DE69201734T2 - Halbleiterscheiben-Reinigungsverfahren unter Benutzung eines Mischers und Vorrichtung dafür. - Google Patents
Halbleiterscheiben-Reinigungsverfahren unter Benutzung eines Mischers und Vorrichtung dafür.Info
- Publication number
- DE69201734T2 DE69201734T2 DE69201734T DE69201734T DE69201734T2 DE 69201734 T2 DE69201734 T2 DE 69201734T2 DE 69201734 T DE69201734 T DE 69201734T DE 69201734 T DE69201734 T DE 69201734T DE 69201734 T2 DE69201734 T2 DE 69201734T2
- Authority
- DE
- Germany
- Prior art keywords
- mixer
- cleaning method
- wafer cleaning
- device therefor
- therefor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004140 cleaning Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
- B08B9/027—Cleaning the internal surfaces; Removal of blockages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/005—Details of cleaning machines or methods involving the use or presence of liquid or steam the liquid being ozonated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2680091 | 1991-01-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69201734D1 DE69201734D1 (de) | 1995-04-27 |
DE69201734T2 true DE69201734T2 (de) | 1995-09-21 |
Family
ID=12203390
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69201734T Expired - Fee Related DE69201734T2 (de) | 1991-01-28 | 1992-01-27 | Halbleiterscheiben-Reinigungsverfahren unter Benutzung eines Mischers und Vorrichtung dafür. |
Country Status (4)
Country | Link |
---|---|
US (2) | US5261966A (de) |
EP (1) | EP0497247B1 (de) |
KR (1) | KR960000374B1 (de) |
DE (1) | DE69201734T2 (de) |
Families Citing this family (88)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3261683B2 (ja) * | 1991-05-31 | 2002-03-04 | 忠弘 大見 | 半導体の洗浄方法及び洗浄装置 |
US5417826A (en) * | 1992-06-15 | 1995-05-23 | Micron Technology, Inc. | Removal of carbon-based polymer residues with ozone, useful in the cleaning of plasma reactors |
KR960002763B1 (ko) * | 1992-12-24 | 1996-02-26 | 금성일렉트론주식회사 | 반도체 세정방법 및 세정용액 |
DE4316096C1 (de) * | 1993-05-13 | 1994-11-10 | Wacker Chemitronic | Verfahren zur naßchemischen Behandlung scheibenförmiger Werkstücke |
US5625915A (en) * | 1993-05-14 | 1997-05-06 | Cyclo3Pss Textile Systems, Inc. | Laundry ozone injection system |
US5911837A (en) * | 1993-07-16 | 1999-06-15 | Legacy Systems, Inc. | Process for treatment of semiconductor wafers in a fluid |
US5464480A (en) * | 1993-07-16 | 1995-11-07 | Legacy Systems, Inc. | Process and apparatus for the treatment of semiconductor wafers in a fluid |
JP3142195B2 (ja) * | 1993-07-20 | 2001-03-07 | 大日本スクリーン製造株式会社 | 薬液供給装置 |
JP2586319B2 (ja) * | 1993-12-15 | 1997-02-26 | 日本電気株式会社 | 半導体基板の研磨方法 |
JP2760418B2 (ja) * | 1994-07-29 | 1998-05-28 | 住友シチックス株式会社 | 半導体ウエーハの洗浄液及びこれを用いた半導体ウエーハの洗浄方法 |
JP3575859B2 (ja) * | 1995-03-10 | 2004-10-13 | 株式会社東芝 | 半導体基板の表面処理方法及び表面処理装置 |
EP0731495B1 (de) * | 1995-03-10 | 2000-09-27 | ASTEC Halbleitertechnologie GmbH | Verfahren und Vorrichtung zum Reinigen von Siliziumscheiben |
US6325081B1 (en) * | 1996-07-03 | 2001-12-04 | Kabushiki Kaisha Ultraclean Technology Research Institute | Washing apparatus and washing method |
US6082373A (en) * | 1996-07-05 | 2000-07-04 | Kabushiki Kaisha Toshiba | Cleaning method |
US5922138A (en) * | 1996-08-12 | 1999-07-13 | Tokyo Electron Limited | Liquid treatment method and apparatus |
JP3274389B2 (ja) * | 1996-08-12 | 2002-04-15 | 株式会社東芝 | 半導体基板の洗浄方法 |
US5800626A (en) * | 1997-02-18 | 1998-09-01 | International Business Machines Corporation | Control of gas content in process liquids for improved megasonic cleaning of semiconductor wafers and microelectronics substrates |
JPH10261687A (ja) * | 1997-03-18 | 1998-09-29 | Furontetsuku:Kk | 半導体等製造装置 |
KR100238234B1 (ko) | 1997-03-20 | 2000-01-15 | 윤종용 | 반도체소자용 인-시튜 세정장치 및 그를 이용한 반도체 소자의 세정방법 |
US5876516A (en) * | 1997-03-28 | 1999-03-02 | Norwood Dry Cleaning Unlimited | Method for cleaning window blinds |
US6240933B1 (en) * | 1997-05-09 | 2001-06-05 | Semitool, Inc. | Methods for cleaning semiconductor surfaces |
US6701941B1 (en) | 1997-05-09 | 2004-03-09 | Semitool, Inc. | Method for treating the surface of a workpiece |
US7416611B2 (en) * | 1997-05-09 | 2008-08-26 | Semitool, Inc. | Process and apparatus for treating a workpiece with gases |
US7404863B2 (en) * | 1997-05-09 | 2008-07-29 | Semitool, Inc. | Methods of thinning a silicon wafer using HF and ozone |
US6869487B1 (en) | 1997-05-09 | 2005-03-22 | Semitool, Inc. | Process and apparatus for treating a workpiece such as a semiconductor wafer |
US7163588B2 (en) * | 1997-05-09 | 2007-01-16 | Semitool, Inc. | Processing a workpiece using water, a base, and ozone |
US20050215063A1 (en) * | 1997-05-09 | 2005-09-29 | Bergman Eric J | System and methods for etching a silicon wafer using HF and ozone |
US7378355B2 (en) * | 1997-05-09 | 2008-05-27 | Semitool, Inc. | System and methods for polishing a wafer |
US20050034745A1 (en) * | 1997-05-09 | 2005-02-17 | Semitool, Inc. | Processing a workpiece with ozone and a halogenated additive |
US7264680B2 (en) * | 1997-05-09 | 2007-09-04 | Semitool, Inc. | Process and apparatus for treating a workpiece using ozone |
US20020157686A1 (en) * | 1997-05-09 | 2002-10-31 | Semitool, Inc. | Process and apparatus for treating a workpiece such as a semiconductor wafer |
US5849091A (en) * | 1997-06-02 | 1998-12-15 | Micron Technology, Inc. | Megasonic cleaning methods and apparatus |
US6945257B2 (en) * | 1997-06-23 | 2005-09-20 | Princeton Trade & Technology | Method for cleaning hollow tubing and fibers |
US20040007255A1 (en) * | 1997-06-20 | 2004-01-15 | Labib Mohamed Emam | Apparatus and method for cleaning pipelines, tubing and membranes using two-phase flow |
JP3662111B2 (ja) * | 1997-06-24 | 2005-06-22 | アルプス電気株式会社 | 洗浄液の製造方法およびそのための装置 |
KR100290703B1 (ko) * | 1997-08-26 | 2001-06-01 | 윤종용 | 정량공급조건을갖는반도체웨이퍼세정방법 |
US5807439A (en) * | 1997-09-29 | 1998-09-15 | Siemens Aktiengesellschaft | Apparatus and method for improved washing and drying of semiconductor wafers |
JPH11121417A (ja) * | 1997-10-09 | 1999-04-30 | Mitsubishi Electric Corp | 半導体基板の処理システムおよび処理方法 |
US5971368A (en) | 1997-10-29 | 1999-10-26 | Fsi International, Inc. | System to increase the quantity of dissolved gas in a liquid and to maintain the increased quantity of dissolved gas in the liquid until utilized |
US6273107B1 (en) * | 1997-12-05 | 2001-08-14 | Texas Instruments Incorporated | Positive flow, positive displacement rinse tank |
US6039055A (en) * | 1998-01-08 | 2000-03-21 | International Business Machines Corporation | Wafer cleaning with dissolved gas concentration control |
KR100572295B1 (ko) * | 1998-04-16 | 2006-04-24 | 세미툴 인코포레이티드 | 반도체 웨이퍼와 같은 작업편을 가공하는 공정 및 장치 |
US5979474A (en) * | 1998-05-12 | 1999-11-09 | Sumitomo Sitix Corporation | Cleaning equipment for semiconductor substrates |
DE19825063A1 (de) * | 1998-06-04 | 1999-12-09 | Astex Sorbios Gmbh | Verfahren zur Unterdrückung der Zerfallsgeschwindigkeit von Ozon in ultrareinem Wasser |
US6021791A (en) * | 1998-06-29 | 2000-02-08 | Speedfam-Ipec Corporation | Method and apparatus for immersion cleaning of semiconductor devices |
US6146468A (en) * | 1998-06-29 | 2000-11-14 | Speedfam-Ipec Corporation | Semiconductor wafer treatment |
DE19837041A1 (de) * | 1998-08-14 | 2000-02-24 | Messer Griesheim Gmbh | Erzeugung von gebrauchsfertigen Lösungen |
US6235641B1 (en) | 1998-10-30 | 2001-05-22 | Fsi International Inc. | Method and system to control the concentration of dissolved gas in a liquid |
US6173720B1 (en) * | 1998-12-02 | 2001-01-16 | International Business Machines Corporation | Process for treating a semiconductor substrate |
US6090217A (en) | 1998-12-09 | 2000-07-18 | Kittle; Paul A. | Surface treatment of semiconductor substrates |
US6261845B1 (en) * | 1999-02-25 | 2001-07-17 | Cfmt, Inc. | Methods and systems for determining chemical concentrations and controlling the processing of semiconductor substrates |
US6406551B1 (en) | 1999-05-14 | 2002-06-18 | Fsi International, Inc. | Method for treating a substrate with heat sensitive agents |
EP1481741B1 (de) * | 1999-07-23 | 2010-10-20 | Semitool, Inc. | Verfahren und System zum Behandeln eines Werkstückes wie eines Halbleiterwafers |
JP3875456B2 (ja) * | 2000-06-29 | 2007-01-31 | 株式会社東芝 | 洗浄方法および洗浄装置 |
JP2002316027A (ja) * | 2001-04-19 | 2002-10-29 | Ebara Corp | ガス溶解水製造装置、およびその方法、超音波洗浄装置、およびその方法 |
GB2384185B (en) * | 2001-12-06 | 2003-12-17 | Barrie Mellor | Cleaning process |
US6880191B2 (en) * | 2001-12-31 | 2005-04-19 | Joe G. Bristor | Spray caddy and method of dispensing chemicals |
TW200303581A (en) * | 2002-02-28 | 2003-09-01 | Tech Ltd A | Method and apparatus for cleaning and drying semiconductor wafer |
JP2003266030A (ja) * | 2002-03-15 | 2003-09-24 | Seiko Epson Corp | 被処理物の洗浄方法および装置並びにデバイスの製造方法およびデバイス |
US7799141B2 (en) * | 2003-06-27 | 2010-09-21 | Lam Research Corporation | Method and system for using a two-phases substrate cleaning compound |
US7648584B2 (en) * | 2003-06-27 | 2010-01-19 | Lam Research Corporation | Method and apparatus for removing contamination from substrate |
US7913703B1 (en) | 2003-06-27 | 2011-03-29 | Lam Research Corporation | Method and apparatus for uniformly applying a multi-phase cleaning solution to a substrate |
US7737097B2 (en) * | 2003-06-27 | 2010-06-15 | Lam Research Corporation | Method for removing contamination from a substrate and for making a cleaning solution |
US20040261823A1 (en) * | 2003-06-27 | 2004-12-30 | Lam Research Corporation | Method and apparatus for removing a target layer from a substrate using reactive gases |
US8316866B2 (en) * | 2003-06-27 | 2012-11-27 | Lam Research Corporation | Method and apparatus for cleaning a semiconductor substrate |
US8522801B2 (en) * | 2003-06-27 | 2013-09-03 | Lam Research Corporation | Method and apparatus for cleaning a semiconductor substrate |
US7862662B2 (en) * | 2005-12-30 | 2011-01-04 | Lam Research Corporation | Method and material for cleaning a substrate |
US8522799B2 (en) * | 2005-12-30 | 2013-09-03 | Lam Research Corporation | Apparatus and system for cleaning a substrate |
US7416370B2 (en) * | 2005-06-15 | 2008-08-26 | Lam Research Corporation | Method and apparatus for transporting a substrate using non-Newtonian fluid |
US8323420B2 (en) | 2005-06-30 | 2012-12-04 | Lam Research Corporation | Method for removing material from semiconductor wafer and apparatus for performing the same |
US7568490B2 (en) * | 2003-12-23 | 2009-08-04 | Lam Research Corporation | Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids |
US8043441B2 (en) | 2005-06-15 | 2011-10-25 | Lam Research Corporation | Method and apparatus for cleaning a substrate using non-Newtonian fluids |
US7502114B2 (en) | 2004-03-12 | 2009-03-10 | Mks Instruments, Inc. | Ozone concentration sensor |
US20060074529A1 (en) * | 2004-09-30 | 2006-04-06 | Garcia James P | Apparatus for dispensing precise volumes of fluid |
US20070062372A1 (en) * | 2005-09-20 | 2007-03-22 | Ravi Jain | Method of producing a mixture of ozone and high pressure carbon dioxide |
SG154438A1 (en) * | 2005-12-30 | 2009-08-28 | Lam Res Corp | Cleaning compound and method and system for using the cleaning compound |
US20080148595A1 (en) * | 2006-12-20 | 2008-06-26 | Lam Research Corporation | Method and apparatus for drying substrates using a surface tensions reducing gas |
US7862660B2 (en) | 2007-01-12 | 2011-01-04 | Princeton Trade & Technology, Inc. | Device and method for fluid dynamics cleaning of constrained spaces |
US7897213B2 (en) * | 2007-02-08 | 2011-03-01 | Lam Research Corporation | Methods for contained chemical surface treatment |
US20080245390A1 (en) * | 2007-04-03 | 2008-10-09 | Lam Research Corporation | Method for cleaning semiconductor wafer surfaces by applying periodic shear stress to the cleaning solution |
US8211846B2 (en) | 2007-12-14 | 2012-07-03 | Lam Research Group | Materials for particle removal by single-phase and two-phase media |
US8226774B2 (en) | 2008-09-30 | 2012-07-24 | Princeton Trade & Technology, Inc. | Method for cleaning passageways such an endoscope channels using flow of liquid and gas |
US8114221B2 (en) | 2008-09-30 | 2012-02-14 | Princeton Trade & Technology, Inc. | Method and composition for cleaning tubular systems employing moving three-phase contact lines |
EP2611741A4 (de) * | 2010-09-02 | 2016-10-05 | Fujifilm Planar Solutions Llc | Reinigungsverfahren und -system |
JP2016164977A (ja) * | 2015-02-27 | 2016-09-08 | キヤノン株式会社 | ナノインプリント用液体材料、ナノインプリント用液体材料の製造方法、硬化物パターンの製造方法、光学部品の製造方法、回路基板の製造方法、および電子部品の製造方法 |
WO2018089658A1 (en) * | 2016-11-11 | 2018-05-17 | Mks Instruments, Inc. | Systems and method for generating a conductive liquid comprising deionized water with ammonia gas dissolved therein |
KR20210038980A (ko) | 2018-08-29 | 2021-04-08 | 엠케이에스 인스트루먼츠 인코포레이티드 | 오존수 전달 시스템 및 사용 방법 |
US11691111B2 (en) | 2019-04-08 | 2023-07-04 | Mks Instruments, Inc. | Systems and methods for generating a dissolved ammonia solution with reduced dissolved carrier gas and oxygen content |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3227166A (en) * | 1962-09-12 | 1966-01-04 | Tasope Ltd | Etching machine |
GB1363416A (en) * | 1971-09-03 | 1974-08-14 | Ames Crosta Mills & Co Ltd | Biological filtration apparatus |
US3882027A (en) * | 1972-04-24 | 1975-05-06 | Ici Ltd | Random packing medium |
USB480702I5 (de) * | 1974-06-19 | 1976-01-27 | ||
US4481154A (en) * | 1981-03-20 | 1984-11-06 | Cal Gavin Limited | Insert for placement in a vessel and method of forming the insert |
US4485840A (en) * | 1982-05-03 | 1984-12-04 | Ashland Oil, Inc. | Flushing system for a meter-mix-dispensing device |
US4778532A (en) * | 1985-06-24 | 1988-10-18 | Cfm Technologies Limited Partnership | Process and apparatus for treating wafers with process fluids |
US4552783A (en) * | 1984-11-05 | 1985-11-12 | General Electric Company | Enhancing the selectivity of tungsten deposition on conductor and semiconductor surfaces |
US4673443A (en) * | 1985-03-18 | 1987-06-16 | Motorola, Inc. | Continuous ionizer for semiconductor manufacturing processes |
JPS62213127A (ja) * | 1986-03-13 | 1987-09-19 | Nec Corp | 半導体ウエハ−の洗浄装置 |
JPS6310529A (ja) * | 1986-07-01 | 1988-01-18 | Mitsubishi Electric Corp | 洗浄装置 |
JPH02164035A (ja) * | 1988-12-19 | 1990-06-25 | Nec Corp | 半導体基板の洗浄方法 |
JP2892742B2 (ja) * | 1990-02-08 | 1999-05-17 | 東芝コンポーネンツ株式会社 | メサ型半導体素子の洗浄方法 |
US5089084A (en) * | 1990-12-03 | 1992-02-18 | Micron Technology, Inc. | Hydrofluoric acid etcher and cascade rinser |
-
1992
- 1992-01-24 US US07/825,589 patent/US5261966A/en not_active Expired - Lifetime
- 1992-01-27 KR KR1019920001121A patent/KR960000374B1/ko not_active IP Right Cessation
- 1992-01-27 EP EP92101278A patent/EP0497247B1/de not_active Expired - Lifetime
- 1992-01-27 DE DE69201734T patent/DE69201734T2/de not_active Expired - Fee Related
-
1994
- 1994-06-17 US US08/263,218 patent/US5415191A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5261966A (en) | 1993-11-16 |
US5415191A (en) | 1995-05-16 |
EP0497247B1 (de) | 1995-03-22 |
DE69201734D1 (de) | 1995-04-27 |
KR960000374B1 (ko) | 1996-01-05 |
EP0497247A1 (de) | 1992-08-05 |
KR920015477A (ko) | 1992-08-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |