DE69032970T2 - Halbleiterchippackungen und Module bestehend aus Stapeln derartiger Packungen - Google Patents

Halbleiterchippackungen und Module bestehend aus Stapeln derartiger Packungen

Info

Publication number
DE69032970T2
DE69032970T2 DE69032970T DE69032970T DE69032970T2 DE 69032970 T2 DE69032970 T2 DE 69032970T2 DE 69032970 T DE69032970 T DE 69032970T DE 69032970 T DE69032970 T DE 69032970T DE 69032970 T2 DE69032970 T2 DE 69032970T2
Authority
DE
Germany
Prior art keywords
packages
stacks
semiconductor chip
modules consisting
chip packages
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69032970T
Other languages
English (en)
Other versions
DE69032970D1 (de
Inventor
Elwyn Paul Michael Wakefield
Christopher Paul Hulme Walker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Ltd Great Britain
Original Assignee
SGS Thomson Microelectronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGS Thomson Microelectronics Ltd filed Critical SGS Thomson Microelectronics Ltd
Publication of DE69032970D1 publication Critical patent/DE69032970D1/de
Application granted granted Critical
Publication of DE69032970T2 publication Critical patent/DE69032970T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1029—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being a lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE69032970T 1989-12-01 1990-11-06 Halbleiterchippackungen und Module bestehend aus Stapeln derartiger Packungen Expired - Fee Related DE69032970T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB898927164A GB8927164D0 (en) 1989-12-01 1989-12-01 Semiconductor chip packages

Publications (2)

Publication Number Publication Date
DE69032970D1 DE69032970D1 (de) 1999-04-08
DE69032970T2 true DE69032970T2 (de) 2000-03-09

Family

ID=10667248

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69032970T Expired - Fee Related DE69032970T2 (de) 1989-12-01 1990-11-06 Halbleiterchippackungen und Module bestehend aus Stapeln derartiger Packungen

Country Status (5)

Country Link
US (2) US5165067A (de)
EP (1) EP0430458B1 (de)
JP (1) JP2859429B2 (de)
DE (1) DE69032970T2 (de)
GB (1) GB8927164D0 (de)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5155067A (en) * 1991-03-26 1992-10-13 Micron Technology, Inc. Packaging for a semiconductor die
DE4232268A1 (de) * 1992-09-25 1994-03-31 Siemens Ag Oberflächenmontierbarer Baustein, insbesondere für Koppelelemente und hohe Datenraten
JPH06310558A (ja) * 1993-04-20 1994-11-04 Sanyo Electric Co Ltd Ｉｃチップ
JP3299342B2 (ja) * 1993-06-11 2002-07-08 株式会社日立製作所 半導体メモリモジュール
JPH07147386A (ja) * 1993-09-29 1995-06-06 Toshiba Micro Electron Kk 半導体装置とその製造方法およびそれに用いる器具
US5502621A (en) * 1994-03-31 1996-03-26 Hewlett-Packard Company Mirrored pin assignment for two sided multi-chip layout
JP2888755B2 (ja) * 1994-04-28 1999-05-10 株式会社メガチップス 半導体装置
US5434745A (en) * 1994-07-26 1995-07-18 White Microelectronics Div. Of Bowmar Instrument Corp. Stacked silicon die carrier assembly
TW359023B (en) * 1996-04-20 1999-05-21 Winbond Electronics Corp Device for improvement of static discharge protection in ICs
US6246122B1 (en) 1996-07-09 2001-06-12 Winbond Electronics Corp. Electrostatic discharge protective schemes for integrated circuit packages
US5805520A (en) * 1997-04-25 1998-09-08 Hewlett-Packard Company Integrated circuit address reconfigurability
TW357450B (en) * 1997-10-22 1999-05-01 Windbond Electronics Corp Pin structure for enhanced IC electro-static discharge protection
US6509632B1 (en) * 1998-01-30 2003-01-21 Micron Technology, Inc. Method of fabricating a redundant pinout configuration for signal enhancement in an IC package
JP3035534B2 (ja) * 1998-07-23 2000-04-24 敬 錫 姜 積層パッケ―ジ及びその積層方法
US6093029A (en) * 1998-09-08 2000-07-25 S3 Incorporated Vertically stackable integrated circuit
KR100318257B1 (ko) * 1998-11-07 2002-04-22 박종섭 인쇄회로기판및그의신호배선방법
JP3575001B2 (ja) * 1999-05-07 2004-10-06 アムコー テクノロジー コリア インコーポレーティド 半導体パッケージ及びその製造方法
USRE40112E1 (en) 1999-05-20 2008-02-26 Amkor Technology, Inc. Semiconductor package and method for fabricating the same
JP3398721B2 (ja) 1999-05-20 2003-04-21 アムコー テクノロジー コリア インコーポレーティド 半導体パッケージ及びその製造方法
JP2001077301A (ja) * 1999-08-24 2001-03-23 Amkor Technology Korea Inc 半導体パッケージ及びその製造方法
KR20010064907A (ko) * 1999-12-20 2001-07-11 마이클 디. 오브라이언 와이어본딩 방법 및 이를 이용한 반도체패키지
US6414396B1 (en) 2000-01-24 2002-07-02 Amkor Technology, Inc. Package for stacked integrated circuits
KR100559664B1 (ko) 2000-03-25 2006-03-10 앰코 테크놀로지 코리아 주식회사 반도체패키지
US6452278B1 (en) 2000-06-30 2002-09-17 Amkor Technology, Inc. Low profile package for plural semiconductor dies
KR100699810B1 (ko) * 2000-08-05 2007-03-27 삼성전자주식회사 버스 효율을 향상시키는 반도체 메모리장치 및 메모리시스템
US6552416B1 (en) 2000-09-08 2003-04-22 Amkor Technology, Inc. Multiple die lead frame package with enhanced die-to-die interconnect routing using internal lead trace wiring
US7205036B2 (en) 2000-11-13 2007-04-17 Henkel Kommanditgesellschaft Auf Aktien Anti-telescoping adhesive tape product
US20040225766A1 (en) * 2001-01-25 2004-11-11 Ellison Ryan Scott Functional pathway configuration at a system/IC interface
US20030033576A1 (en) * 2001-05-25 2003-02-13 Mark Palmer Functional pathway configuration at a system/IC interface
JP3623762B2 (ja) * 2001-08-20 2005-02-23 エルピーダメモリ株式会社 半導体装置
US20050156322A1 (en) * 2001-08-31 2005-07-21 Smith Lee J. Thin semiconductor package including stacked dies
US20040021483A1 (en) * 2001-09-28 2004-02-05 Brian Boles Functional pathway configuration at a system/IC interface
KR100458869B1 (ko) * 2002-04-17 2004-12-03 삼성전자주식회사 부착 방향이 자유로운 반도체 칩 패키지
JP2004296853A (ja) 2003-03-27 2004-10-21 Seiko Epson Corp 半導体チップ、半導体装置及びその製造方法、回路基板並びに電子機器
US7098541B2 (en) * 2003-05-19 2006-08-29 Hewlett-Packard Development Company, L.P. Interconnect method for directly connected stacked integrated circuits
US8222721B2 (en) * 2003-09-15 2012-07-17 Silicon Laboratories Inc. Integrated circuit suitable for use in radio receivers
US20050285248A1 (en) * 2004-06-29 2005-12-29 Sun-Teck See Method and system for expanding flash storage device capacity
US8324725B2 (en) * 2004-09-27 2012-12-04 Formfactor, Inc. Stacked die module
US7364945B2 (en) 2005-03-31 2008-04-29 Stats Chippac Ltd. Method of mounting an integrated circuit package in an encapsulant cavity
TWI442520B (zh) * 2005-03-31 2014-06-21 Stats Chippac Ltd 具有晶片尺寸型封裝及第二基底及在上側與下側包含暴露基底表面之半導體組件
US7354800B2 (en) 2005-04-29 2008-04-08 Stats Chippac Ltd. Method of fabricating a stacked integrated circuit package system
US7394148B2 (en) 2005-06-20 2008-07-01 Stats Chippac Ltd. Module having stacked chip scale semiconductor packages
US7456088B2 (en) 2006-01-04 2008-11-25 Stats Chippac Ltd. Integrated circuit package system including stacked die
US7768125B2 (en) 2006-01-04 2010-08-03 Stats Chippac Ltd. Multi-chip package system
US7750482B2 (en) 2006-02-09 2010-07-06 Stats Chippac Ltd. Integrated circuit package system including zero fillet resin
KR101340512B1 (ko) * 2006-12-01 2013-12-12 삼성디스플레이 주식회사 반도체 칩 패키지 및 이를 포함하는 인쇄 회로 기판어셈블리
US9466545B1 (en) 2007-02-21 2016-10-11 Amkor Technology, Inc. Semiconductor package in package
KR100795027B1 (ko) * 2007-03-12 2008-01-16 주식회사 하이닉스반도체 반도체 집적 회로 및 이를 포함하는 반도체 패키지 모듈
KR101557273B1 (ko) 2009-03-17 2015-10-05 삼성전자주식회사 반도체 패키지
KR101660430B1 (ko) * 2009-08-14 2016-09-27 삼성전자 주식회사 반도체 패키지
TWI539565B (zh) * 2014-01-29 2016-06-21 森富科技股份有限公司 記憶體與記憶體球位焊墊之佈局方法
KR101626935B1 (ko) * 2014-02-28 2016-06-02 (주)하이디어 솔루션즈 돌보미 업무 검증 방법 및 보호 관리 시스템

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6034054A (ja) * 1983-08-04 1985-02-21 Nec Corp メモリｉｃモジユ−ル
KR890004820B1 (ko) * 1984-03-28 1989-11-27 인터내셔널 비지네스 머신즈 코포레이션 배저장밀도의 메모리 모듈 및 보드와 그 형성방법
US4632293A (en) * 1985-09-03 1986-12-30 Feinstein Dov Y Method of upgrading memory boards
JPS6318654A (ja) * 1986-07-11 1988-01-26 Hitachi Micro Comput Eng Ltd 電子装置
JP2515755B2 (ja) * 1986-09-26 1996-07-10 株式会社日立製作所 半導体装置
US4868712A (en) * 1987-02-04 1989-09-19 Woodman John K Three dimensional integrated circuit package
JPH0810746B2 (ja) * 1987-02-19 1996-01-31 日本電気株式会社 メモリーモジュール
JP2513724B2 (ja) * 1987-09-18 1996-07-03 日立マクセル株式会社 半導体装置用キヤリアテ―プ
US5016138A (en) * 1987-10-27 1991-05-14 Woodman John K Three dimensional integrated circuit package
US4979016A (en) * 1988-05-16 1990-12-18 Dallas Semiconductor Corporation Split lead package
US4972253A (en) * 1988-06-27 1990-11-20 Digital Equipment Corporation Programmable ceramic high performance custom package
EP0351581A1 (de) * 1988-07-22 1990-01-24 Oerlikon-Contraves AG Hochintegrierte Schaltung sowie Verfahren zu deren Herstellung
US4956694A (en) * 1988-11-04 1990-09-11 Dense-Pac Microsystems, Inc. Integrated circuit chip stacking
US4907128A (en) * 1988-12-15 1990-03-06 Grumman Aerospace Corporation Chip to multilevel circuit board bonding
US4953060A (en) * 1989-05-05 1990-08-28 Ncr Corporation Stackable integrated circuit chip package with improved heat removal

Also Published As

Publication number Publication date
EP0430458A3 (en) 1992-06-03
EP0430458A2 (de) 1991-06-05
GB8927164D0 (en) 1990-01-31
DE69032970D1 (de) 1999-04-08
JPH03181163A (ja) 1991-08-07
EP0430458B1 (de) 1999-03-03
JP2859429B2 (ja) 1999-02-17
US5512783A (en) 1996-04-30
US5165067A (en) 1992-11-17

Similar Documents

Publication Publication Date Title
DE69032970D1 (de) Halbleiterchippackungen und Module bestehend aus Stapeln derartiger Packungen
DE69118602D1 (de) Halbleitervorrichtung bestehend aus mehreren LED-Chips
DE69226398D1 (de) Halbleiterchip-Verpackung
EP0522563A3 (en) Semiconductor chip module and method of manufacturing the same
DE69033909D1 (de) Packung von Halbleiterchips
KR900010986A (ko) 회로접속 구성물 및 그것을 이용한 접속방법 및 반도체 칩의 접속구조
DE19882885T1 (de) Testsystem mit mechanischer Ausrichtung für halbleiterchipgroße Verpackungen und Chips
DE69223692T2 (de) Trägerfolie für gedruckte Schaltung und Halbleiterchip
KR880702041A (ko) 회로 패키지 접착 장치 및 방법
DE69522151T2 (de) Eingeschlossenes integriertes plastikvergossenes Mehr-Chip-Modul-Substrat und dessen Herstellungsverfahren
KR860005438A (ko) 반도체칩과 기판과의 접합구조가 개선된 반도체장치
EP0528291A3 (en) Semiconductor chip module and method for manufacturing the same
DE59307626D1 (de) Kontaktierung und Verkapselung von integrierten Schaltungsmodulen
DE69034109D1 (de) Halbleiter-IC-Vorrichtung und deren Herstellungsverfahren
GB9419271D0 (en) Semiconductor module and ic package used for the semiconductor module
KR900012355A (ko) 반도체장치 패키지
KR900014991U (ko) 반도체 패키지(package)
DE3856168T2 (de) Halbleiterchippackung
BR8400122A (pt) Modulo semicondutor e embalagem de semicondutor aperfeicoada
EP0523387A3 (en) Semiconductor chip module and method for manufacturing the same
DE69209387D1 (de) Versiegelte Flip-Chip-Halbleiteranordnung
DE9218450U1 (de) Halbleitervorrichtung aus einem Halbleiterchip und einem Systemträger
EP0375777A4 (en) Semiconductor packaging module and heat-conducting block structure used therefor
KR900012324A (ko) 반도체 칩 이송 및 선별장치
KR930016251U (ko) 메모리 모듈용 반도체 집적회로 패키지 구조

Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication of lapse of patent is to be deleted
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee