DE69117868D1 - Zerstäubungstarget und dessen herstellung - Google Patents
Zerstäubungstarget und dessen herstellungInfo
- Publication number
- DE69117868D1 DE69117868D1 DE69117868T DE69117868T DE69117868D1 DE 69117868 D1 DE69117868 D1 DE 69117868D1 DE 69117868 T DE69117868 T DE 69117868T DE 69117868 T DE69117868 T DE 69117868T DE 69117868 D1 DE69117868 D1 DE 69117868D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- spraying target
- spraying
- target
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/58085—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/58085—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicides
- C04B35/58092—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicides based on refractory metal silicides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/64—Burning or sintering processes
- C04B35/645—Pressure sintering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S75/00—Specialized metallurgical processes, compositions for use therein, consolidated metal powder compositions, and loose metal particulate mixtures
- Y10S75/95—Consolidated metal powder compositions of >95% theoretical density, e.g. wrought
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12305490 | 1990-05-15 | ||
PCT/JP1991/000639 WO1991018125A1 (en) | 1990-05-15 | 1991-05-15 | Sputtering target and production thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69117868D1 true DE69117868D1 (de) | 1996-04-18 |
DE69117868T2 DE69117868T2 (de) | 1996-07-25 |
Family
ID=14851063
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69117868T Expired - Lifetime DE69117868T2 (de) | 1990-05-15 | 1991-05-15 | Zerstäubungstarget und dessen herstellung |
Country Status (4)
Country | Link |
---|---|
US (3) | US5409517A (de) |
EP (1) | EP0483375B1 (de) |
DE (1) | DE69117868T2 (de) |
WO (1) | WO1991018125A1 (de) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5409517A (en) * | 1990-05-15 | 1995-04-25 | Kabushiki Kaisha Toshiba | Sputtering target and method of manufacturing the same |
JPH05214523A (ja) * | 1992-02-05 | 1993-08-24 | Toshiba Corp | スパッタリングターゲットおよびその製造方法 |
US5464520A (en) * | 1993-03-19 | 1995-11-07 | Japan Energy Corporation | Silicide targets for sputtering and method of manufacturing the same |
JP2794382B2 (ja) * | 1993-05-07 | 1998-09-03 | 株式会社ジャパンエナジー | スパッタリング用シリサイドターゲット及びその製造方法 |
EP0666336B1 (de) * | 1993-07-27 | 2001-10-17 | Kabushiki Kaisha Toshiba | Verfahren zur herstellung eines hochschmelzenden metallischen silizidtargets |
JP3755559B2 (ja) * | 1997-04-15 | 2006-03-15 | 株式会社日鉱マテリアルズ | スパッタリングターゲット |
EP1021265A4 (de) * | 1997-07-11 | 2003-08-27 | Johnson Matthey Elect Inc | Sputtering targets aus intermetallischen aluminiden und siliziden, sowie herstellungsverfahren dafür |
US6258719B1 (en) | 1998-07-01 | 2001-07-10 | Honeywell International Inc. | Intermetallic aluminides and silicides articles, such as sputtering targets, and methods of making same |
US6569270B2 (en) | 1997-07-11 | 2003-05-27 | Honeywell International Inc. | Process for producing a metal article |
JP2003535969A (ja) | 1997-07-11 | 2003-12-02 | ジョンソン マッティー エレクトロニクス インコーポレイテッド | 金属間アルミニド及びシリサイドスパッタリングターゲット、及びその製造方法 |
US6713391B2 (en) | 1997-07-11 | 2004-03-30 | Honeywell International Inc. | Physical vapor deposition targets |
EP1028824B1 (de) * | 1997-07-15 | 2002-10-09 | Tosoh Smd, Inc. | Feuerfeste metall-silizid-legierung sputter-targets, dessen verwendung und herstellung |
US6423196B1 (en) | 1997-11-19 | 2002-07-23 | Tosoh Smd, Inc. | Method of making Ni-Si magnetron sputtering targets and targets made thereby |
US6348139B1 (en) | 1998-06-17 | 2002-02-19 | Honeywell International Inc. | Tantalum-comprising articles |
US6183686B1 (en) | 1998-08-04 | 2001-02-06 | Tosoh Smd, Inc. | Sputter target assembly having a metal-matrix-composite backing plate and methods of making same |
JP3820787B2 (ja) * | 1999-01-08 | 2006-09-13 | 日鉱金属株式会社 | スパッタリングターゲットおよびその製造方法 |
US6042777A (en) * | 1999-08-03 | 2000-03-28 | Sony Corporation | Manufacturing of high density intermetallic sputter targets |
US6878250B1 (en) * | 1999-12-16 | 2005-04-12 | Honeywell International Inc. | Sputtering targets formed from cast materials |
US20040072009A1 (en) * | 1999-12-16 | 2004-04-15 | Segal Vladimir M. | Copper sputtering targets and methods of forming copper sputtering targets |
US6331233B1 (en) | 2000-02-02 | 2001-12-18 | Honeywell International Inc. | Tantalum sputtering target with fine grains and uniform texture and method of manufacture |
US7517417B2 (en) * | 2000-02-02 | 2009-04-14 | Honeywell International Inc. | Tantalum PVD component producing methods |
US6803235B1 (en) * | 2000-06-15 | 2004-10-12 | Honeywell International Inc. | Methods of generating information about materials present in compositions and about particulates present in fluids utilizing a microscope |
US7153468B2 (en) * | 2000-08-18 | 2006-12-26 | Honeywell International Inc. | Physical vapor deposition targets and methods of formation |
US6682636B2 (en) * | 2000-08-18 | 2004-01-27 | Honeywell International Inc. | Physical vapor deposition targets and methods of formation |
US6454994B1 (en) * | 2000-08-28 | 2002-09-24 | Honeywell International Inc. | Solids comprising tantalum, strontium and silicon |
JP4596379B2 (ja) * | 2001-07-09 | 2010-12-08 | Jx日鉱日石金属株式会社 | ゲート酸化膜形成用ハフニウムシリサイドターゲット |
JP3995082B2 (ja) * | 2001-07-18 | 2007-10-24 | 日鉱金属株式会社 | ゲート酸化膜形成用ハフニウムシリサイドターゲット及びその製造方法 |
US6666901B1 (en) * | 2001-11-08 | 2003-12-23 | Technology Assessment & Transfer, Inc. | Thermal shock resistant quasicrystalline alloy target |
US7041200B2 (en) * | 2002-04-19 | 2006-05-09 | Applied Materials, Inc. | Reducing particle generation during sputter deposition |
JP4160557B2 (ja) * | 2002-08-06 | 2008-10-01 | 日鉱金属株式会社 | ハフニウムシリサイドターゲット |
KR20050118313A (ko) * | 2003-05-02 | 2005-12-16 | 토소우 에스엠디, 인크 | 실리콘 함량이 낮은 Ni-Si 스퍼터링 타깃의 제조방법및 당해 방법으로 제조한 타깃 |
JP2005167006A (ja) * | 2003-12-03 | 2005-06-23 | Shin Etsu Chem Co Ltd | フレキシブル金属箔ポリイミド基板の製造方法 |
EP1694275A2 (de) * | 2003-12-18 | 2006-08-30 | AFG Industries, Inc. | Schutzschicht für optische beschichtungen mit verbesserter korrosions- und kratzfestigkeit |
FR2881757B1 (fr) * | 2005-02-08 | 2007-03-30 | Saint Gobain | Procede d'elaboration par projection thermique d'une cible a base de silicium et de zirconium |
MX2007014164A (es) * | 2005-05-12 | 2008-02-25 | Agc Flat Glass North America | Recubrimiento de baja emisividad con bajo coeficiente de ganancia de calor solar, propiedades quimicas y mecanicas mejoradas y metodo para fabricar el mismo. |
JP4826882B2 (ja) * | 2005-05-18 | 2011-11-30 | 株式会社 アイアイエスマテリアル | スクラップシリコンの選別及び分析方法 |
US20070099332A1 (en) * | 2005-07-07 | 2007-05-03 | Honeywell International Inc. | Chalcogenide PVD components and methods of formation |
US20070084527A1 (en) * | 2005-10-19 | 2007-04-19 | Stephane Ferrasse | High-strength mechanical and structural components, and methods of making high-strength components |
US20070251818A1 (en) * | 2006-05-01 | 2007-11-01 | Wuwen Yi | Copper physical vapor deposition targets and methods of making copper physical vapor deposition targets |
US20080112878A1 (en) * | 2006-11-09 | 2008-05-15 | Honeywell International Inc. | Alloy casting apparatuses and chalcogenide compound synthesis methods |
US7901781B2 (en) * | 2007-11-23 | 2011-03-08 | Agc Flat Glass North America, Inc. | Low emissivity coating with low solar heat gain coefficient, enhanced chemical and mechanical properties and method of making the same |
JP5387613B2 (ja) * | 2010-09-03 | 2014-01-15 | 株式会社豊田中央研究所 | 遷移金属シリサイド−Si複合粉末及びその製造方法、並びに、遷移金属シリサイド−Si複合粉末製造用CaSiy系粉末及びその製造方法 |
SG11201404314WA (en) * | 2012-02-22 | 2014-10-30 | Jx Nippon Mining & Metals Corp | Magnetic material sputtering target and manufacturing method for same |
AT15050U1 (de) * | 2015-12-18 | 2016-11-15 | Plansee Composite Mat Gmbh | Beschichtungsquelle mit Strukturierung |
JP6768575B2 (ja) | 2017-03-24 | 2020-10-14 | Jx金属株式会社 | タングステンシリサイドターゲット及びその製造方法 |
KR20220157951A (ko) * | 2020-03-26 | 2022-11-29 | 도소 가부시키가이샤 | Cr-Si 계 소결체, 스퍼터링 타깃, 및 박막의 제조 방법 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2878113A (en) * | 1958-04-17 | 1959-03-17 | Du Pont | Fe-si-ti composition or product and process of preparing same |
US3285017A (en) * | 1963-05-27 | 1966-11-15 | Monsanto Co | Two-phase thermoelectric body comprising a silicon-germanium matrix |
US3361560A (en) * | 1966-04-19 | 1968-01-02 | Du Pont | Nickel silicon and refractory metal alloy |
US3883314A (en) * | 1970-06-29 | 1975-05-13 | Omega Brandt & Freres Sa Louis | Self-lubrication bearing member |
CA1064736A (en) * | 1975-06-11 | 1979-10-23 | Robert D. Sturdevant | Strontium-bearing master composition for aluminum casting alloys |
US4135286A (en) * | 1977-12-22 | 1979-01-23 | United Technologies Corporation | Sputtering target fabrication method |
US4364100A (en) * | 1980-04-24 | 1982-12-14 | International Business Machines Corporation | Multi-layered metallized silicon matrix substrate |
JPS6066425A (ja) * | 1983-09-22 | 1985-04-16 | Nippon Telegr & Teleph Corp <Ntt> | Lsi電極用の高純度モリブデンタ−ゲツトならびに高純度モリブデンシリサイドタ−ゲツトおよびその製造方法 |
US4558017A (en) * | 1984-05-14 | 1985-12-10 | Allied Corporation | Light induced production of ultrafine powders comprising metal silicide powder and silicon |
US4619697A (en) * | 1984-08-30 | 1986-10-28 | Mitsubishi Kinzoku Kabushiki Kaisha | Sputtering target material and process for producing the same |
JPS61179534A (ja) * | 1985-01-16 | 1986-08-12 | Mitsubishi Metal Corp | スパツタリング装置用複合タ−ゲツト |
US4750932A (en) * | 1985-04-15 | 1988-06-14 | Gte Products Corporation | Refractory metal silicide sputtering target |
US4664120A (en) * | 1986-01-22 | 1987-05-12 | Cordis Corporation | Adjustable isodiametric atrial-ventricular pervenous lead |
JPS63179061A (ja) * | 1987-01-19 | 1988-07-23 | Nippon Mining Co Ltd | 高融点金属シリサイドタ−ゲツトとその製造方法 |
JPH0791636B2 (ja) * | 1987-03-09 | 1995-10-04 | 日立金属株式会社 | スパツタリングタ−ゲツトおよびその製造方法 |
JP2594794B2 (ja) * | 1987-08-06 | 1997-03-26 | 株式会社ジャパンエナジー | シリサイドターゲットとその製造方法 |
US4941920A (en) * | 1987-11-25 | 1990-07-17 | Hitachi Metals, Ltd. | Sintered target member and method of producing same |
JPH0610345B2 (ja) * | 1987-12-18 | 1994-02-09 | 東京エレクトロン株式会社 | スパッタリング装置 |
EP0388565B1 (de) * | 1988-02-11 | 1996-06-05 | STMicroelectronics, Inc. | Schwerschmelzende Metallsilicid-Verkapselung, zum Schutz mehrlagiger Policide |
JPH01249619A (ja) * | 1988-03-30 | 1989-10-04 | Toshiba Corp | 高融点金属シリサイドターゲットの製造方法 |
JP2587872B2 (ja) * | 1988-12-19 | 1997-03-05 | 住友金属鉱山株式会社 | Fe―Si合金軟質磁性焼結体の製造方法 |
JPH0390319A (ja) * | 1989-09-01 | 1991-04-16 | Sogo Shika Iryo Kenkyusho:Kk | 可視光重合型レジンの連続硬化方法及び装置 |
US5409517A (en) * | 1990-05-15 | 1995-04-25 | Kabushiki Kaisha Toshiba | Sputtering target and method of manufacturing the same |
-
1991
- 1991-05-15 US US07/793,384 patent/US5409517A/en not_active Expired - Lifetime
- 1991-05-15 DE DE69117868T patent/DE69117868T2/de not_active Expired - Lifetime
- 1991-05-15 WO PCT/JP1991/000639 patent/WO1991018125A1/ja active IP Right Grant
- 1991-05-15 EP EP91909140A patent/EP0483375B1/de not_active Expired - Lifetime
-
1994
- 1994-11-21 US US08/345,405 patent/US5508000A/en not_active Expired - Lifetime
-
1995
- 1995-08-09 US US08/512,911 patent/US5612571A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
WO1991018125A1 (en) | 1991-11-28 |
EP0483375B1 (de) | 1996-03-13 |
EP0483375A1 (de) | 1992-05-06 |
EP0483375A4 (en) | 1992-08-12 |
US5409517A (en) | 1995-04-25 |
US5612571A (en) | 1997-03-18 |
DE69117868T2 (de) | 1996-07-25 |
US5508000A (en) | 1996-04-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: KRAMER - BARSKE - SCHMIDTCHEN, 81245 MUENCHEN |