DE69431298T2 - Anisotropisch leitende löt-zusammensetzung und verfahren zu deren verwendung - Google Patents
Anisotropisch leitende löt-zusammensetzung und verfahren zu deren verwendungInfo
- Publication number
- DE69431298T2 DE69431298T2 DE69431298T DE69431298T DE69431298T2 DE 69431298 T2 DE69431298 T2 DE 69431298T2 DE 69431298 T DE69431298 T DE 69431298T DE 69431298 T DE69431298 T DE 69431298T DE 69431298 T2 DE69431298 T2 DE 69431298T2
- Authority
- DE
- Germany
- Prior art keywords
- anisotropically conductive
- conductive solder
- solder composition
- manufacturing processes
- solder paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/082,653 US5346558A (en) | 1993-06-28 | 1993-06-28 | Solderable anisotropically conductive composition and method of using same |
PCT/US1994/006934 WO1995000285A1 (en) | 1993-06-28 | 1994-06-14 | Solderable anisotropically conductive composition and method of using same |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69431298D1 DE69431298D1 (de) | 2002-10-10 |
DE69431298T2 true DE69431298T2 (de) | 2003-07-31 |
Family
ID=22172527
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69431298T Expired - Fee Related DE69431298T2 (de) | 1993-06-28 | 1994-06-14 | Anisotropisch leitende löt-zusammensetzung und verfahren zu deren verwendung |
Country Status (8)
Country | Link |
---|---|
US (1) | US5346558A (de) |
EP (1) | EP0707524B1 (de) |
JP (1) | JPH08511732A (de) |
KR (1) | KR100318395B1 (de) |
AT (1) | ATE223277T1 (de) |
CA (1) | CA2165674C (de) |
DE (1) | DE69431298T2 (de) |
WO (1) | WO1995000285A1 (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2158941A1 (en) * | 1994-01-27 | 1995-08-03 | Ciaran Bernard Mcardle | Compositions and methods for providing anisotropic conductive pathways and bonds between two sets of conductors |
JPH08102218A (ja) * | 1994-09-30 | 1996-04-16 | Nec Corp | 異方性導電フィルム |
US5851644A (en) * | 1995-08-01 | 1998-12-22 | Loctite (Ireland) Limited | Films and coatings having anisotropic conductive pathways therein |
US5699613A (en) * | 1995-09-25 | 1997-12-23 | International Business Machines Corporation | Fine dimension stacked vias for a multiple layer circuit board structure |
US5851311A (en) * | 1996-03-29 | 1998-12-22 | Sophia Systems Co., Ltd. | Polymerizable flux composition for encapsulating the solder in situ |
US5916641A (en) * | 1996-08-01 | 1999-06-29 | Loctite (Ireland) Limited | Method of forming a monolayer of particles |
US6977025B2 (en) * | 1996-08-01 | 2005-12-20 | Loctite (R&D) Limited | Method of forming a monolayer of particles having at least two different sizes, and products formed thereby |
ATE309556T1 (de) | 1996-08-01 | 2005-11-15 | Loctite Ireland Ltd | Verfahren zur erzeugung einer monoschicht von teilchen und damit hergestellte produkte |
US6402876B1 (en) | 1997-08-01 | 2002-06-11 | Loctite (R&D) Ireland | Method of forming a monolayer of particles, and products formed thereby |
US5772104A (en) * | 1996-08-26 | 1998-06-30 | Peerless Of America Incorporated | Methods of brazing and preparing articles for brazing, and coating composition for use in such methods |
US6083768A (en) | 1996-09-06 | 2000-07-04 | Micron Technology, Inc. | Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components |
US5928404A (en) * | 1997-03-28 | 1999-07-27 | Ford Motor Company | Electrical solder and method of manufacturing |
US6592943B2 (en) | 1998-12-01 | 2003-07-15 | Fujitsu Limited | Stencil and method for depositing solder |
US6054761A (en) | 1998-12-01 | 2000-04-25 | Fujitsu Limited | Multi-layer circuit substrates and electrical assemblies having conductive composition connectors |
US6805280B2 (en) * | 2002-01-08 | 2004-10-19 | International Business Machines Corporation | Z interconnect structure and method |
US20050056365A1 (en) * | 2003-09-15 | 2005-03-17 | Albert Chan | Thermal interface adhesive |
JP3964911B2 (ja) | 2004-09-03 | 2007-08-22 | 松下電器産業株式会社 | バンプ付き基板の製造方法 |
US7763188B2 (en) * | 2005-03-04 | 2010-07-27 | International Business Machines Corporation | Electrically stable copper filled electrically conductive adhesive |
JP6164416B2 (ja) * | 2013-09-25 | 2017-07-19 | 株式会社スリーボンド | 導電性接着剤組成物 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1131375A (en) * | 1967-05-12 | 1968-10-23 | Standard Telephones Cables Ltd | Copper brazing paste |
DE2142229A1 (de) * | 1971-08-23 | 1973-03-01 | Azerb Gni I Pi | Loetpaste |
ES8104932A1 (es) * | 1979-04-06 | 1981-05-16 | Johnson Matthey Co Ltd | Procedimiento para la obtencion de una composicion para sol-dar. |
US4496475A (en) * | 1980-09-15 | 1985-01-29 | Potters Industries, Inc. | Conductive paste, electroconductive body and fabrication of same |
US4419279A (en) * | 1980-09-15 | 1983-12-06 | Potters Industries, Inc. | Conductive paste, electroconductive body and fabrication of same |
JPS60213396A (ja) * | 1984-04-06 | 1985-10-25 | Tanaka Kikinzoku Kogyo Kk | ペ−ストろう用バインダ− |
US4509994A (en) * | 1984-09-04 | 1985-04-09 | Mcdonnell Douglas Corporation | Solder composition for high-density circuits |
US4619715A (en) * | 1984-09-11 | 1986-10-28 | Scm Corporation | Fusible powdered metal paste |
US4531986A (en) * | 1984-10-15 | 1985-07-30 | Mcdonnell Douglas Corporation | Solder composition |
DE3510000A1 (de) * | 1985-03-20 | 1986-10-02 | Ka We electronic GmbH & Co KG, 4796 Salzkotten | Thermoplastisches loetmittel und verfahren und vorrichtung zu dessen verwendung |
JPS63113073A (ja) * | 1986-05-19 | 1988-05-18 | Harima Chem Inc | 電子回路部材を接着し且つその端子間に選択的に電気的導通を得る方法 |
GB8628916D0 (en) * | 1986-12-03 | 1987-01-07 | Multicore Solders Ltd | Solder composition |
US5001542A (en) * | 1988-12-05 | 1991-03-19 | Hitachi Chemical Company | Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips |
US5043102A (en) * | 1989-11-29 | 1991-08-27 | Advanced Products, Inc. | Conductive adhesive useful for bonding a semiconductor die to a conductive support base |
US5062896A (en) * | 1990-03-30 | 1991-11-05 | International Business Machines Corporation | Solder/polymer composite paste and method |
US5088189A (en) * | 1990-08-31 | 1992-02-18 | Federated Fry Metals | Electronic manufacturing process |
US5136365A (en) * | 1990-09-27 | 1992-08-04 | Motorola, Inc. | Anisotropic conductive adhesive and encapsulant material |
CA2055065A1 (en) * | 1990-11-13 | 1992-05-14 | David Hitz Scheiber | Organic vehicle for electronic composition |
-
1993
- 1993-06-28 US US08/082,653 patent/US5346558A/en not_active Expired - Lifetime
-
1994
- 1994-06-14 AT AT94921329T patent/ATE223277T1/de not_active IP Right Cessation
- 1994-06-14 KR KR1019950705944A patent/KR100318395B1/ko not_active IP Right Cessation
- 1994-06-14 EP EP94921329A patent/EP0707524B1/de not_active Expired - Lifetime
- 1994-06-14 JP JP7503010A patent/JPH08511732A/ja active Pending
- 1994-06-14 WO PCT/US1994/006934 patent/WO1995000285A1/en active IP Right Grant
- 1994-06-14 DE DE69431298T patent/DE69431298T2/de not_active Expired - Fee Related
- 1994-06-14 CA CA002165674A patent/CA2165674C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR100318395B1 (ko) | 2002-04-22 |
WO1995000285A1 (en) | 1995-01-05 |
CA2165674C (en) | 2003-04-08 |
EP0707524A1 (de) | 1996-04-24 |
JPH08511732A (ja) | 1996-12-10 |
US5346558A (en) | 1994-09-13 |
CA2165674A1 (en) | 1995-01-05 |
DE69431298D1 (de) | 2002-10-10 |
EP0707524B1 (de) | 2002-09-04 |
ATE223277T1 (de) | 2002-09-15 |
KR960703362A (ko) | 1996-08-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |