DE69231777T2 - Verfahren zur Herstellung eines Halbleitersubstrats - Google Patents

Verfahren zur Herstellung eines Halbleitersubstrats

Info

Publication number
DE69231777T2
DE69231777T2 DE69231777T DE69231777T DE69231777T2 DE 69231777 T2 DE69231777 T2 DE 69231777T2 DE 69231777 T DE69231777 T DE 69231777T DE 69231777 T DE69231777 T DE 69231777T DE 69231777 T2 DE69231777 T2 DE 69231777T2
Authority
DE
Germany
Prior art keywords
layer
substrate
oxidation
monocrystalline
porous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69231777T
Other languages
German (de)
English (en)
Other versions
DE69231777D1 (de
Inventor
Kiyofumi Sakaguchi
Takao Yonehara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69231777D1 publication Critical patent/DE69231777D1/de
Publication of DE69231777T2 publication Critical patent/DE69231777T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10P90/1914—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/0203—Making porous regions on the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
    • H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
    • H10P90/15—
    • H10W10/181—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/116—Oxidation, differential
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/928—Front and rear surface processing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
  • Recrystallisation Techniques (AREA)
DE69231777T 1991-01-16 1992-01-15 Verfahren zur Herstellung eines Halbleitersubstrats Expired - Fee Related DE69231777T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP00325391A JP3176072B2 (ja) 1991-01-16 1991-01-16 半導体基板の形成方法

Publications (2)

Publication Number Publication Date
DE69231777D1 DE69231777D1 (de) 2001-05-17
DE69231777T2 true DE69231777T2 (de) 2001-08-23

Family

ID=11552303

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69231777T Expired - Fee Related DE69231777T2 (de) 1991-01-16 1992-01-15 Verfahren zur Herstellung eines Halbleitersubstrats

Country Status (5)

Country Link
US (1) US5258322A (OSRAM)
EP (1) EP0501119B1 (OSRAM)
JP (1) JP3176072B2 (OSRAM)
CA (1) CA2059368C (OSRAM)
DE (1) DE69231777T2 (OSRAM)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6171512B1 (en) 1991-02-15 2001-01-09 Canon Kabushiki Kaisha Etching solution for etching porous silicon, etching method using the etching solution and method of preparing semiconductor member using the etching solution
JP3092761B2 (ja) * 1991-12-02 2000-09-25 キヤノン株式会社 画像表示装置及びその製造方法
JPH05217824A (ja) * 1992-01-31 1993-08-27 Canon Inc 半導体ウエハ及びその製造方法
JP3416163B2 (ja) * 1992-01-31 2003-06-16 キヤノン株式会社 半導体基板及びその作製方法
US5331180A (en) * 1992-04-30 1994-07-19 Fujitsu Limited Porous semiconductor light emitting device
JPH06244389A (ja) * 1992-12-25 1994-09-02 Canon Inc 半導体基板の作製方法及び該方法により作製された半導体基板
JP2907125B2 (ja) * 1996-06-11 1999-06-21 日本電気株式会社 裏面照射型固体撮像素子の製造方法
CA2231625C (en) * 1997-03-17 2002-04-02 Canon Kabushiki Kaisha Semiconductor substrate having compound semiconductor layer, process for its production, and electronic device fabricated on semiconductor substrate
JPH11195775A (ja) 1997-12-26 1999-07-21 Sony Corp 半導体基板および薄膜半導体素子およびそれらの製造方法ならびに陽極化成装置
DE19802131B4 (de) * 1998-01-21 2007-03-15 Robert Bosch Gmbh Verfahren zur Herstellung einer monokristallinen Schicht aus einem leitenden oder halbleitenden Material
US6372601B1 (en) * 1998-09-03 2002-04-16 Micron Technology, Inc. Isolation region forming methods
US6284671B1 (en) * 1998-11-19 2001-09-04 National Research Council Of Canada Selective electrochemical process for creating semiconductor nano-and micro-patterns
EP1244139A2 (en) * 2001-03-23 2002-09-25 Matsushita Electric Industrial Co., Ltd. Manufacturing method of semiconductor film
DE10143936A1 (de) * 2001-09-07 2003-01-09 Infineon Technologies Ag Verfahren zur Bildung eines SOI-Substrats, vertikaler Transistor und Speicherzelle mit vertikalem Transistor
JP4554180B2 (ja) * 2003-09-17 2010-09-29 ソニー株式会社 薄膜半導体デバイスの製造方法
US7767541B2 (en) * 2005-10-26 2010-08-03 International Business Machines Corporation Methods for forming germanium-on-insulator semiconductor structures using a porous layer and semiconductor structures formed by these methods
WO2007131343A1 (en) * 2006-05-15 2007-11-22 Arise Technologies Corporation Low-temperature doping processes for silicon wafer devices
US20170092725A1 (en) * 2015-09-29 2017-03-30 International Business Machines Corporation Activated thin silicon layers

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS584818B2 (ja) * 1977-04-30 1983-01-27 松下電器産業株式会社 半導体基体の製造方法
JPS592185B2 (ja) * 1980-02-04 1984-01-17 日本電信電話株式会社 半導体基体内への絶縁領域の形成法
JPS5825245A (ja) * 1981-07-23 1983-02-15 Clarion Co Ltd 半導体集積回路およびその製法
JPS59144149A (ja) * 1983-02-08 1984-08-18 Toko Inc 誘電体分離基板の製造方法
US5098850A (en) * 1989-06-16 1992-03-24 Canon Kabushiki Kaisha Process for producing substrate for selective crystal growth, selective crystal growth process and process for producing solar battery by use of them
JP3253099B2 (ja) * 1990-03-27 2002-02-04 キヤノン株式会社 半導体基板の作製方法

Also Published As

Publication number Publication date
EP0501119A2 (en) 1992-09-02
EP0501119B1 (en) 2001-04-11
CA2059368C (en) 1998-07-28
JPH04241414A (ja) 1992-08-28
DE69231777D1 (de) 2001-05-17
CA2059368A1 (en) 1992-07-17
JP3176072B2 (ja) 2001-06-11
US5258322A (en) 1993-11-02
EP0501119A3 (OSRAM) 1995-03-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee