DE69128370T2 - Verfahren zum Spalten einer spröden Platte sowie Vorrichtung zum Durchführen des Verfahrens - Google Patents

Verfahren zum Spalten einer spröden Platte sowie Vorrichtung zum Durchführen des Verfahrens

Info

Publication number
DE69128370T2
DE69128370T2 DE69128370T DE69128370T DE69128370T2 DE 69128370 T2 DE69128370 T2 DE 69128370T2 DE 69128370 T DE69128370 T DE 69128370T DE 69128370 T DE69128370 T DE 69128370T DE 69128370 T2 DE69128370 T2 DE 69128370T2
Authority
DE
Germany
Prior art keywords
splitting
carrying
brittle plate
brittle
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69128370T
Other languages
English (en)
Other versions
DE69128370D1 (de
Inventor
Maarten Harm Zonneveld
Jacobus Nicolaas Dekker
Gerrit Cornelis Verkade
Ireneus Henricus Theo Fierkens
Theodorus Johannes Van Gennip
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV, Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of DE69128370D1 publication Critical patent/DE69128370D1/de
Application granted granted Critical
Publication of DE69128370T2 publication Critical patent/DE69128370T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Mining & Mineral Resources (AREA)
  • Mathematical Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
DE69128370T 1990-03-21 1991-03-18 Verfahren zum Spalten einer spröden Platte sowie Vorrichtung zum Durchführen des Verfahrens Expired - Fee Related DE69128370T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9000655 1990-03-21

Publications (2)

Publication Number Publication Date
DE69128370D1 DE69128370D1 (de) 1998-01-22
DE69128370T2 true DE69128370T2 (de) 1998-06-04

Family

ID=19856782

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69128370T Expired - Fee Related DE69128370T2 (de) 1990-03-21 1991-03-18 Verfahren zum Spalten einer spröden Platte sowie Vorrichtung zum Durchführen des Verfahrens

Country Status (4)

Country Link
US (1) US5132505A (de)
EP (1) EP0448168B1 (de)
JP (1) JPH04224091A (de)
DE (1) DE69128370T2 (de)

Families Citing this family (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0639572A (ja) * 1991-01-11 1994-02-15 Souei Tsusho Kk ウェハ割断装置
RU2024441C1 (ru) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
DE4214159C1 (de) * 1992-04-30 1993-11-18 Schott Glaswerke Verfahren zum Erzeugen von Bruchspannungen in Glas
DE4305106C2 (de) * 1993-02-19 1995-02-02 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Schneiden eines spröden Körpers mit Laserstrahlung
DE4305107C2 (de) * 1993-02-19 1995-02-23 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Schneiden eines spröden Körpers mit Laserstrahlung
WO1994022778A1 (de) * 1993-04-02 1994-10-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum schneiden von hohlglas
US5387776A (en) * 1993-05-11 1995-02-07 General Electric Company Method of separation of pieces from super hard material by partial laser cut and pressure cleavage
US5581971A (en) * 1994-09-16 1996-12-10 Alumet Manufacturing, Inc. Glass spacer bar for use in multipane window construction and method of making the same
DE4434648A1 (de) * 1994-09-28 1996-04-04 Glaswerke H U Kl Ritzenhoff Gm Verfahren zum Absprengen einer Glaskuppe von einem dünnwandigen geblasenen Glas
IT1284082B1 (it) * 1996-06-27 1998-05-08 Calp Spa Metodo e dispositivo per il taglio mediante un raggio laser di articoli cavi in vetro
KR100218580B1 (ko) * 1996-07-09 1999-09-01 구자홍 고 밀도 대형 액정 표시 장치 제조 방법
MY120533A (en) * 1997-04-14 2005-11-30 Schott Ag Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass.
KR100267711B1 (ko) * 1998-04-06 2000-10-16 노건일 피라미드 미러를 이용한 광폭 레이저 빔 가공장치
US6259058B1 (en) 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
US6420678B1 (en) 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
US6252197B1 (en) 1998-12-01 2001-06-26 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator
KR100553119B1 (ko) * 1999-01-15 2006-02-22 삼성전자주식회사 레이저를 이용한 절단장치
US6327875B1 (en) * 1999-03-09 2001-12-11 Corning Incorporated Control of median crack depth in laser scoring
US6795274B1 (en) 1999-09-07 2004-09-21 Asahi Glass Company, Ltd. Method for manufacturing a substantially circular substrate by utilizing scribing
US6664503B1 (en) 1999-09-07 2003-12-16 Asahi Glass Company, Ltd. Method for manufacturing a magnetic disk
US6489588B1 (en) 1999-11-24 2002-12-03 Applied Photonics, Inc. Method and apparatus for separating non-metallic materials
DE19963939B4 (de) * 1999-12-31 2004-11-04 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material
DE10014788A1 (de) * 2000-03-24 2001-10-11 Schott Spezialglas Gmbh Verfahren zum Herstellen von Displays
AU2001261402A1 (en) * 2000-05-11 2001-11-20 Ptg Precision Technology Center Limited Llc System for cutting brittle materials
JP4659300B2 (ja) 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
KR100561763B1 (ko) * 2000-12-15 2006-03-16 엘체파우 라제르첸트룸 하노버 에.파우. 절단영역을 따라 구성요소위에 열팽창틈새를 발생시켜서 유리, 세라믹, 유리세라믹 등의 구성요소을 절단하기 위한 방법
WO2003010102A1 (en) * 2001-07-25 2003-02-06 Kondratenko Vladimir Stepanovi Cutting method for brittle non-metallic materials (two variants)
TWI326626B (en) 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
EP3664131A3 (de) 2002-03-12 2020-08-19 Hamamatsu Photonics K. K. Substrattrennverfahren
EP2216128B1 (de) 2002-03-12 2016-01-27 Hamamatsu Photonics K.K. Verfahren zum Schneiden eines bearbeiteten Gegenstands
KR100948914B1 (ko) * 2002-11-15 2010-03-24 주식회사 포스코 레이져 용접기의 반사장치
TWI520269B (zh) 2002-12-03 2016-02-01 Hamamatsu Photonics Kk Cutting method of semiconductor substrate
FR2852250B1 (fr) * 2003-03-11 2009-07-24 Jean Luc Jouvin Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau
US8685838B2 (en) * 2003-03-12 2014-04-01 Hamamatsu Photonics K.K. Laser beam machining method
DE10330179A1 (de) * 2003-07-02 2005-01-20 Jenoptik Automatisierungstechnik Gmbh Verfahren zum Trennen flacher Werkstücke aus Keramik
DE102004014277A1 (de) * 2004-03-22 2005-10-20 Fraunhofer Ges Forschung Verfahren zum laserthermischen Trennen von Flachgläsern
DE102004014276A1 (de) * 2004-03-22 2005-10-13 Grenzebach Maschinenbau Gmbh Verfahren zum Laserschneiden von Flachglas
DE102004024475A1 (de) * 2004-05-14 2005-12-01 Lzh Laserzentrum Hannover E.V. Verfahren und Vorrichtung zum Trennen von Halbleitermaterialien
US7820941B2 (en) * 2004-07-30 2010-10-26 Corning Incorporated Process and apparatus for scoring a brittle material
US7723212B2 (en) * 2004-07-30 2010-05-25 Mitsuboshi Diamond Industrial Co., Ltd Method for forming median crack in substrate and apparatus for forming median crack in substrate
US20060021977A1 (en) * 2004-07-30 2006-02-02 Menegus Harry E Process and apparatus for scoring a brittle material incorporating moving optical assembly
WO2006025994A2 (en) * 2004-08-31 2006-03-09 Gyrotron Technology, Inc. A method of separating non-metallic material using microwave radiation
US20080236199A1 (en) * 2005-07-28 2008-10-02 Vladislav Sklyarevich Method of Separating Non-Metallic Material Using Microwave Radiation
DE102006018622B3 (de) * 2005-12-29 2007-08-09 H2B Photonics Gmbh Vorrichtung zum durchtrennenden Bearbeiten von Bauteilen aus sprödbrüchigem Material
CA2560238A1 (en) * 2006-09-20 2008-03-20 Institut National D'optique Laser-based ablation method and optical system
ES2400019T3 (es) * 2007-05-10 2013-04-05 Grenzebach Maschinenbau Gmbh Procedimiento para la separación térmica por láser de placa de material cerámico o de otro material de placa frágil
DE102008007632A1 (de) * 2008-02-04 2009-08-06 Limo Patentverwaltung Gmbh & Co. Kg Verfahren zum Laserschneiden eines nichtmetallischen Werkstücks
JP5345334B2 (ja) * 2008-04-08 2013-11-20 株式会社レミ 脆性材料の熱応力割断方法
US8245540B2 (en) * 2009-02-24 2012-08-21 Corning Incorporated Method for scoring a sheet of brittle material
US8269138B2 (en) 2009-05-21 2012-09-18 Corning Incorporated Method for separating a sheet of brittle material
US8932510B2 (en) * 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8426767B2 (en) * 2009-08-31 2013-04-23 Corning Incorporated Methods for laser scribing and breaking thin glass
US8946590B2 (en) * 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
TW201134596A (en) * 2010-04-15 2011-10-16 Epileds Technologies Inc Laser processing method
US8720228B2 (en) 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
DE102010053712A1 (de) * 2010-12-07 2012-06-21 Etec Gmbh Verfahren zum Zerteilen und/oder Zerkleinern von Siliziumblöcken, Siliziumplatten oder Siliziumstäben
WO2013109328A2 (en) * 2011-10-27 2013-07-25 Applied Materials, Inc. Laser crystallization and polycrystal efficiency improvement for thin film solar
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
US10017411B2 (en) * 2014-11-19 2018-07-10 Corning Incorporated Methods of separating a glass web
JP2018537389A (ja) * 2015-11-25 2018-12-20 コーニング インコーポレイテッド ガラスウェブを分離する方法
US9782906B1 (en) 2015-12-16 2017-10-10 Amazon Technologies, Inc. On demand apparel panel cutting
US10307926B2 (en) 2016-03-14 2019-06-04 Amazon Technologies, Inc. Automated fabric picking
US10820649B2 (en) 2016-03-14 2020-11-03 Amazon Technologies, Inc. Organized assembly instruction printing and referencing
US9895819B1 (en) * 2016-03-14 2018-02-20 Amazon Technologies, Inc. Continuous feed fabric cutting
US9868302B1 (en) 2016-06-20 2018-01-16 Amazon Technologies, Inc. Fluorescent ink printing, cutting, and apparel assembly
US11512016B2 (en) 2017-03-22 2022-11-29 Corning Incorporated Methods of separating a glass web
WO2019065533A1 (ja) * 2017-09-27 2019-04-04 三星ダイヤモンド工業株式会社 ガラス基板の切断装置、切断方法、プログラム、及び記憶媒体
WO2023228617A1 (ja) * 2022-05-27 2023-11-30 日本電気硝子株式会社 ガラス板の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1244346B (de) * 1964-10-19 1967-07-13 Menzel Gerhard Glasbearbeitung Verfahren zum Schneiden von Glas
US3629545A (en) * 1967-12-19 1971-12-21 Western Electric Co Laser substrate parting
GB1246481A (en) * 1968-03-29 1971-09-15 Pilkington Brothers Ltd Improvements in or relating to the cutting of glass
SE403280B (sv) * 1972-10-12 1978-08-07 Glaverbel Sett och anordning att skera av glas- eller glaskristalliniskt material lengs en bestemd linje
AT342232B (de) * 1972-10-12 1978-03-28 Glaverbel Verfahren und vorrichtung zum trennen eines korpers aus einem glasartigen oder vitrokristallinen material
FR2228040B1 (de) * 1973-05-04 1977-04-29 Commissariat Energie Atomique
GB2139613B (en) * 1983-05-13 1987-03-04 Glaverbel Method and apparatus for cutting glass
GB2139614B (en) * 1983-05-13 1987-02-04 Glaverbel Method and apparatus for cutting glass
US4546231A (en) * 1983-11-14 1985-10-08 Group Ii Manufacturing Ltd. Creation of a parting zone in a crystal structure

Also Published As

Publication number Publication date
JPH04224091A (ja) 1992-08-13
DE69128370D1 (de) 1998-01-22
EP0448168A1 (de) 1991-09-25
EP0448168B1 (de) 1997-12-10
US5132505A (en) 1992-07-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N

8339 Ceased/non-payment of the annual fee