DE69032711T2 - Gegossener gegenstand zum halten von waffeln - Google Patents
Gegossener gegenstand zum halten von waffelnInfo
- Publication number
- DE69032711T2 DE69032711T2 DE69032711T DE69032711T DE69032711T2 DE 69032711 T2 DE69032711 T2 DE 69032711T2 DE 69032711 T DE69032711 T DE 69032711T DE 69032711 T DE69032711 T DE 69032711T DE 69032711 T2 DE69032711 T2 DE 69032711T2
- Authority
- DE
- Germany
- Prior art keywords
- waffles
- hold
- molded object
- molded
- hold waffles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/902—High modulus filament or fiber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9265—Special properties
- Y10S428/931—Components of differing electric conductivity
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/131—Glass, ceramic, or sintered, fused, fired, or calcined metal oxide or metal carbide containing [e.g., porcelain, brick, cement, etc.]
- Y10T428/1314—Contains fabric, fiber particle, or filament made of glass, ceramic, or sintered, fused, fired, or calcined metal oxide, or metal carbide or other inorganic compound [e.g., fiber glass, mineral fiber, sand, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
- Y10T428/1372—Randomly noninterengaged or randomly contacting fibers, filaments, particles, or flakes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1176795A JP2816864B2 (ja) | 1989-07-07 | 1989-07-07 | 搬送用ウエーハバスケット及び収納ケース |
PCT/JP1990/000863 WO1991001044A1 (en) | 1989-07-07 | 1990-07-04 | Molded article for holding wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69032711D1 DE69032711D1 (de) | 1998-11-26 |
DE69032711T2 true DE69032711T2 (de) | 1999-03-11 |
Family
ID=16019978
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69032711T Expired - Fee Related DE69032711T2 (de) | 1989-07-07 | 1990-07-04 | Gegossener gegenstand zum halten von waffeln |
Country Status (6)
Country | Link |
---|---|
US (1) | US5240753A (de) |
EP (1) | EP0436030B1 (de) |
JP (1) | JP2816864B2 (de) |
DE (1) | DE69032711T2 (de) |
HK (1) | HK1007930A1 (de) |
WO (1) | WO1991001044A1 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5593916A (en) * | 1988-08-12 | 1997-01-14 | Mitsui Toatsu Chemicals, Incorporated | Processing of glass substrates using holding container and holding container |
KR930003300A (ko) * | 1991-07-23 | 1993-02-24 | 스탠 게이어 | 다이아몬드가 피복된 캐리어 |
JPH0758192A (ja) * | 1993-08-12 | 1995-03-03 | Nikon Corp | 基板収納ケース |
JP3723982B2 (ja) * | 1994-11-04 | 2005-12-07 | ダイキン工業株式会社 | 含フッ素溶融樹脂組成物を用いた動的シール材料 |
JP3016344B2 (ja) * | 1994-12-19 | 2000-03-06 | 三菱電機株式会社 | 開閉器 |
DE69526126T2 (de) | 1995-10-13 | 2002-11-07 | Empak Inc | 300 mm behälter mit mikroumgebung und seitentür und erdungsleitung |
EP0957514A4 (de) * | 1996-03-29 | 2006-10-04 | Tokyo Electron Ltd | Instrument und montage-ausrüstung angewndet im reinraum |
US5709065A (en) * | 1996-07-31 | 1998-01-20 | Empak, Inc. | Desiccant substrate package |
TW392200B (en) * | 1997-03-25 | 2000-06-01 | Taisei Corp | Electronic and electrical components and substrate treatment devices used in a clean room |
KR100576758B1 (ko) * | 1997-11-28 | 2006-05-03 | 가부시키가이샤 에바라 세이사꾸쇼 | 반도체기판용 반송박스 |
US6428729B1 (en) * | 1998-05-28 | 2002-08-06 | Entegris, Inc. | Composite substrate carrier |
JP3046010B2 (ja) * | 1998-11-12 | 2000-05-29 | 沖電気工業株式会社 | 収納容器および収納方法 |
US6578893B2 (en) | 2000-10-02 | 2003-06-17 | Ajs Automation, Inc. | Apparatus and methods for handling semiconductor wafers |
EP1429380A4 (de) * | 2001-08-28 | 2009-07-15 | Zeon Corp | Behälter für ein präzisionssubstrat |
CN100374358C (zh) * | 2001-11-27 | 2008-03-12 | 诚实公司 | 通过门形成接地线路的前开口式晶片容器 |
JP2006506278A (ja) * | 2002-09-03 | 2006-02-23 | エンテグリス・インコーポレーテッド | 電子機器処理アプリケーションで使用するための高温高強度着色可能材料 |
US20070026171A1 (en) * | 2002-09-03 | 2007-02-01 | Extrand Charles W | High temperature, high strength, colorable materials for use with electronics processing applications |
US6988620B2 (en) * | 2002-09-06 | 2006-01-24 | E.Pak International, Inc. | Container with an adjustable inside dimension that restricts movement of items within the container |
US6926937B2 (en) * | 2002-09-11 | 2005-08-09 | Entegris, Inc. | Matrix tray with tacky surfaces |
US7108899B2 (en) * | 2002-09-11 | 2006-09-19 | Entegris, Inc. | Chip tray with tacky surface |
JP2006507994A (ja) * | 2002-10-09 | 2006-03-09 | エンテグリス・インコーポレーテッド | デバイス処理システム用の高温高強度の着色可能な材料 |
WO2004041678A1 (ja) * | 2002-11-06 | 2004-05-21 | Fuji Bakelite Co., Ltd. | クリーンルーム用容器 |
JP4584023B2 (ja) * | 2005-05-17 | 2010-11-17 | 信越ポリマー株式会社 | 基板収納容器及びその製造方法 |
JP5043021B2 (ja) * | 2005-10-04 | 2012-10-10 | アプライド マテリアルズ インコーポレイテッド | 基板を乾燥するための方法及び装置 |
US20090162183A1 (en) * | 2007-12-19 | 2009-06-25 | Peter Davison | Full-contact ring for a large wafer |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4404615A (en) * | 1981-12-14 | 1983-09-13 | United Plastics, Corp. | Anti-static container for electronic components |
JPS58168638A (ja) * | 1982-03-31 | 1983-10-05 | Japan Synthetic Rubber Co Ltd | 高モジユラスジエン系ゴム組成物 |
JPS5949256A (ja) * | 1982-09-14 | 1984-03-21 | Otsuka Chem Co Ltd | メツキ用ポリオキシメチレン樹脂組成物及び該組成物に対するメツキ方法 |
JPS6033852B2 (ja) * | 1983-07-18 | 1985-08-05 | 三菱瓦斯化学株式会社 | 成形用ポリアミド樹脂組成物 |
JPS5959256A (ja) * | 1983-08-29 | 1984-04-05 | 第一電子技術開発株式会社 | シユレツダ−機構 |
JPS6096649A (ja) * | 1983-10-31 | 1985-05-30 | Otsuka Chem Co Ltd | 摺動部材用樹脂組成物 |
JPS60106807A (ja) * | 1983-11-15 | 1985-06-12 | Mitsui Petrochem Ind Ltd | 超高分子量エチレン系ポリオレフイン粉末 |
JPS60124848A (ja) * | 1983-12-08 | 1985-07-03 | Hitachi Chem Co Ltd | 半導体類のパッケ−ジ構造 |
JPS6112099A (ja) * | 1984-06-26 | 1986-01-20 | 倉敷紡績株式会社 | 半導体製造用治具 |
JPS61207465A (ja) * | 1985-03-11 | 1986-09-13 | Otsuka Chem Co Ltd | 導電性熱可塑性樹脂組成物 |
JPH07118217B2 (ja) * | 1986-09-29 | 1995-12-18 | 大塚化学株式会社 | 導電性組成物 |
JPS6461087A (en) * | 1987-09-01 | 1989-03-08 | Sumitomo Chemical Co | Resin composition for printed wiring board |
US4754880A (en) * | 1987-10-01 | 1988-07-05 | Ncr Corporation | Surface mount electronic device package |
JPH0762101B2 (ja) * | 1987-12-22 | 1995-07-05 | トヨタ自動車株式会社 | ポリプロピレン樹脂組成物 |
US4815596A (en) * | 1988-02-04 | 1989-03-28 | Minnesota Mining And Manufacturing Company | Dip carrier |
JPH0216120A (ja) * | 1988-07-05 | 1990-01-19 | Polyplastics Co | 溶融時に光学的異方性を示すポリエステル樹脂及び樹脂組成物 |
US4881642A (en) * | 1988-12-08 | 1989-11-21 | Adam William D | Electrostatic charge dissipator and method of making |
-
1989
- 1989-07-07 JP JP1176795A patent/JP2816864B2/ja not_active Expired - Lifetime
-
1990
- 1990-07-04 US US07/655,352 patent/US5240753A/en not_active Expired - Lifetime
- 1990-07-04 WO PCT/JP1990/000863 patent/WO1991001044A1/ja active IP Right Grant
- 1990-07-04 DE DE69032711T patent/DE69032711T2/de not_active Expired - Fee Related
- 1990-07-04 EP EP90910186A patent/EP0436030B1/de not_active Expired - Lifetime
-
1998
- 1998-07-07 HK HK98108914A patent/HK1007930A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
HK1007930A1 (en) | 1999-04-30 |
WO1991001044A1 (en) | 1991-01-24 |
DE69032711D1 (de) | 1998-11-26 |
US5240753A (en) | 1993-08-31 |
EP0436030A1 (de) | 1991-07-10 |
EP0436030A4 (en) | 1992-08-12 |
EP0436030B1 (de) | 1998-10-21 |
JP2816864B2 (ja) | 1998-10-27 |
JPH0341747A (ja) | 1991-02-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |