HK1007930A1 - Molded article for holding wafer - Google Patents

Molded article for holding wafer

Info

Publication number
HK1007930A1
HK1007930A1 HK98108914A HK98108914A HK1007930A1 HK 1007930 A1 HK1007930 A1 HK 1007930A1 HK 98108914 A HK98108914 A HK 98108914A HK 98108914 A HK98108914 A HK 98108914A HK 1007930 A1 HK1007930 A1 HK 1007930A1
Authority
HK
Hong Kong
Prior art keywords
molded article
holding wafer
wafer
holding
molded
Prior art date
Application number
HK98108914A
Other languages
English (en)
Inventor
Akira Tabuchi
Morihiko Nakamura
Original Assignee
Otsuka Kagaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Otsuka Kagaku Kk filed Critical Otsuka Kagaku Kk
Publication of HK1007930A1 publication Critical patent/HK1007930A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/902—High modulus filament or fiber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/931—Components of differing electric conductivity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/131—Glass, ceramic, or sintered, fused, fired, or calcined metal oxide or metal carbide containing [e.g., porcelain, brick, cement, etc.]
    • Y10T428/1314—Contains fabric, fiber particle, or filament made of glass, ceramic, or sintered, fused, fired, or calcined metal oxide, or metal carbide or other inorganic compound [e.g., fiber glass, mineral fiber, sand, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
    • Y10T428/1372—Randomly noninterengaged or randomly contacting fibers, filaments, particles, or flakes
HK98108914A 1989-07-07 1998-07-07 Molded article for holding wafer HK1007930A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1176795A JP2816864B2 (ja) 1989-07-07 1989-07-07 搬送用ウエーハバスケット及び収納ケース
PCT/JP1990/000863 WO1991001044A1 (en) 1989-07-07 1990-07-04 Molded article for holding wafer

Publications (1)

Publication Number Publication Date
HK1007930A1 true HK1007930A1 (en) 1999-04-30

Family

ID=16019978

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98108914A HK1007930A1 (en) 1989-07-07 1998-07-07 Molded article for holding wafer

Country Status (6)

Country Link
US (1) US5240753A (xx)
EP (1) EP0436030B1 (xx)
JP (1) JP2816864B2 (xx)
DE (1) DE69032711T2 (xx)
HK (1) HK1007930A1 (xx)
WO (1) WO1991001044A1 (xx)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5593916A (en) * 1988-08-12 1997-01-14 Mitsui Toatsu Chemicals, Incorporated Processing of glass substrates using holding container and holding container
KR930003300A (ko) * 1991-07-23 1993-02-24 스탠 게이어 다이아몬드가 피복된 캐리어
JPH0758192A (ja) * 1993-08-12 1995-03-03 Nikon Corp 基板収納ケース
WO1996014359A1 (fr) * 1994-11-04 1996-05-17 Daikin Industries, Ltd. Composition de fluororesine fondue
JP3016344B2 (ja) * 1994-12-19 2000-03-06 三菱電機株式会社 開閉器
USRE38221E1 (en) * 1995-10-13 2003-08-19 Entegris, Inc. 300 mm microenvironment pod with door on side
EP0957514A4 (en) * 1996-03-29 2006-10-04 Tokyo Electron Ltd INSTRUMENT USED IN A WHITE ROOM AND MOUNTING EQUIPMENT
US5709065A (en) * 1996-07-31 1998-01-20 Empak, Inc. Desiccant substrate package
TW392200B (en) * 1997-03-25 2000-06-01 Taisei Corp Electronic and electrical components and substrate treatment devices used in a clean room
WO1999028966A1 (fr) * 1997-11-28 1999-06-10 Ebara Corporation Boite de transfert d'une tranche en semi-conducteur
US6428729B1 (en) * 1998-05-28 2002-08-06 Entegris, Inc. Composite substrate carrier
JP3046010B2 (ja) * 1998-11-12 2000-05-29 沖電気工業株式会社 収納容器および収納方法
US6578893B2 (en) 2000-10-02 2003-06-17 Ajs Automation, Inc. Apparatus and methods for handling semiconductor wafers
WO2003021665A1 (fr) 2001-08-28 2003-03-13 Zeon Corporation Contenant destine a un substrat de precision
KR100927923B1 (ko) * 2001-11-27 2009-11-19 엔테그리스, 아이엔씨. 도어에 의해 구현되는 접지 경로를 포함하는 전방 개방웨이퍼 캐리어
US20070026171A1 (en) * 2002-09-03 2007-02-01 Extrand Charles W High temperature, high strength, colorable materials for use with electronics processing applications
CN1694803A (zh) * 2002-09-03 2005-11-09 诚实公司 用于电子加工应用的高温、高强度、可着色的材料
US6988620B2 (en) * 2002-09-06 2006-01-24 E.Pak International, Inc. Container with an adjustable inside dimension that restricts movement of items within the container
US7108899B2 (en) * 2002-09-11 2006-09-19 Entegris, Inc. Chip tray with tacky surface
US6926937B2 (en) * 2002-09-11 2005-08-09 Entegris, Inc. Matrix tray with tacky surfaces
WO2004033103A2 (en) * 2002-10-09 2004-04-22 Entegris, Inc. High temperature, high strength, colorable materials for device processing systems
CN1319824C (zh) * 2002-11-06 2007-06-06 富士塑料股份有限公司 净室用容器及其制造方法
JP4584023B2 (ja) * 2005-05-17 2010-11-17 信越ポリマー株式会社 基板収納容器及びその製造方法
US8635784B2 (en) * 2005-10-04 2014-01-28 Applied Materials, Inc. Methods and apparatus for drying a substrate
US20090162183A1 (en) * 2007-12-19 2009-06-25 Peter Davison Full-contact ring for a large wafer

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4404615A (en) * 1981-12-14 1983-09-13 United Plastics, Corp. Anti-static container for electronic components
JPS58168638A (ja) * 1982-03-31 1983-10-05 Japan Synthetic Rubber Co Ltd 高モジユラスジエン系ゴム組成物
JPS5949256A (ja) * 1982-09-14 1984-03-21 Otsuka Chem Co Ltd メツキ用ポリオキシメチレン樹脂組成物及び該組成物に対するメツキ方法
JPS6033852B2 (ja) * 1983-07-18 1985-08-05 三菱瓦斯化学株式会社 成形用ポリアミド樹脂組成物
JPS5959256A (ja) * 1983-08-29 1984-04-05 第一電子技術開発株式会社 シユレツダ−機構
JPS6096649A (ja) * 1983-10-31 1985-05-30 Otsuka Chem Co Ltd 摺動部材用樹脂組成物
JPS60106807A (ja) * 1983-11-15 1985-06-12 Mitsui Petrochem Ind Ltd 超高分子量エチレン系ポリオレフイン粉末
JPS60124848A (ja) * 1983-12-08 1985-07-03 Hitachi Chem Co Ltd 半導体類のパッケ−ジ構造
JPS6112099A (ja) * 1984-06-26 1986-01-20 倉敷紡績株式会社 半導体製造用治具
JPS61207465A (ja) * 1985-03-11 1986-09-13 Otsuka Chem Co Ltd 導電性熱可塑性樹脂組成物
JPH07118217B2 (ja) * 1986-09-29 1995-12-18 大塚化学株式会社 導電性組成物
JPS6461087A (en) * 1987-09-01 1989-03-08 Sumitomo Chemical Co Resin composition for printed wiring board
US4754880A (en) * 1987-10-01 1988-07-05 Ncr Corporation Surface mount electronic device package
JPH0762101B2 (ja) * 1987-12-22 1995-07-05 トヨタ自動車株式会社 ポリプロピレン樹脂組成物
US4815596A (en) * 1988-02-04 1989-03-28 Minnesota Mining And Manufacturing Company Dip carrier
JPH0216120A (ja) * 1988-07-05 1990-01-19 Polyplastics Co 溶融時に光学的異方性を示すポリエステル樹脂及び樹脂組成物
US4881642A (en) * 1988-12-08 1989-11-21 Adam William D Electrostatic charge dissipator and method of making

Also Published As

Publication number Publication date
US5240753A (en) 1993-08-31
EP0436030B1 (en) 1998-10-21
DE69032711T2 (de) 1999-03-11
WO1991001044A1 (en) 1991-01-24
JPH0341747A (ja) 1991-02-22
EP0436030A1 (en) 1991-07-10
JP2816864B2 (ja) 1998-10-27
EP0436030A4 (en) 1992-08-12
DE69032711D1 (de) 1998-11-26

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20050704