thermoelektrische Kühlvorrichtung für thermoelektrischen Kühlschrank und Verfahren zu ihrer Herstellung |
Country Status (5)
Country | Link |
---|---|
US (1) | US5409547A (de) |
EP (2) | EP0592044B1 (de) |
JP (1) | JP3451107B2 (de) |
AU (2) | AU667747B2 (de) |
DE (1) | DE69318663T2 (de) |
Families Citing this family (102)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5605189A (en) * | 1994-04-15 | 1997-02-25 | Imation Corp. | Method for controlling the temperature of an intermittently standing and flowing fluid which is at rest during standstill intervals and is flowing during flow intervals |
JP3369349B2 (ja) * | 1995-03-02 | 2003-01-20 | 株式会社エコ・トゥエンティーワン | 熱電変換装置 |
JP3951315B2 (ja) * | 1995-05-26 | 2007-08-01 | 松下電工株式会社 | ペルチェモジュール |
US5784890A (en) * | 1996-06-03 | 1998-07-28 | Polkinghorne; John D. | Compact thermoelectric refrigeration drive assembly |
JP3459328B2 (ja) * | 1996-07-26 | 2003-10-20 | 日本政策投資銀行 | 熱電半導体およびその製造方法 |
EP0827215A3 (de) * | 1996-08-27 | 2000-09-20 | Kubota Corporation | Thermoelektrische Moduln und thermoelektrische Elemente |
JPH10125962A (ja) * | 1996-10-22 | 1998-05-15 | Nanba Kikujiro | 熱電変換装置 |
US5884235A (en) * | 1996-12-17 | 1999-03-16 | Integrated Systems, Inc. | Non-contact, zero-flux temperature sensor |
JPH10178216A (ja) * | 1996-12-18 | 1998-06-30 | Seru Appl Kk | 熱電素子及び熱電冷却装置 |
AU8249498A (en) * | 1997-06-04 | 1998-12-21 | Obschestvo S Ogranichennoi Otvetstvennostyu Mak-Bet | Thermo-electric battery, thermo-electric cooling unit and device for heating andcooling a liquid |
AU7904298A (en) * | 1997-07-15 | 1999-02-10 | Ivo F. Sbalzarini | High efficiency thermoelectric converter and applications thereof |
US6222242B1 (en) * | 1998-07-27 | 2001-04-24 | Komatsu Ltd. | Thermoelectric semiconductor material and method of manufacturing same |
US6586835B1 (en) * | 1998-08-31 | 2003-07-01 | Micron Technology, Inc. | Compact system module with built-in thermoelectric cooling |
US6392296B1 (en) | 1998-08-31 | 2002-05-21 | Micron Technology, Inc. | Silicon interposer with optical connections |
US6424034B1 (en) | 1998-08-31 | 2002-07-23 | Micron Technology, Inc. | High performance packaging for microprocessors and DRAM chips which minimizes timing skews |
US6219237B1 (en) | 1998-08-31 | 2001-04-17 | Micron Technology, Inc. | Structure and method for an electronic assembly |
US6281042B1 (en) | 1998-08-31 | 2001-08-28 | Micron Technology, Inc. | Structure and method for a high performance electronic packaging assembly |
US6434000B1 (en) * | 1998-12-03 | 2002-08-13 | Iv Phoenix Group, Inc. | Environmental system for rugged disk drive |
US6255852B1 (en) | 1999-02-09 | 2001-07-03 | Micron Technology, Inc. | Current mode signal interconnects and CMOS amplifier |
IT1309710B1 (it) | 1999-02-19 | 2002-01-30 | Pastorino Giorgio | Dispositivo termoelettrico a stato solido |
CN1156921C (zh) * | 1999-06-25 | 2004-07-07 | 松下电工株式会社 | 用于生产热电元件材料的烧结体的方法 |
US7554829B2 (en) | 1999-07-30 | 2009-06-30 | Micron Technology, Inc. | Transmission lines for CMOS integrated circuits |
JP3510831B2 (ja) * | 1999-12-22 | 2004-03-29 | 株式会社小松製作所 | 熱交換器 |
CA2305647C (en) * | 2000-04-20 | 2006-07-11 | Jacques Laliberte | Modular thermoelectric unit and cooling system using same |
US6907322B2 (en) * | 2000-11-30 | 2005-06-14 | International Business Machines Corporation | Method and apparatus for characterization of thermal response of GMR sensors in magnetic heads for disk drives |
US6555413B1 (en) * | 2001-02-23 | 2003-04-29 | Triquint Technology Holding Co. | Method for interconnecting semiconductor elements to form a thermoelectric cooler and a thermoelectric cooler formed therefrom |
CN2480779Y (zh) * | 2001-05-18 | 2002-03-06 | 河北节能投资有限责任公司 | 一种间冷式温差电致冷器 |
KR100426693B1 (ko) * | 2001-07-14 | 2004-04-13 | 삼성전자주식회사 | 펠티어 소자를 이용한 냉온장고 및 그 제조방법 |
US6623514B1 (en) | 2001-08-01 | 2003-09-23 | Origin Medsystems, Inc. | Method of cooling an organ |
JP2002151750A (ja) * | 2001-08-20 | 2002-05-24 | Development Bank Of Japan | 熱電変換装置 |
US6698224B2 (en) * | 2001-11-07 | 2004-03-02 | Hitachi Kokusai Electric Inc. | Electronic apparatus having at least two electronic parts operating at different temperatures |
US7101770B2 (en) * | 2002-01-30 | 2006-09-05 | Micron Technology, Inc. | Capacitive techniques to reduce noise in high speed interconnections |
US7235457B2 (en) | 2002-03-13 | 2007-06-26 | Micron Technology, Inc. | High permeability layered films to reduce noise in high speed interconnects |
JP2003282969A (ja) * | 2002-03-26 | 2003-10-03 | Yamaha Corp | 熱電変換モジュール |
RU2234765C1 (ru) * | 2003-10-22 | 2004-08-20 | Закрытое акционерное общество "Специализированное конструкторско-технологическое бюро "НОРД" | Термоэлектрический модуль |
US7032389B2 (en) * | 2003-12-12 | 2006-04-25 | Thermoelectric Design, Llc | Thermoelectric heat pump with direct cold sink support |
EP1723702B1 (de) * | 2004-03-12 | 2015-10-28 | Panduit Corporation | Verfahren und vorrichtungen zum verringern von übersprechen in elektrischen verbindern |
US7129501B2 (en) * | 2004-06-29 | 2006-10-31 | Sii Nanotechnology Usa, Inc. | Radiation detector system having heat pipe based cooling |
EP1807881A2 (de) * | 2004-11-02 | 2007-07-18 | Showa Denko Kabushiki Kaisha | Thermoelektrisches wandlermodul, thermoelektrische stromerzeugungsvorrichtung und verfahren damit, auspuff-wärmewiedergewinnungssystem, solarwärme-wiedergewinnungssystem und peltier-kühlsystem |
US7587901B2 (en) | 2004-12-20 | 2009-09-15 | Amerigon Incorporated | Control system for thermal module in vehicle |
US20060163490A1 (en) * | 2005-01-21 | 2006-07-27 | Advanced Ion Beam Technology Inc. | Ion implantation cooling system |
JP2006234362A (ja) * | 2005-02-28 | 2006-09-07 | Komatsu Electronics Inc | 熱交換器及び熱交換器の製造方法 |
US20070101737A1 (en) * | 2005-11-09 | 2007-05-10 | Masao Akei | Refrigeration system including thermoelectric heat recovery and actuation |
US7310953B2 (en) * | 2005-11-09 | 2007-12-25 | Emerson Climate Technologies, Inc. | Refrigeration system including thermoelectric module |
US8481842B2 (en) * | 2006-03-01 | 2013-07-09 | Curamik Electronics Gmbh | Process for producing Peltier modules, and Peltier module |
JP4953841B2 (ja) * | 2006-03-31 | 2012-06-13 | 京セラ株式会社 | 熱電モジュール |
US20080087316A1 (en) * | 2006-10-12 | 2008-04-17 | Masa Inaba | Thermoelectric device with internal sensor |
WO2008086499A2 (en) | 2007-01-10 | 2008-07-17 | Amerigon Incorporated | Thermoelectric device |
US8544292B2 (en) * | 2007-07-10 | 2013-10-01 | Omnitherm, Inc. | Vehicle air conditioner |
US7877827B2 (en) | 2007-09-10 | 2011-02-01 | Amerigon Incorporated | Operational control schemes for ventilated seat or bed assemblies |
EP3121060A1 (de) | 2008-02-01 | 2017-01-25 | Gentherm Incorporated | Kondensations- und feuchtigkeitssensoren für thermoelektrische vorrichtungen |
JP5997899B2 (ja) | 2008-07-18 | 2016-09-28 | ジェンサーム インコーポレイテッドGentherm Incorporated | 空調されるベッドアセンブリ |
DE102009000514A1 (de) * | 2009-01-30 | 2010-08-26 | Robert Bosch Gmbh | Verbundbauteil sowie Verfahren zum Herstellen eines Verbundbauteil |
US8359871B2 (en) * | 2009-02-11 | 2013-01-29 | Marlow Industries, Inc. | Temperature control device |
US8905968B2 (en) | 2009-04-29 | 2014-12-09 | Encephalon Technologies, Llc | System for cooling and pressurizing fluid |
US20110030754A1 (en) * | 2009-08-06 | 2011-02-10 | Laird Technologies, Inc. | Thermoelectric modules and related methods |
JP2012059831A (ja) * | 2010-09-07 | 2012-03-22 | Toyota Industries Corp | 配線基板の伝熱装置 |
US9121414B2 (en) | 2010-11-05 | 2015-09-01 | Gentherm Incorporated | Low-profile blowers and methods |
DE102011009428A1 (de) | 2011-01-26 | 2012-07-26 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Thermoelektrisches Modul mit einer Wärmeleitschicht |
US8649179B2 (en) | 2011-02-05 | 2014-02-11 | Laird Technologies, Inc. | Circuit assemblies including thermoelectric modules |
RU2444814C1 (ru) * | 2011-03-29 | 2012-03-10 | Юрий Феликсович Верниковский | Термоэлектрический кластер, способ его работы, устройство соединения в нем активного элемента с теплоэлектропроводом, генератор (варианты) и тепловой насос (варианты) на его основе |
KR20130035016A (ko) * | 2011-09-29 | 2013-04-08 | 삼성전기주식회사 | 열전 모듈 |
US9685599B2 (en) | 2011-10-07 | 2017-06-20 | Gentherm Incorporated | Method and system for controlling an operation of a thermoelectric device |
US9989267B2 (en) | 2012-02-10 | 2018-06-05 | Gentherm Incorporated | Moisture abatement in heating operation of climate controlled systems |
WO2013169774A2 (en) * | 2012-05-07 | 2013-11-14 | Phononic Devices, Inc. | Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance |
US20130291555A1 (en) | 2012-05-07 | 2013-11-07 | Phononic Devices, Inc. | Thermoelectric refrigeration system control scheme for high efficiency performance |
JP6069945B2 (ja) * | 2012-08-10 | 2017-02-01 | ヤマハ株式会社 | 熱電ユニット |
CN102901266A (zh) * | 2012-09-28 | 2013-01-30 | 杭州电子科技大学 | 一种柔性磁条贴合式半导体制冷装置 |
US9151524B2 (en) * | 2012-12-03 | 2015-10-06 | Whirlpool Corporation | Refrigerator with icemaker chilled by thermoelectric device cooled by fresh food compartment air |
US20140332048A1 (en) * | 2013-05-08 | 2014-11-13 | Vern Green Power Solutions, Llc | Thermoelectric device |
RU2534445C1 (ru) * | 2013-06-04 | 2014-11-27 | Открытое акционерное общество "РИФ" | Термоэлектрический охлаждающий модуль |
DE102013212524A1 (de) * | 2013-06-27 | 2015-01-15 | Behr Gmbh & Co. Kg | Thermoelektrische Temperiereinheit |
CN103335468A (zh) * | 2013-07-05 | 2013-10-02 | 无锡商业职业技术学院 | 半导体型温度可调节可显示车载冰箱 |
US9662962B2 (en) | 2013-11-05 | 2017-05-30 | Gentherm Incorporated | Vehicle headliner assembly for zonal comfort |
KR102051617B1 (ko) | 2014-02-14 | 2019-12-03 | 젠썸 인코포레이티드 | 전도식 대류식 기온 제어 시트 |
CN106471321A (zh) * | 2014-06-16 | 2017-03-01 | 利勃海尔-家用电器奥克森豪森有限责任公司 | 热绝缘的容器 |
DE102015006557A1 (de) * | 2014-06-16 | 2015-12-17 | Liebherr-Hausgeräte Lienz Gmbh | Thermoelektrisch gekühltes oder beheiztes Behältnis |
DE102015006561A1 (de) * | 2014-06-16 | 2015-12-17 | Liebherr-Hausgeräte Lienz Gmbh | Vakuumdämmkörper mit einem thermoelektrischen Element |
DE102015006583A1 (de) * | 2014-06-16 | 2015-12-17 | Liebherr-Hausgeräte Lienz Gmbh | Temperiertes Behältnis |
CN105452921B (zh) * | 2014-07-18 | 2019-03-08 | 华为技术有限公司 | 波长选择开关和选择波长的方法 |
US10458683B2 (en) | 2014-07-21 | 2019-10-29 | Phononic, Inc. | Systems and methods for mitigating heat rejection limitations of a thermoelectric module |
WO2016077843A1 (en) | 2014-11-14 | 2016-05-19 | Cauchy Charles J | Heating and cooling technologies |
US11857004B2 (en) | 2014-11-14 | 2024-01-02 | Gentherm Incorporated | Heating and cooling technologies |
US11639816B2 (en) | 2014-11-14 | 2023-05-02 | Gentherm Incorporated | Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system |
EP3051231B1 (de) * | 2015-01-29 | 2020-03-04 | Liebherr-Hausgeräte Lienz GmbH | Kühl- und/oder gefriergerät |
CN104729182B (zh) * | 2015-02-03 | 2016-11-23 | 青岛海尔股份有限公司 | 半导体制冷冰箱 |
JP6527250B2 (ja) | 2015-06-10 | 2019-06-05 | ジェンサーム インコーポレイテッドGentherm Incorporated | 低温プレートアセンブリ一体化車両バッテリ熱電素子と熱電素子の組立方法 |
KR20180054516A (ko) * | 2015-06-10 | 2018-05-24 | 젠썸 인코포레이티드 | 파스닝 엘리먼트 단열 특징부를 가진 자동차 전지용 열전 모듈 |
US20200031242A1 (en) * | 2015-06-10 | 2020-01-30 | Gentherm Inc. | Thermoelectric module with thermal isolation features for vehicle battery |
CN107735638A (zh) * | 2015-06-10 | 2018-02-23 | 金瑟姆股份有限公司 | 具有改进的传热和隔热特征的运载工具电池热电模块 |
DE102016202435A1 (de) * | 2016-02-17 | 2017-08-17 | Mahle International Gmbh | Wärmeübertrager |
JP6785581B2 (ja) * | 2016-05-25 | 2020-11-18 | ヤンマーパワーテクノロジー株式会社 | 熱電発電装置 |
US20180054858A1 (en) | 2016-08-16 | 2018-02-22 | Ford Global Technologies, Llc | Thermally conductive skin |
CN109186161A (zh) * | 2018-07-02 | 2019-01-11 | 青岛海尔股份有限公司 | 可制热的微型冰箱 |
US10991869B2 (en) | 2018-07-30 | 2021-04-27 | Gentherm Incorporated | Thermoelectric device having a plurality of sealing materials |
CN113167510A (zh) | 2018-11-30 | 2021-07-23 | 金瑟姆股份公司 | 热电调节系统和方法 |
US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
RU2740589C1 (ru) * | 2020-06-25 | 2021-01-15 | Общество с ограниченной ответственностью "Термоэлектрические инновационные технологии" | Термоэлектрический модуль. |
CN112556236A (zh) * | 2021-01-08 | 2021-03-26 | 东莞市静航电子商务有限公司 | 一种用于小空间降温的半导体冷却装置 |
CN114977888A (zh) * | 2021-04-23 | 2022-08-30 | 深圳市安服优智能互联科技有限公司 | 温差发电结构及测温传感器 |
US20230053122A1 (en) | 2021-08-10 | 2023-02-16 | Becton, Dickinson And Company | Clamps for operably coupling an optical component to a mounting block, and methods and systems for using the same |
TWI790933B (zh) * | 2022-03-02 | 2023-01-21 | 宏碁股份有限公司 | 熱電致冷模組 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3097027A (en) * | 1961-03-21 | 1963-07-09 | Barden Corp | Thermoelectric cooling assembly |
US3162531A (en) * | 1961-03-30 | 1964-12-22 | Sanyo Electric Co | Method for the production of semiconductor elements made of an intermetallic compound |
DE1944453B2 (de) * | 1969-09-02 | 1970-11-19 | Buderus Eisenwerk | Peltierbatterie mit Waermeaustauscher |
DE1963023A1 (de) * | 1969-12-10 | 1971-06-16 | Siemens Ag | Thermoelektrische Vorrichtung |
US4459428A (en) * | 1982-04-28 | 1984-07-10 | Energy Conversion Devices, Inc. | Thermoelectric device and method of making same |
FR2570169B1 (fr) * | 1984-09-12 | 1987-04-10 | Air Ind | Perfectionnements apportes aux modules thermo-electriques a plusieurs thermo-elements pour installation thermo-electrique, et installation thermo-electrique comportant de tels modules thermo-electriques |
US4634803A (en) * | 1985-02-25 | 1987-01-06 | Midwest Research Institute | Method of obtaining optimum performance from a thermoelectric heating/cooling device |
US5316858A (en) * | 1985-03-22 | 1994-05-31 | Sharp Kabushiki Kaisha | Materials for thermoelectric and light-heat conversion |
FR2594599B1 (fr) * | 1986-02-19 | 1988-06-24 | Centre Nat Rech Scient | Materiaux semiconducteurs thermoelectriques a base d'argent, cuivre, tellure et thallium, procede de preparation et application aux convertisseurs thermoelectriques |
US4828627A (en) * | 1987-09-02 | 1989-05-09 | Living Water Corporation | Thermoelectric module optimized for low temperature difference |
EP0335213A3 (de) * | 1988-03-30 | 1990-01-24 | Idemitsu Petrochemical Co. Ltd. | Verfahren zur Herstellung thermoelektrischer Elemente |
US5006505A (en) * | 1988-08-08 | 1991-04-09 | Hughes Aircraft Company | Peltier cooling stage utilizing a superconductor-semiconductor junction |
US5246504A (en) * | 1988-11-15 | 1993-09-21 | Director-General, Agency Of Industrial Science And Technology | Thermoelectric material |
JPH02198179A (ja) * | 1989-01-27 | 1990-08-06 | Matsushita Electric Ind Co Ltd | 熱電素子および熱電素子の製造方法 |
JPH03263382A (ja) * | 1989-04-17 | 1991-11-22 | Nippondenso Co Ltd | 熱電変換装置 |
JPH03187280A (ja) * | 1989-12-18 | 1991-08-15 | Nkk Corp | Bi―Te系熱電変換薄膜及びその熱電変換素子 |
US5040381A (en) * | 1990-04-19 | 1991-08-20 | Prime Computer, Inc. | Apparatus for cooling circuits |
DE69130654T2 (de) * | 1990-04-20 | 1999-08-12 | Matsushita Electric Ind Co Ltd | Vakuumisolierter thermoelektrischer Halbleiter bestehend aus einer porösen Struktur und thermoelektrisches Bauelement |
-
1993
- 1993-05-06 JP JP10552693A patent/JP3451107B2/ja not_active Expired - Fee Related
- 1993-09-30 US US08/128,697 patent/US5409547A/en not_active Expired - Fee Related
- 1993-10-04 EP EP93202824A patent/EP0592044B1/de not_active Expired - Lifetime
- 1993-10-04 EP EP97203488A patent/EP0838868A3/de not_active Withdrawn
- 1993-10-04 DE DE69318663T patent/DE69318663T2/de not_active Expired - Fee Related
- 1993-10-05 AU AU48821/93A patent/AU667747B2/en not_active Ceased
-
1996
- 1996-02-05 AU AU43356/96A patent/AU676811B2/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
EP0838868A3 (de) | 1999-04-21 |
US5409547A (en) | 1995-04-25 |
JPH06174329A (ja) | 1994-06-24 |
AU4335696A (en) | 1996-05-02 |
EP0592044A3 (en) | 1994-05-18 |
AU667747B2 (en) | 1996-04-04 |
AU4882193A (en) | 1994-04-21 |
DE69318663T2 (de) | 1998-09-10 |
EP0592044B1 (de) | 1998-05-20 |
JP3451107B2 (ja) | 2003-09-29 |
EP0838868A2 (de) | 1998-04-29 |
AU676811B2 (en) | 1997-03-20 |
EP0592044A2 (de) | 1994-04-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69318663T2 (de) | Thermoelektrische Kühlvorrichtung für thermoelektrischen Kühlschrank und Verfahren zu ihrer Herstellung | |
DE69309583D1 (de) | Halbleitervorrichtung und Verfahren zu ihrer Herstellung | |
DE69329635D1 (de) | Halbleiteranordnung und Verfahren zu ihrer Herstellung | |
DE4323799B4 (de) | Halbleiteranordnung und Verfahren zu ihrer Herstellung | |
DE69529493T2 (de) | Anzeigevorrichtung und Verfahren zu ihrer Herstellung | |
DE69532907D1 (de) | Halbleitervorrichtung und Verfahren zu ihrer Herstellung | |
DE69030822D1 (de) | Halbleitervorrichtung und Verfahren zu ihrer Herstellung | |
DE69326419D1 (de) | Flache Anzeigevorrichtung und Verfahren zu ihrer Herstellung | |
DE69231290D1 (de) | Halbleitervorrichtung und Verfahren zu ihrer Herstellung | |
DE69128568T2 (de) | Kontaktstrukturen für Halbleiteranordnungen und Verfahren zu ihrer Herstellung | |
DE69031058D1 (de) | Kältespeichermaterial und Verfahren zu seiner Herstellung | |
DE69334128D1 (de) | Aufbewahrungsvorrichtung für Stangen | |
DE69309036D1 (de) | Formverfahren und -einrichtung für Gegenstände aus gefrorenen Süsswaren | |
DE69313024T2 (de) | Festkörperbildaufnahmeanordnung und Verfahren zu ihrer Herstellung | |
DE69032447D1 (de) | Thermistor und Verfahren zu seiner Herstellung | |
DE69306678D1 (de) | Dichtungsvorrichtung und Verfahren zu ihrer Herstellung | |
DE69332117D1 (de) | 4-diphenylmethylpiperidine und verfahren zu ihrer herstellung | |
DE69323884D1 (de) | Elektrolumineszente Festkörpervorrichtung und Verfahren zu ihrer Herstellung | |
DE69432546D1 (de) | Metallgehäuse für Halbleiterbauelement und Verfahren zu seiner Herstellung | |
DE69022665D1 (de) | Speichereffizientes Gerät und Verfahren für eine Bild-im-Bild-Anzeige. | |
DE69327434T2 (de) | Dünnschicht-Halbleiteranordnung und Verfahren zu ihrer Herstellung | |
DE69330302D1 (de) | Halbleiterspeicheranordnung und Verfahren zu ihrer Herstellung | |
DE69324848D1 (de) | Zusammensetzung für Süsswarenfett und Herstellungsverfahren | |
DE69528271D1 (de) | Flüssigkristalline copolyesterimide und verfahren zu ihrer herstellung | |
DE69219100D1 (de) | Halbleiteranordnung und Verfahren zu ihrer Herstellung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |