DE69022529D1 - Anordnung zum Testen von fertig bestückten Printplatten, Verfahren zur Herstellung und Testen derselben. - Google Patents

Anordnung zum Testen von fertig bestückten Printplatten, Verfahren zur Herstellung und Testen derselben.

Info

Publication number
DE69022529D1
DE69022529D1 DE69022529T DE69022529T DE69022529D1 DE 69022529 D1 DE69022529 D1 DE 69022529D1 DE 69022529 T DE69022529 T DE 69022529T DE 69022529 T DE69022529 T DE 69022529T DE 69022529 D1 DE69022529 D1 DE 69022529D1
Authority
DE
Germany
Prior art keywords
printed circuit
testing
circuit board
operability
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69022529T
Other languages
English (en)
Other versions
DE69022529T2 (de
Inventor
W Randolph Lusby
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Compaq Computer Corp
Original Assignee
Compaq Computer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compaq Computer Corp filed Critical Compaq Computer Corp
Application granted granted Critical
Publication of DE69022529D1 publication Critical patent/DE69022529D1/de
Publication of DE69022529T2 publication Critical patent/DE69022529T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
DE69022529T 1989-10-26 1990-10-02 Anordnung zum Testen von fertig bestückten Printplatten, Verfahren zur Herstellung und Testen derselben. Expired - Fee Related DE69022529T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/427,753 US5001604A (en) 1989-10-26 1989-10-26 Embedded testing circuit and method for fabricating same

Publications (2)

Publication Number Publication Date
DE69022529D1 true DE69022529D1 (de) 1995-10-26
DE69022529T2 DE69022529T2 (de) 1996-05-02

Family

ID=23696135

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69022529T Expired - Fee Related DE69022529T2 (de) 1989-10-26 1990-10-02 Anordnung zum Testen von fertig bestückten Printplatten, Verfahren zur Herstellung und Testen derselben.

Country Status (7)

Country Link
US (2) US5001604A (de)
EP (1) EP0424696B1 (de)
JP (1) JPH03158777A (de)
KR (1) KR100197314B1 (de)
AT (1) ATE128245T1 (de)
CA (1) CA2025952A1 (de)
DE (1) DE69022529T2 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5001604A (en) * 1989-10-26 1991-03-19 Lusby W Randolph Embedded testing circuit and method for fabricating same
US5121297A (en) * 1990-12-31 1992-06-09 Compaq Computer Corporation Flexible printed circuits
US5201671A (en) * 1992-01-24 1993-04-13 Compaq Computer Corporation Flex pull tab for surface mount connector
US5197889A (en) * 1992-02-03 1993-03-30 Motorola, Inc. Electrical contact for battery package or similar device
US5263244A (en) * 1992-04-17 1993-11-23 Gould Inc. Method of making a flexible printed circuit sensor assembly for detecting optical pulses
EP0603739B1 (de) * 1992-12-23 1995-10-25 Rheinmetall Industrie Aktiengesellschaft Spannungsfeste Elektronik-Baugruppe
US5363275A (en) * 1993-02-10 1994-11-08 International Business Machines Corporation Modular component computer system
US5307241A (en) * 1993-03-25 1994-04-26 Northern Telecom Limited Electronic circuit board arrangements including main auxiliary circuit boards
JPH06334279A (ja) * 1993-05-20 1994-12-02 Minolta Camera Co Ltd 多層フレキシブル電装基板
US5412538A (en) * 1993-07-19 1995-05-02 Cordata, Inc. Space-saving memory module
JPH07306883A (ja) * 1994-05-12 1995-11-21 Fujitsu Ltd パターン評価支援装置
US5731547A (en) * 1996-02-20 1998-03-24 International Business Machines Corporation Circuitized substrate with material containment means and method of making same
JP3166611B2 (ja) * 1996-04-19 2001-05-14 富士ゼロックス株式会社 プリント配線板及びその製造方法
US6612022B1 (en) * 1996-05-03 2003-09-02 Invensys Systems, Inc. Printed circuit board including removable auxiliary area with test points
US5798638A (en) * 1996-10-24 1998-08-25 Ericsson, Inc. Apparatus for testing of printed circuit boards
KR100269947B1 (ko) * 1997-09-13 2000-10-16 윤종용 인쇄회로기판및이를이용한엘씨디모듈
JP2000241485A (ja) * 1999-02-24 2000-09-08 Jsr Corp 回路基板の電気抵抗測定装置および方法
DE19912441A1 (de) * 1999-03-19 2000-09-21 Elfo Ag Sachseln Sachseln Multi-Chip-Modul
US20020158639A1 (en) * 2000-04-25 2002-10-31 Toru Nakashiba Laminate with an inside layer circuit used for multilayer printed circuit board for a high frequency circuit ,and method and device for measuring circuit impedance of the laminate with inside layer circuit
JP2002034126A (ja) * 2000-07-19 2002-01-31 Yazaki Corp 配線ユニット
GB0304440D0 (en) * 2003-02-27 2003-04-02 Pace Micro Tech Plc Printed circuit board and method of use thereof
JP4830287B2 (ja) * 2004-11-19 2011-12-07 凸版印刷株式会社 測定用端点付積層配線基板及びその製造方法
JP2009038111A (ja) * 2007-07-31 2009-02-19 Toshiba Corp 半導体パッケージ、プリント配線板構造および電子機器
US8334704B2 (en) * 2009-02-20 2012-12-18 Apple Inc. Systems and methods for providing a system-on-a-substrate
US7845956B1 (en) * 2009-05-26 2010-12-07 Thomas Baycura Electrical component interface
CN102548220A (zh) * 2010-12-29 2012-07-04 富葵精密组件(深圳)有限公司 电路板的制作方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3546775A (en) * 1965-10-22 1970-12-15 Sanders Associates Inc Method of making multi-layer circuit
US4540229A (en) * 1982-04-12 1985-09-10 At&T Bell Laboratories Electrical interconnection apparatus
US4812792A (en) * 1983-12-22 1989-03-14 Trw Inc. High-frequency multilayer printed circuit board
DE8424493U1 (de) * 1984-08-16 1985-08-08 Brumm GmbH Elektronik-Gerätebau, 1000 Berlin Prüfadapter
DE3526485A1 (de) * 1985-07-24 1987-02-05 Heinz Krug Schaltungsanordnung zum pruefen integrierter schaltungseinheiten
JPS62265796A (ja) * 1986-05-14 1987-11-18 株式会社住友金属セラミックス セラミツク多層配線基板およびその製造法
US4800461A (en) * 1987-11-02 1989-01-24 Teledyne Industries, Inc. Multilayer combined rigid and flex printed circuits
US5008614A (en) * 1988-10-11 1991-04-16 Hewlett-Packard Company TAB frame and process of testing same
US4912401A (en) * 1989-01-18 1990-03-27 Tektronix, Inc. Connection apparatus for interactively accessing an electronic device in a pin grid array socket
US5001604A (en) * 1989-10-26 1991-03-19 Lusby W Randolph Embedded testing circuit and method for fabricating same
US5010446A (en) * 1989-10-30 1991-04-23 Commonwealth Edison Company Multi-edge extender board

Also Published As

Publication number Publication date
KR910008423A (ko) 1991-05-31
DE69022529T2 (de) 1996-05-02
EP0424696A2 (de) 1991-05-02
JPH03158777A (ja) 1991-07-08
EP0424696A3 (en) 1992-03-18
US5001604A (en) 1991-03-19
KR100197314B1 (ko) 1999-06-15
EP0424696B1 (de) 1995-09-20
ATE128245T1 (de) 1995-10-15
CA2025952A1 (en) 1991-04-27
US5162729A (en) 1992-11-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee