DE69118164T2 - Verfahren zum entfernen organischer überzüge - Google Patents
Verfahren zum entfernen organischer überzügeInfo
- Publication number
- DE69118164T2 DE69118164T2 DE69118164T DE69118164T DE69118164T2 DE 69118164 T2 DE69118164 T2 DE 69118164T2 DE 69118164 T DE69118164 T DE 69118164T DE 69118164 T DE69118164 T DE 69118164T DE 69118164 T2 DE69118164 T2 DE 69118164T2
- Authority
- DE
- Germany
- Prior art keywords
- removing organic
- organic coatings
- coatings
- organic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27089890A JP3152430B2 (ja) | 1990-10-09 | 1990-10-09 | 有機物被膜の除去方法 |
PCT/JP1991/001374 WO1992006489A1 (en) | 1990-10-09 | 1991-10-09 | Method of removing organic coating |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69118164D1 DE69118164D1 (de) | 1996-04-25 |
DE69118164T2 true DE69118164T2 (de) | 1996-10-24 |
Family
ID=17492518
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69118164T Expired - Fee Related DE69118164T2 (de) | 1990-10-09 | 1991-10-09 | Verfahren zum entfernen organischer überzüge |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0504431B1 (de) |
JP (1) | JP3152430B2 (de) |
KR (1) | KR100229687B1 (de) |
DE (1) | DE69118164T2 (de) |
WO (1) | WO1992006489A1 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3261683B2 (ja) * | 1991-05-31 | 2002-03-04 | 忠弘 大見 | 半導体の洗浄方法及び洗浄装置 |
US5911837A (en) * | 1993-07-16 | 1999-06-15 | Legacy Systems, Inc. | Process for treatment of semiconductor wafers in a fluid |
US5464480A (en) * | 1993-07-16 | 1995-11-07 | Legacy Systems, Inc. | Process and apparatus for the treatment of semiconductor wafers in a fluid |
US6245155B1 (en) | 1996-09-06 | 2001-06-12 | Arch Specialty Chemicals, Inc. | Method for removing photoresist and plasma etch residues |
US5861064A (en) * | 1997-03-17 | 1999-01-19 | Fsi Int Inc | Process for enhanced photoresist removal in conjunction with various methods and chemistries |
EP0959390A1 (de) * | 1998-05-20 | 1999-11-24 | STMicroelectronics S.r.l. | Verfahren zur Entfernung von Photolack |
JP3862868B2 (ja) * | 1998-08-10 | 2006-12-27 | 沖電気工業株式会社 | 半導体ウエハの洗浄システム |
JP2000147793A (ja) * | 1998-11-12 | 2000-05-26 | Mitsubishi Electric Corp | フォトレジスト膜除去方法およびそのための装置 |
US6790783B1 (en) * | 1999-05-27 | 2004-09-14 | Micron Technology, Inc. | Semiconductor fabrication apparatus |
US6524936B2 (en) | 2000-12-22 | 2003-02-25 | Axcelis Technologies, Inc. | Process for removal of photoresist after post ion implantation |
US6848455B1 (en) | 2002-04-22 | 2005-02-01 | Novellus Systems, Inc. | Method and apparatus for removing photoresist and post-etch residue from semiconductor substrates by in-situ generation of oxidizing species |
KR100412258B1 (ko) * | 2003-07-01 | 2003-12-31 | 주식회사 에스에프에이 | 오존수를 이용한 엘시디기판 세정방법 |
JP3863127B2 (ja) * | 2003-07-08 | 2006-12-27 | 沖電気工業株式会社 | 半導体ウエハの洗浄方法 |
JP2007165842A (ja) | 2005-11-21 | 2007-06-28 | Dainippon Screen Mfg Co Ltd | 基板処理方法及びその装置 |
US9748120B2 (en) | 2013-07-01 | 2017-08-29 | Lam Research Ag | Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus |
US10490426B2 (en) | 2014-08-26 | 2019-11-26 | Lam Research Ag | Method and apparatus for processing wafer-shaped articles |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2326447C2 (de) * | 1973-05-24 | 1986-02-06 | Ibm Deutschland Gmbh, 7000 Stuttgart | Verfahren zum Entfernen von Schichten aus organischem Material und seine Verwendung |
JPS5762530A (en) * | 1980-10-01 | 1982-04-15 | Hitachi Ltd | Method and apparatus for removing photo-resist |
JPS62213127A (ja) * | 1986-03-13 | 1987-09-19 | Nec Corp | 半導体ウエハ−の洗浄装置 |
US4749640A (en) * | 1986-09-02 | 1988-06-07 | Monsanto Company | Integrated circuit manufacturing process |
JPS648630A (en) * | 1986-09-22 | 1989-01-12 | Tokyo Electron Ltd | Cleaning method |
JPS6476726A (en) * | 1987-09-17 | 1989-03-22 | Hitachi Ltd | Manufacture of semiconductor |
JPH0626201B2 (ja) * | 1987-10-15 | 1994-04-06 | 富士通株式会社 | 半導体装置の製造方法 |
DE3818714A1 (de) * | 1988-06-01 | 1989-12-14 | Wacker Chemitronic | Verfahren zur nasschemischen oberflaechenbehandlung von halbleiterscheiben |
-
1990
- 1990-10-09 JP JP27089890A patent/JP3152430B2/ja not_active Expired - Lifetime
-
1991
- 1991-10-09 KR KR1019920701360A patent/KR100229687B1/ko not_active IP Right Cessation
- 1991-10-09 WO PCT/JP1991/001374 patent/WO1992006489A1/ja active IP Right Grant
- 1991-10-09 DE DE69118164T patent/DE69118164T2/de not_active Expired - Fee Related
- 1991-10-09 EP EP91917693A patent/EP0504431B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP3152430B2 (ja) | 2001-04-03 |
JPH04146616A (ja) | 1992-05-20 |
EP0504431A4 (en) | 1993-03-10 |
WO1992006489A1 (en) | 1992-04-16 |
EP0504431A1 (de) | 1992-09-23 |
EP0504431B1 (de) | 1996-03-20 |
DE69118164D1 (de) | 1996-04-25 |
KR100229687B1 (ko) | 1999-11-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: LINDNER BLAUMEIER & KOLLEGEN PATENT- UND RECHTSANW |
|
8339 | Ceased/non-payment of the annual fee |