DE69119916D1 - Verfahren und Anlage zum Herstellen einer Dünnfilm-Elektroluminescentenvorrichtung - Google Patents

Verfahren und Anlage zum Herstellen einer Dünnfilm-Elektroluminescentenvorrichtung

Info

Publication number
DE69119916D1
DE69119916D1 DE69119916T DE69119916T DE69119916D1 DE 69119916 D1 DE69119916 D1 DE 69119916D1 DE 69119916 T DE69119916 T DE 69119916T DE 69119916 T DE69119916 T DE 69119916T DE 69119916 D1 DE69119916 D1 DE 69119916D1
Authority
DE
Germany
Prior art keywords
plant
manufacturing
thin film
electroluminescent device
film electroluminescent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69119916T
Other languages
English (en)
Other versions
DE69119916T2 (de
Inventor
Koichi Tanaka
Akiyoshi Mikami
Kouji Taniguchi
Katsushi Okibayashi
Kousuke Terada
Takuo Yamashita
Takashi Ogura
Hiroaki Nakaya
Masaru Yoshida
Shigeo Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of DE69119916D1 publication Critical patent/DE69119916D1/de
Application granted granted Critical
Publication of DE69119916T2 publication Critical patent/DE69119916T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45502Flow conditions in reaction chamber
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/305Sulfides, selenides, or tellurides
    • C23C16/306AII BVI compounds, where A is Zn, Cd or Hg and B is S, Se or Te
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45512Premixing before introduction in the reaction chamber
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45559Diffusion of reactive gas to substrate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45582Expansion of gas before it reaches the substrate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
DE69119916T 1990-01-09 1991-01-09 Verfahren und Anlage zum Herstellen einer Dünnfilm-Elektroluminescentenvorrichtung Expired - Fee Related DE69119916T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003190A JPH0793191B2 (ja) 1990-01-09 1990-01-09 薄膜el素子の製造方法

Publications (2)

Publication Number Publication Date
DE69119916D1 true DE69119916D1 (de) 1996-07-11
DE69119916T2 DE69119916T2 (de) 1996-11-28

Family

ID=11550487

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69119916T Expired - Fee Related DE69119916T2 (de) 1990-01-09 1991-01-09 Verfahren und Anlage zum Herstellen einer Dünnfilm-Elektroluminescentenvorrichtung

Country Status (5)

Country Link
US (1) US5147683A (de)
EP (1) EP0437355B1 (de)
JP (1) JPH0793191B2 (de)
DE (1) DE69119916T2 (de)
FI (1) FI101585B1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5300316A (en) * 1991-12-11 1994-04-05 Kabushiki Kaisha Komatsu Seisakusho Method of forming thin oxysulfide film
US6689422B1 (en) * 1994-02-16 2004-02-10 Howmet Research Corporation CVD codeposition of A1 and one or more reactive (gettering) elements to form protective aluminide coating
JP3564737B2 (ja) * 1994-06-24 2004-09-15 株式会社デンソー エレクトロルミネッセンス素子の製造方法および製造装置
US5989733A (en) 1996-07-23 1999-11-23 Howmet Research Corporation Active element modified platinum aluminide diffusion coating and CVD coating method
DE602004015218D1 (de) * 2003-09-17 2008-09-04 Konica Minolta Med & Graphic Strahlungsbildwandler und Verfahren zu seiner Herstellung
CN103289693A (zh) * 2012-02-28 2013-09-11 海洋王照明科技股份有限公司 铈铽共掺杂硼磷酸盐发光材料、制备方法及其应用
CN107604340B (zh) * 2017-08-31 2023-09-01 安徽光智科技有限公司 化学气相沉积炉

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4582720A (en) * 1982-09-20 1986-04-15 Semiconductor Energy Laboratory Co., Ltd. Method and apparatus for forming non-single-crystal layer
US4548159A (en) * 1984-07-06 1985-10-22 Anicon, Inc. Chemical vapor deposition wafer boat
JPH0760738B2 (ja) * 1988-05-13 1995-06-28 シャープ株式会社 エレクトロルミネッセンス発光膜の製造方法

Also Published As

Publication number Publication date
FI101585B (fi) 1998-07-15
EP0437355A1 (de) 1991-07-17
FI910095A0 (fi) 1991-01-08
EP0437355B1 (de) 1996-06-05
JPH0793191B2 (ja) 1995-10-09
DE69119916T2 (de) 1996-11-28
US5147683A (en) 1992-09-15
FI910095A (fi) 1991-07-10
JPH03208298A (ja) 1991-09-11
FI101585B1 (fi) 1998-07-15

Similar Documents

Publication Publication Date Title
DE69133316D1 (de) Verfahren zum Herstellen einer Halbleitervorrichtung
DE69227464T2 (de) Vorrichtung und verfahren zum aufnehmen einer substanz
DE68911621T2 (de) Verfahren zum Herstellen einer Einrichtung.
DE69131586T2 (de) Strahlungsemittierende Halbleiteranordnung und Verfahren zum Herstellen einer derartigen Halbleiteranordnung
DE69030229D1 (de) Verfahren zum Herstellen einer Halbleitervorrichtung
DE69312807T2 (de) Verfahren und Vorrichtung zum Herstellen einer rohrförmigen Zahnstange
DE69028964D1 (de) Verfahren zum Herstellen einer Halbleitervorrichtung
ATE176888T1 (de) Verfahren und vorrichtung zum herstellen einer streckfolie
DE69125425T2 (de) Verfahren zum Herstellen einer supraleitenden Einrichtung aus supraleitendem Material und dadurch hergestellte supraleitende Einrichtung
DE69226887T2 (de) Halbleiteranordnung und Verfahren zum Herstellen einer derartigen Halbleiteranordnung
DE69120975T2 (de) Verfahren zum Herstellen einer Halbleitervorrichtung
DE68918149T2 (de) Vorrichtung und Verfahren zum Herstellen einer Vorrichtung.
DE69506646T2 (de) Verfahren zum Herstellen einer Halbleitereinrichtung
DE68921607D1 (de) Verfahren zum Züchten einer kristallinen halbleitenden Dünnschicht und Vorrichtung dafür.
DE69118313D1 (de) Verfahren und Anlage zur Bildung eines dünnen Films
DE69022710T2 (de) Verfahren zum Herstellen einer Halbleitervorrichtung.
DE68922085D1 (de) Halbleiteranordung und Verfahren zum Herstellen einer Halbleiteranordung.
DE69119916D1 (de) Verfahren und Anlage zum Herstellen einer Dünnfilm-Elektroluminescentenvorrichtung
DE69209408D1 (de) Verfahren und Vorrichtung zum Spritzgiessen einer Formmasse
DE69116592D1 (de) Verfahren zum Herstellen einer Halbleiteranordnung
DE69229288D1 (de) Verfahren zum Herstellen einer Halbleiterspeicheranordnung
DE69116938T2 (de) Verfahren zum Herstellen einer Halbleiteranordnung
DE69215480D1 (de) Verfahren und Vorrichtung zum Halten der Bandspannung in einer Bandkassette
DE69128326T2 (de) Ein Verfahren zum Herstellen einer Halbleiteranordnung
DE69429636T2 (de) Verfahren zum Herstellen einer Halbleiteranordnung

Legal Events

Date Code Title Description
8328 Change in the person/name/address of the agent

Free format text: PATENTANWAELTE MUELLER & HOFFMANN, 81667 MUENCHEN

8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee