DE69210431T2 - Wasserlösliche Lötpaste - Google Patents

Wasserlösliche Lötpaste

Info

Publication number
DE69210431T2
DE69210431T2 DE69210431T DE69210431T DE69210431T2 DE 69210431 T2 DE69210431 T2 DE 69210431T2 DE 69210431 T DE69210431 T DE 69210431T DE 69210431 T DE69210431 T DE 69210431T DE 69210431 T2 DE69210431 T2 DE 69210431T2
Authority
DE
Germany
Prior art keywords
water
solder paste
soluble solder
soluble
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69210431T
Other languages
English (en)
Other versions
DE69210431D1 (de
Inventor
Courtney V Dodd
John R Morris
Gregory C Munie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Publication of DE69210431D1 publication Critical patent/DE69210431D1/de
Application granted granted Critical
Publication of DE69210431T2 publication Critical patent/DE69210431T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69210431T 1991-01-28 1992-01-17 Wasserlösliche Lötpaste Expired - Fee Related DE69210431T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/646,556 US5069730A (en) 1991-01-28 1991-01-28 Water-soluble soldering paste

Publications (2)

Publication Number Publication Date
DE69210431D1 DE69210431D1 (de) 1996-06-13
DE69210431T2 true DE69210431T2 (de) 1996-11-28

Family

ID=24593510

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69210431T Expired - Fee Related DE69210431T2 (de) 1991-01-28 1992-01-17 Wasserlösliche Lötpaste

Country Status (4)

Country Link
US (1) US5069730A (de)
EP (1) EP0497481B1 (de)
JP (1) JP2609391B2 (de)
DE (1) DE69210431T2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5198038A (en) * 1990-05-15 1993-03-30 Hughes Aircraft Company Foaming flux for automatic soldering process
GB2265156B (en) * 1992-03-19 1996-04-03 Fujitsu Ltd Methods for making metal particles spherical and removing oxide film therefrom
US5297721A (en) * 1992-11-19 1994-03-29 Fry's Metals, Inc. No-clean soldering flux and method using the same
US5571340A (en) * 1994-09-09 1996-11-05 Fry's Metals, Inc. Rosin-free, low VOC, no-clean soldering flux and method using the same
US6752309B1 (en) 1999-07-22 2004-06-22 Oatey Co. Water soluble fluxes and methods of using the same
JP4812429B2 (ja) * 2005-01-31 2011-11-09 三洋電機株式会社 回路装置の製造方法
JP4800900B2 (ja) * 2006-10-31 2011-10-26 ハリマ化成株式会社 はんだペースト組成物
KR20140006017A (ko) * 2011-03-02 2014-01-15 센주긴조쿠고교 가부시키가이샤 플럭스

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3977916A (en) * 1974-12-20 1976-08-31 Chevron Research Company Wax-flux composition containing alkylaryl sulfonic acid for soldering
US4151015A (en) * 1977-12-02 1979-04-24 Lake Chemical Company Flux for use in soldering
US4342607A (en) * 1981-01-05 1982-08-03 Western Electric Company, Inc. Solder flux
US4460414A (en) * 1983-10-31 1984-07-17 Scm Corporation Solder paste and vehicle therefor
JPS6149799A (ja) * 1984-08-17 1986-03-11 Kemikooto:Kk 水溶性はんだ付け用フラツクス
JPS6174538A (ja) * 1984-09-17 1986-04-16 Ajinomoto Co Inc 含脂粉末用油脂
JPS61242790A (ja) * 1985-04-19 1986-10-29 Asahi Kagaku Kenkyusho:Kk 半田付け用フラツクス
US4648547A (en) * 1985-06-26 1987-03-10 At&T Technologies, Inc. Method and apparatus for achieving reduced component failure during soldering
JPH0773795B2 (ja) * 1985-07-02 1995-08-09 太陽インキ製造株式会社 はんだ付用水洗性フラツクス組成物
JPS6216899A (ja) * 1985-07-15 1987-01-26 Asahi Kagaku Kenkyusho:Kk 水溶性フラツクス
JPH0647190B2 (ja) * 1985-10-28 1994-06-22 カルソニック株式会社 熱交換器の製造方法
JPS62137195A (ja) * 1985-12-10 1987-06-20 Sanko Kagaku Kk ハンダ用フラツクス組成物
JPS62158710A (ja) * 1986-01-08 1987-07-14 Ube Ind Ltd 光硬化性組成物
JPS62224496A (ja) * 1986-03-27 1987-10-02 Kanto Yakin Kogyo Kk アルミニウム又はアルミニウム合金のろう付け用フラツクス塗料組成物
US4701224A (en) * 1986-04-21 1987-10-20 American Telephone And Telegraph Company, At&T Bell Laboratories Water soluble condensation soldering flux
JPS62248596A (ja) * 1986-04-22 1987-10-29 Electroplating Eng Of Japan Co 水溶性ハンダフラツクス及びそれを用いたハンダ付け方法
JPS6388085A (ja) * 1986-10-02 1988-04-19 Toyo Kohan Co Ltd めつき鋼板の後処理方法
JPS63115693A (ja) * 1986-11-04 1988-05-20 Asahi Chem Res Lab Ltd クリ−ムはんだ
GB8628916D0 (en) * 1986-12-03 1987-01-07 Multicore Solders Ltd Solder composition
SU1493430A1 (ru) * 1987-06-24 1989-07-15 Кабардино-Балкарский государственный университет Паста дл пайки
US4872298A (en) * 1988-02-12 1989-10-10 Klemic Jr Frank Concrete anchor bolt setting device
US4988395A (en) * 1989-01-31 1991-01-29 Senju Metal Industry Co., Ltd. Water-soluble soldering flux and paste solder using the flux
AU5919890A (en) * 1989-08-14 1991-02-14 Multicore Solders Limited Manufacture of printed circuit board assemblies
US5009724A (en) * 1990-07-02 1991-04-23 At&T Bell Laboratories Soldering flux and method of its use in fabricating and assembling circuit boards

Also Published As

Publication number Publication date
EP0497481A3 (en) 1992-11-25
JPH0569183A (ja) 1993-03-23
JP2609391B2 (ja) 1997-05-14
DE69210431D1 (de) 1996-06-13
US5069730A (en) 1991-12-03
EP0497481B1 (de) 1996-05-08
EP0497481A2 (de) 1992-08-05

Similar Documents

Publication Publication Date Title
DE69431001T2 (de) Lötpaste
DE69224014D1 (de) Weichlötpasta
FI941884A (fi) Vesiliukoinen pakkaus
FI982185A (fi) Vesiliukoiset kamtotesiinijohdokset
DE69131712D1 (de) Lottragender anschlussdraht
DE69220483D1 (de) Wasserlösliche verpackung
DE69213084D1 (de) Aluminiumhartlotpaste
DE69226968T2 (de) Lottragender anschlussdraht
ATA193788A (de) Loetverbindung
DE69108336T2 (de) Lötmittelaufbringung.
DE69112164T2 (de) Aufbringen einer Lötpaste.
DE69209873D1 (de) Multiplizierschaltung
DE59204995D1 (de) Anschlussklemme
DE69126943D1 (de) Wasserlösliche Lötpaste
DE69205385T2 (de) Lötflussmittel.
DE69210431D1 (de) Wasserlösliche Lötpaste
DE69216323D1 (de) Impedanzvervielfacher
DE69127226T2 (de) Wasserlöslisches Weichlötflussmittel
TR27562A (tr) Lehim pastasi.
DE59206409D1 (de) Lötstation
DE69832034D1 (de) Lötpaste
DE69212691D1 (de) Einpress-Lötkelch
DE29506050U1 (de) Lötpaste
CS112790A2 (en) Soldering paste
KR930002462U (ko) 풀 도포 절단기

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee