DE69022775D1 - Dünne Kupferfolie für eine gedruckte Schaltungsplatte sowie Verfahren zu ihrer Herstellung. - Google Patents

Dünne Kupferfolie für eine gedruckte Schaltungsplatte sowie Verfahren zu ihrer Herstellung.

Info

Publication number
DE69022775D1
DE69022775D1 DE69022775T DE69022775T DE69022775D1 DE 69022775 D1 DE69022775 D1 DE 69022775D1 DE 69022775 T DE69022775 T DE 69022775T DE 69022775 T DE69022775 T DE 69022775T DE 69022775 D1 DE69022775 D1 DE 69022775D1
Authority
DE
Germany
Prior art keywords
manufacture
circuit board
printed circuit
copper foil
thin copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69022775T
Other languages
English (en)
Other versions
DE69022775T2 (de
Inventor
Toshiyuki Kajiwara
Yoshinori Tanii
Kazuhiko Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fukuda Metal Foil and Powder Co Ltd
Original Assignee
Fukuda Metal Foil and Powder Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fukuda Metal Foil and Powder Co Ltd filed Critical Fukuda Metal Foil and Powder Co Ltd
Application granted granted Critical
Publication of DE69022775D1 publication Critical patent/DE69022775D1/de
Publication of DE69022775T2 publication Critical patent/DE69022775T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DE69022775T 1989-05-17 1990-05-17 Dünne Kupferfolie für eine gedruckte Schaltungsplatte sowie Verfahren zu ihrer Herstellung. Expired - Fee Related DE69022775T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP12349689 1989-05-17
JP1265680A JPH0818401B2 (ja) 1989-05-17 1989-10-12 複合箔とその製法

Publications (2)

Publication Number Publication Date
DE69022775D1 true DE69022775D1 (de) 1995-11-09
DE69022775T2 DE69022775T2 (de) 1996-03-14

Family

ID=26460406

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69022775T Expired - Fee Related DE69022775T2 (de) 1989-05-17 1990-05-17 Dünne Kupferfolie für eine gedruckte Schaltungsplatte sowie Verfahren zu ihrer Herstellung.

Country Status (4)

Country Link
US (1) US5114543A (de)
EP (1) EP0398721B1 (de)
JP (1) JPH0818401B2 (de)
DE (1) DE69022775T2 (de)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW317575B (de) * 1994-01-21 1997-10-11 Olin Corp
US5681662A (en) * 1995-09-15 1997-10-28 Olin Corporation Copper alloy foils for flexible circuits
US5780172A (en) * 1995-12-18 1998-07-14 Olin Corporation Tin coated electrical connector
US5916695A (en) * 1995-12-18 1999-06-29 Olin Corporation Tin coated electrical connector
US6117300A (en) * 1996-05-01 2000-09-12 Honeywell International Inc. Method for forming conductive traces and printed circuits made thereby
US6083633A (en) * 1997-06-16 2000-07-04 Olin Corporation Multi-layer diffusion barrier for a tin coated electrical connector
DE69930909T2 (de) * 1998-10-19 2007-05-03 Mitsui Mining & Smelting Co., Ltd. Neue Verbundfolie, Verfahren zu deren Herstellung und Kupferkaschiertes Laminat
SG101924A1 (en) 1998-10-19 2004-02-27 Mitsui Mining & Smelting Co Composite material used in making printed wiring boards
JP3142259B2 (ja) 1998-11-30 2001-03-07 三井金属鉱業株式会社 耐薬品性および耐熱性に優れたプリント配線板用銅箔およびその製造方法
US6579568B2 (en) 1999-11-29 2003-06-17 Mitsui Mining & Smelting Co., Ltd. Copper foil for printed wiring board having excellent chemical resistance and heat resistance
EP1133220B1 (de) * 2000-03-10 2011-05-11 GBC Metals, LLC Kupferfolie mit Niedrigprofil-Adhäsionsverbesserung
US6346335B1 (en) 2000-03-10 2002-02-12 Olin Corporation Copper foil composite including a release layer
US6569543B2 (en) 2001-02-15 2003-05-27 Olin Corporation Copper foil with low profile bond enahncement
JP2002026475A (ja) * 2000-07-07 2002-01-25 Mitsui Mining & Smelting Co Ltd キャリア箔付銅箔回路及びそれを用いたプリント配線板の製造方法並びにプリント配線板
US6447929B1 (en) 2000-08-29 2002-09-10 Gould Electronics Inc. Thin copper on usable carrier and method of forming same
US7026059B2 (en) 2000-09-22 2006-04-11 Circuit Foil Japan Co., Ltd. Copper foil for high-density ultrafine printed wiring boad
US6893742B2 (en) 2001-02-15 2005-05-17 Olin Corporation Copper foil with low profile bond enhancement
JP2002292788A (ja) * 2001-03-30 2002-10-09 Nippon Denkai Kk 複合銅箔及び該複合銅箔の製造方法
US6759142B2 (en) 2001-07-31 2004-07-06 Kobe Steel Ltd. Plated copper alloy material and process for production thereof
US6770976B2 (en) 2002-02-13 2004-08-03 Nikko Materials Usa, Inc. Process for manufacturing copper foil on a metal carrier substrate
US6946205B2 (en) * 2002-04-25 2005-09-20 Matsushita Electric Industrial Co., Ltd. Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same
JP2003347149A (ja) * 2002-05-23 2003-12-05 Nitto Denko Corp 金属転写シート、金属転写シートの製造方法およびセラミックコンデンサの製造方法
JP2004090488A (ja) * 2002-08-30 2004-03-25 Panac Co Ltd 金属層転写シート
JP2004169181A (ja) * 2002-10-31 2004-06-17 Furukawa Techno Research Kk キャリア付き極薄銅箔、及びその製造方法、キャリア付き極薄銅箔を用いたプリント配線基板
TW200420208A (en) * 2002-10-31 2004-10-01 Furukawa Circuit Foil Ultra-thin copper foil with carrier, method of production of the same, and printed circuit board using ultra-thin copper foil with carrier
JP3977790B2 (ja) * 2003-09-01 2007-09-19 古河サーキットフォイル株式会社 キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板
US7132158B2 (en) * 2003-10-22 2006-11-07 Olin Corporation Support layer for thin copper foil
US20050158574A1 (en) * 2003-11-11 2005-07-21 Furukawa Circuit Foil Co., Ltd. Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier
JP2006240074A (ja) * 2005-03-03 2006-09-14 Nippon Denkai Kk 複合銅箔およびその製造方法
KR100941219B1 (ko) * 2005-03-31 2010-02-10 미쓰이 긴조꾸 고교 가부시키가이샤 전해 동박, 그 전해 동박을 이용하여 얻어진 표면 처리 전해 동박, 그 표면 처리 전해 동박을 이용한 동장 적층판 및 프린트 배선판
US7976956B2 (en) * 2005-08-01 2011-07-12 Furukawa Circuit Foil., Ltd. Laminated circuit board
US20070098910A1 (en) * 2005-10-14 2007-05-03 Mitsui Mining & Smelting Co., Ltd. Flexible copper clad laminate, flexible printed wiring board obtained by using flexible copper clad laminate thereof, film carrier tape obtained by using flexible copper clad laminate thereof, semiconductor device obtained by using flexible copper clad laminate thereof, method of manufacturing flexible copper clad laminate and method of manufacturing film carrier tape
KR20070044774A (ko) * 2005-10-25 2007-04-30 미쓰이 긴조꾸 고교 가부시키가이샤 2층 플렉시블 프린트 배선판 및 그 2층 플렉시블 프린트배선판의 제조 방법
JP4927503B2 (ja) * 2005-12-15 2012-05-09 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
JP4934409B2 (ja) * 2005-12-15 2012-05-16 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
JP2007314855A (ja) * 2006-05-29 2007-12-06 Furukawa Circuit Foil Kk キャリア付き極薄銅箔、銅張積層板及びプリント配線基板
TWI513388B (zh) * 2008-09-05 2015-12-11 Furukawa Electric Co Ltd A very thin copper foil with a carrier, and a laminated plate or printed circuit board with copper foil
JP5515328B2 (ja) * 2009-03-04 2014-06-11 福田金属箔粉工業株式会社 複合金属箔及びその製造方法並びにプリント配線板
JP5448616B2 (ja) * 2009-07-14 2014-03-19 古河電気工業株式会社 抵抗層付銅箔、該銅箔の製造方法および積層基板
CN101892499B (zh) * 2010-07-24 2011-11-09 江西理工大学 以铜箔作载体的可剥离超薄铜箔及其制备方法
CN102452197B (zh) 2010-10-21 2014-08-20 财团法人工业技术研究院 附载箔铜箔及其制造方法
JP5373995B2 (ja) 2011-08-31 2013-12-18 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔
WO2014157728A1 (ja) * 2013-03-29 2014-10-02 Jx日鉱日石金属株式会社 キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法
JP6403969B2 (ja) * 2013-03-29 2018-10-10 Ｊｘ金属株式会社 キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法
US10330701B2 (en) 2014-02-22 2019-06-25 International Business Machines Corporation Test probe head for full wafer testing
US9070586B1 (en) 2014-02-22 2015-06-30 International Business Machines Corporation Method of forming surface protrusions on an article and the article with the protrusions attached
TWI613940B (zh) * 2014-03-31 2018-02-01 Jx Nippon Mining & Metals Corp 附載體之銅箔、印刷配線板、積層體、電子機器及印刷配線板之製造方法
KR101852671B1 (ko) * 2015-01-21 2018-06-04 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법
KR101942621B1 (ko) 2015-02-06 2019-01-25 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법
US10057984B1 (en) 2017-02-02 2018-08-21 Chang Chun Petrochemical Co., Ltd. Composite thin copper foil and carrier
CN108541144A (zh) * 2018-04-17 2018-09-14 广东工业大学 一种易剥离载体箔及其制备方法和应用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3998601A (en) * 1973-12-03 1976-12-21 Yates Industries, Inc. Thin foil
US4131517A (en) * 1977-06-03 1978-12-26 Nippon Mining Co., Ltd. Surface treating process for copper foil for use in printed circuit
JPS5720347A (en) * 1980-07-14 1982-02-02 Nippon Denkai Kk Synthetic foil for printed wiring and its manufacture
DE69005691T2 (de) * 1989-05-02 1994-04-28 Nikko Gould Foil Co Behandlung von Kupferfolie für gedruckte Schaltungen.

Also Published As

Publication number Publication date
JPH0818401B2 (ja) 1996-02-28
JPH0373338A (ja) 1991-03-28
DE69022775T2 (de) 1996-03-14
EP0398721A2 (de) 1990-11-22
US5114543A (en) 1992-05-19
EP0398721A3 (de) 1991-12-18
EP0398721B1 (de) 1995-10-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee