DE69020409T2 - Verfahren zum Aufbringen einer Schicht aus supraleitenden Materialien und geeignete Anordnung. - Google Patents

Verfahren zum Aufbringen einer Schicht aus supraleitenden Materialien und geeignete Anordnung.

Info

Publication number
DE69020409T2
DE69020409T2 DE69020409T DE69020409T DE69020409T2 DE 69020409 T2 DE69020409 T2 DE 69020409T2 DE 69020409 T DE69020409 T DE 69020409T DE 69020409 T DE69020409 T DE 69020409T DE 69020409 T2 DE69020409 T2 DE 69020409T2
Authority
DE
Germany
Prior art keywords
layer
plasma
applying
oxygen
suitable arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69020409T
Other languages
English (en)
Other versions
DE69020409D1 (de
Inventor
Kristin Deneffe
Gustaaf Regina Borghs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Interuniversitair Microelektronica Centrum vzw IMEC
Original Assignee
Interuniversitair Microelektronica Centrum vzw IMEC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL9000214A external-priority patent/NL9000214A/nl
Application filed by Interuniversitair Microelektronica Centrum vzw IMEC filed Critical Interuniversitair Microelektronica Centrum vzw IMEC
Publication of DE69020409D1 publication Critical patent/DE69020409D1/de
Application granted granted Critical
Publication of DE69020409T2 publication Critical patent/DE69020409T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/087—Oxides of copper or solid solutions thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • H10N60/0268—Manufacture or treatment of devices comprising copper oxide
    • H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
    • H10N60/0521—Processes for depositing or forming copper oxide superconductor layers by pulsed laser deposition, e.g. laser sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Oxygen, Ozone, And Oxides In General (AREA)
DE69020409T 1989-04-10 1990-04-10 Verfahren zum Aufbringen einer Schicht aus supraleitenden Materialien und geeignete Anordnung. Expired - Fee Related DE69020409T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP89200904 1989-04-10
NL9000214A NL9000214A (nl) 1989-04-10 1990-01-29 Werkwijze voor het aanbrengen van een laag supergeleidend materiaal en een daarvoor geschikte inrichting.

Publications (2)

Publication Number Publication Date
DE69020409D1 DE69020409D1 (de) 1995-08-03
DE69020409T2 true DE69020409T2 (de) 1995-11-16

Family

ID=26121046

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69020409T Expired - Fee Related DE69020409T2 (de) 1989-04-10 1990-04-10 Verfahren zum Aufbringen einer Schicht aus supraleitenden Materialien und geeignete Anordnung.

Country Status (8)

Country Link
EP (1) EP0392630B1 (de)
JP (1) JPH04501102A (de)
AT (1) ATE124574T1 (de)
DE (1) DE69020409T2 (de)
DK (1) DK0392630T3 (de)
ES (1) ES2073508T3 (de)
GR (1) GR3017236T3 (de)
WO (1) WO1990012425A1 (de)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6274073A (ja) * 1985-09-26 1987-04-04 Hitachi Ltd スパツタ装置
US5158931A (en) * 1988-03-16 1992-10-27 Kabushiki Kaisha Toshiba Method for manufacturing an oxide superconductor thin film

Also Published As

Publication number Publication date
DE69020409D1 (de) 1995-08-03
GR3017236T3 (en) 1995-11-30
DK0392630T3 (da) 1995-08-28
ATE124574T1 (de) 1995-07-15
WO1990012425A1 (en) 1990-10-18
EP0392630B1 (de) 1995-06-28
EP0392630A1 (de) 1990-10-17
ES2073508T3 (es) 1995-08-16
JPH04501102A (ja) 1992-02-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee