DE69202625D1 - Elektronische Vorrichtung und Verfahren zu ihrer Herstellung. - Google Patents
Elektronische Vorrichtung und Verfahren zu ihrer Herstellung.Info
- Publication number
- DE69202625D1 DE69202625D1 DE69202625T DE69202625T DE69202625D1 DE 69202625 D1 DE69202625 D1 DE 69202625D1 DE 69202625 T DE69202625 T DE 69202625T DE 69202625 T DE69202625 T DE 69202625T DE 69202625 D1 DE69202625 D1 DE 69202625D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- electronic device
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
- B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C2045/14114—Positioning or centering articles in the mould using an adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2069/00—Use of PC, i.e. polycarbonates or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3406—Components, e.g. resistors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09872—Insulating conformal coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1322—Encapsulation comprising more than one layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Casings For Electric Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3151932A JPH053390A (ja) | 1991-06-24 | 1991-06-24 | 電子機器およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69202625D1 true DE69202625D1 (de) | 1995-06-29 |
DE69202625T2 DE69202625T2 (de) | 1996-02-08 |
Family
ID=15529355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69202625T Expired - Fee Related DE69202625T2 (de) | 1991-06-24 | 1992-06-17 | Elektronische Vorrichtung und Verfahren zu ihrer Herstellung. |
Country Status (4)
Country | Link |
---|---|
US (2) | US5329696A (de) |
EP (1) | EP0521343B1 (de) |
JP (1) | JPH053390A (de) |
DE (1) | DE69202625T2 (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3198796B2 (ja) * | 1993-06-25 | 2001-08-13 | 富士電機株式会社 | モールドモジュール |
DE4330713A1 (de) * | 1993-09-10 | 1995-03-16 | Philips Patentverwaltung | Kunststoffbauteil, z. B. Verdrahtungsträger oder Kunststoffgehäuse |
US5754398A (en) * | 1996-05-28 | 1998-05-19 | Ford Motor Company, Inc. | Circuit-carrying automotive component and method of manufacturing the same |
GB2318758A (en) * | 1996-10-31 | 1998-05-06 | Motorola Inc | Metod for applying conductive shielding to a non-conductive part |
US5841686A (en) * | 1996-11-22 | 1998-11-24 | Ma Laboratories, Inc. | Dual-bank memory module with shared capacitors and R-C elements integrated into the module substrate |
US5833903A (en) * | 1996-12-10 | 1998-11-10 | Great American Gumball Corporation | Injection molding encapsulation for an electronic device directly onto a substrate |
FR2760998B1 (fr) | 1997-03-21 | 1999-05-21 | Equisecurite Sa | Procede d'inclusion d'une etiquette electronique dans un objet realise en plastique, au moment de la fabrication de l'objet |
FR2770172B1 (fr) * | 1997-10-24 | 1999-12-10 | Allibert Equipement | Procede de moulage pour realiser une piece en matiere plastique munie sur une surface d'un element rapporte de faible epaisseur, et piece ainsi realisee |
US6828666B1 (en) | 1998-03-21 | 2004-12-07 | Advanced Micro Devices, Inc. | Low inductance power distribution system for an integrated circuit chip |
US5963023A (en) * | 1998-03-21 | 1999-10-05 | Advanced Micro Devices, Inc. | Power surge management for high performance integrated circuit |
DE19822095A1 (de) * | 1998-05-16 | 1999-12-02 | Braun Gmbh | Kunststoffgehäuse, insbesondere für ein elektrisches Zahnreinigungsgerät, einen Rasierapparat o. dgl. |
GB2360972A (en) * | 2000-04-05 | 2001-10-10 | Nokia Mobile Phones Ltd | Portable electronic apparatus with a moulded cover |
DE10131601A1 (de) * | 2001-06-29 | 2003-01-16 | Swoboda Gmbh Geb | Verfahren zur Herstellung von Gehäuseteilen |
FR2840252A1 (fr) * | 2002-05-31 | 2003-12-05 | Knauf Snc | Procede de decoration double face d'un substrat en une matiere plastique transparente ainsi que substrat decore obtenu par la mise en oeuvre de ce procede |
FR2840253B1 (fr) * | 2002-05-31 | 2005-03-11 | Knauf Snc | Procede de decoration d'un substrat en polycarbonate ou materiau similaire ainsi que substrat decore obtenu par la mise en oeuvre de ce procede |
DE10330789A1 (de) * | 2003-07-07 | 2005-02-03 | Carl Freudenberg Kg | Gehäuse für elektrische oder elektronische Vorrichtungen |
JP4222490B2 (ja) * | 2006-09-29 | 2009-02-12 | Tdk株式会社 | プレーナ型トランス及びスイッチング電源 |
JP5098772B2 (ja) * | 2007-06-29 | 2012-12-12 | ダイキン工業株式会社 | 電装品ユニット |
EP2048918A1 (de) * | 2007-10-09 | 2009-04-15 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | Herstellung eines leitfähigen Musters auf einem Kunststoffbauteil |
WO2011129130A1 (ja) * | 2010-04-15 | 2011-10-20 | 古河電気工業株式会社 | 基板および基板の製造方法 |
TWI448231B (zh) * | 2010-12-13 | 2014-08-01 | Quanta Comp Inc | 機殼上製備導電凸肋的方法、具導電凸肋之機殼及電子裝置之組裝方法 |
US20150342069A1 (en) * | 2014-05-20 | 2015-11-26 | Freescale Semiconductor, Inc. | Housing for electronic devices |
DE102014014012B4 (de) * | 2014-09-26 | 2017-09-28 | Paul Voinea | Vorrichtungen und Verfahren zur teilweisen Beschichtung der Oberfläche eines Werkstückes durch Vergießen |
DE102017211296B4 (de) * | 2017-07-04 | 2019-01-31 | Leoni Bordnetz-Systeme Gmbh | Verfahren zur Herstellung von Kunststoff-Metall-Hybrid-Bauteilen sowie Kunststoff-Metall-Hybrid-Bauteil |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3934074A (en) * | 1974-04-22 | 1976-01-20 | Trw Inc. | Ceramic circuit board mounted in housing and method of fabrication thereof |
JPS5867099A (ja) * | 1981-10-19 | 1983-04-21 | 松下電器産業株式会社 | 電気機器 |
JPS60137092A (ja) * | 1983-12-19 | 1985-07-20 | 株式会社東芝 | 回路基板の製造方法 |
US4710419A (en) * | 1984-07-16 | 1987-12-01 | Gregory Vernon C | In-mold process for fabrication of molded plastic printed circuit boards |
US4772496A (en) * | 1985-06-15 | 1988-09-20 | Showa Denko Kabushiki Kaisha | Molded product having printed circuit board |
JPS6380597A (ja) * | 1986-09-25 | 1988-04-11 | 古河電気工業株式会社 | 回路付き射出成形体の製造方法 |
US4843520A (en) * | 1987-02-03 | 1989-06-27 | Matsushita Electric Industrial Co. Ltd. | Electronic circuit module |
JPH0744347B2 (ja) * | 1987-07-02 | 1995-05-15 | 古河電気工業株式会社 | 回路付き樹脂成形体 |
US4811482A (en) * | 1987-08-05 | 1989-03-14 | Moll Kenneth W | Method for producing molded circuit boards |
US4914259A (en) * | 1987-09-08 | 1990-04-03 | The Furukawa Electric Co., Ltd. | Molded circuit board |
JPH0814323B2 (ja) * | 1987-10-27 | 1996-02-14 | 株式会社巴技術研究所 | バタフライ弁 |
JPH01243558A (ja) * | 1988-03-25 | 1989-09-28 | Tokyo Keiki Co Ltd | 回路基板のモールド方法 |
JPH0214194A (ja) * | 1988-06-30 | 1990-01-18 | Nissha Printing Co Ltd | Icカードとその製造方法 |
JP2747096B2 (ja) * | 1990-07-24 | 1998-05-06 | 北川工業株式会社 | 3次元回路基板の製造方法 |
JPH04137698A (ja) * | 1990-09-28 | 1992-05-12 | Toshiba Lighting & Technol Corp | 電気機器用キャビネット |
-
1991
- 1991-06-24 JP JP3151932A patent/JPH053390A/ja active Pending
-
1992
- 1992-06-17 EP EP92110198A patent/EP0521343B1/de not_active Expired - Lifetime
- 1992-06-17 DE DE69202625T patent/DE69202625T2/de not_active Expired - Fee Related
- 1992-06-18 US US07/900,121 patent/US5329696A/en not_active Expired - Lifetime
-
1994
- 1994-01-27 US US08/188,075 patent/US5377079A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH053390A (ja) | 1993-01-08 |
US5329696A (en) | 1994-07-19 |
US5377079A (en) | 1994-12-27 |
DE69202625T2 (de) | 1996-02-08 |
EP0521343B1 (de) | 1995-05-24 |
EP0521343A1 (de) | 1993-01-07 |
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