DE69118164D1 - Verfahren zum entfernen organischer überzüge - Google Patents
Verfahren zum entfernen organischer überzügeInfo
- Publication number
- DE69118164D1 DE69118164D1 DE69118164T DE69118164T DE69118164D1 DE 69118164 D1 DE69118164 D1 DE 69118164D1 DE 69118164 T DE69118164 T DE 69118164T DE 69118164 T DE69118164 T DE 69118164T DE 69118164 D1 DE69118164 D1 DE 69118164D1
- Authority
- DE
- Germany
- Prior art keywords
- removing organic
- organic coatings
- coatings
- organic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27089890A JP3152430B2 (ja) | 1990-10-09 | 1990-10-09 | 有機物被膜の除去方法 |
PCT/JP1991/001374 WO1992006489A1 (en) | 1990-10-09 | 1991-10-09 | Method of removing organic coating |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69118164D1 true DE69118164D1 (de) | 1996-04-25 |
DE69118164T2 DE69118164T2 (de) | 1996-10-24 |
Family
ID=17492518
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69118164T Expired - Fee Related DE69118164T2 (de) | 1990-10-09 | 1991-10-09 | Verfahren zum entfernen organischer überzüge |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0504431B1 (de) |
JP (1) | JP3152430B2 (de) |
KR (1) | KR100229687B1 (de) |
DE (1) | DE69118164T2 (de) |
WO (1) | WO1992006489A1 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3261683B2 (ja) * | 1991-05-31 | 2002-03-04 | 忠弘 大見 | 半導体の洗浄方法及び洗浄装置 |
US5464480A (en) * | 1993-07-16 | 1995-11-07 | Legacy Systems, Inc. | Process and apparatus for the treatment of semiconductor wafers in a fluid |
US5911837A (en) * | 1993-07-16 | 1999-06-15 | Legacy Systems, Inc. | Process for treatment of semiconductor wafers in a fluid |
US6245155B1 (en) | 1996-09-06 | 2001-06-12 | Arch Specialty Chemicals, Inc. | Method for removing photoresist and plasma etch residues |
US5861064A (en) * | 1997-03-17 | 1999-01-19 | Fsi Int Inc | Process for enhanced photoresist removal in conjunction with various methods and chemistries |
EP0959390A1 (de) * | 1998-05-20 | 1999-11-24 | STMicroelectronics S.r.l. | Verfahren zur Entfernung von Photolack |
JP3862868B2 (ja) * | 1998-08-10 | 2006-12-27 | 沖電気工業株式会社 | 半導体ウエハの洗浄システム |
JP2000147793A (ja) * | 1998-11-12 | 2000-05-26 | Mitsubishi Electric Corp | フォトレジスト膜除去方法およびそのための装置 |
US6790783B1 (en) * | 1999-05-27 | 2004-09-14 | Micron Technology, Inc. | Semiconductor fabrication apparatus |
US6524936B2 (en) | 2000-12-22 | 2003-02-25 | Axcelis Technologies, Inc. | Process for removal of photoresist after post ion implantation |
US6848455B1 (en) | 2002-04-22 | 2005-02-01 | Novellus Systems, Inc. | Method and apparatus for removing photoresist and post-etch residue from semiconductor substrates by in-situ generation of oxidizing species |
KR100412258B1 (ko) * | 2003-07-01 | 2003-12-31 | 주식회사 에스에프에이 | 오존수를 이용한 엘시디기판 세정방법 |
JP3863127B2 (ja) * | 2003-07-08 | 2006-12-27 | 沖電気工業株式会社 | 半導体ウエハの洗浄方法 |
JP2007165842A (ja) | 2005-11-21 | 2007-06-28 | Dainippon Screen Mfg Co Ltd | 基板処理方法及びその装置 |
US9748120B2 (en) | 2013-07-01 | 2017-08-29 | Lam Research Ag | Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus |
US10490426B2 (en) | 2014-08-26 | 2019-11-26 | Lam Research Ag | Method and apparatus for processing wafer-shaped articles |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2326447C2 (de) * | 1973-05-24 | 1986-02-06 | Ibm Deutschland Gmbh, 7000 Stuttgart | Verfahren zum Entfernen von Schichten aus organischem Material und seine Verwendung |
JPS5762530A (en) * | 1980-10-01 | 1982-04-15 | Hitachi Ltd | Method and apparatus for removing photo-resist |
JPS62213127A (ja) * | 1986-03-13 | 1987-09-19 | Nec Corp | 半導体ウエハ−の洗浄装置 |
US4749640A (en) * | 1986-09-02 | 1988-06-07 | Monsanto Company | Integrated circuit manufacturing process |
JPS648630A (en) * | 1986-09-22 | 1989-01-12 | Tokyo Electron Ltd | Cleaning method |
JPS6476726A (en) * | 1987-09-17 | 1989-03-22 | Hitachi Ltd | Manufacture of semiconductor |
JPH0626201B2 (ja) * | 1987-10-15 | 1994-04-06 | 富士通株式会社 | 半導体装置の製造方法 |
DE3818714A1 (de) * | 1988-06-01 | 1989-12-14 | Wacker Chemitronic | Verfahren zur nasschemischen oberflaechenbehandlung von halbleiterscheiben |
-
1990
- 1990-10-09 JP JP27089890A patent/JP3152430B2/ja not_active Expired - Lifetime
-
1991
- 1991-10-09 EP EP91917693A patent/EP0504431B1/de not_active Expired - Lifetime
- 1991-10-09 DE DE69118164T patent/DE69118164T2/de not_active Expired - Fee Related
- 1991-10-09 WO PCT/JP1991/001374 patent/WO1992006489A1/ja active IP Right Grant
- 1991-10-09 KR KR1019920701360A patent/KR100229687B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP3152430B2 (ja) | 2001-04-03 |
EP0504431A4 (en) | 1993-03-10 |
DE69118164T2 (de) | 1996-10-24 |
WO1992006489A1 (en) | 1992-04-16 |
EP0504431B1 (de) | 1996-03-20 |
EP0504431A1 (de) | 1992-09-23 |
KR100229687B1 (ko) | 1999-11-15 |
JPH04146616A (ja) | 1992-05-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: LINDNER BLAUMEIER & KOLLEGEN PATENT- UND RECHTSANW |
|
8339 | Ceased/non-payment of the annual fee |