WO1990012425A1 - Method for applying a layer of superconducting material and a device suitable therefor - Google Patents

Method for applying a layer of superconducting material and a device suitable therefor Download PDF

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Publication number
WO1990012425A1
WO1990012425A1 PCT/EP1990/000602 EP9000602W WO9012425A1 WO 1990012425 A1 WO1990012425 A1 WO 1990012425A1 EP 9000602 W EP9000602 W EP 9000602W WO 9012425 A1 WO9012425 A1 WO 9012425A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
magnetic field
oxygen
layer
applying
Prior art date
Application number
PCT/EP1990/000602
Other languages
English (en)
French (fr)
Inventor
Kristin Deneffe
Gustaaf Regina Borghs
Original Assignee
Interuniversitair Micro-Elektronica Centrum Vzw
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL9000214A external-priority patent/NL9000214A/nl
Application filed by Interuniversitair Micro-Elektronica Centrum Vzw filed Critical Interuniversitair Micro-Elektronica Centrum Vzw
Publication of WO1990012425A1 publication Critical patent/WO1990012425A1/en

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • C23C14/087Oxides of copper or solid solutions thereof
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/28Vacuum evaporation by wave energy or particle radiation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00Superconducting devices
    • H10N60/01Manufacture or treatment
    • H10N60/0268Manufacture or treatment of devices comprising copper oxide
    • H10N60/0296Processes for depositing or forming copper oxide superconductor layers
    • H10N60/0521Processes for depositing or forming copper oxide superconductor layers by pulsed laser deposition, e.g. laser sputtering

Definitions

  • the drawback of these prior arts comprises the diffusion and/or chemical re ⁇ actions between substrate and the superconducting layer to be applied thereto, particularly in the case of semiconduc ⁇ tor substrates such as gallium arsenide (GaAs) and silicon (Si) .
  • the difference in coefficient of expansion between the different materials may also be a cause of crystal-grid errors.
  • the present invention has for its object to improve the above mentioned prior art and provides to this end a me ⁇ thod according to claim 1.
  • the present invention also provides a device as ac ⁇ cording to claim 5 wherein other micro-electronic layers such as conducting layers and the like can also be applied in a simple manner.
  • the (dry) etching of layers can also take place in such a device.
  • a device 1 comprises a chamber 2 wherein a substrate S is disposed on a substrate holder 3.
  • a laser bundle B is directed via an entrance or window 4 onto a superconducting piece of material M according to the per se known ablation technigue so that material to be applied to the substrate S is released form the piece of material.
  • a holder 5 for the material M preferably takes a rotating form so that overhea ⁇ ting thereof is avoided.
  • a schematically indicated microwave system 6 com ⁇ prising two solenoids (7, 8).
  • the magnetic field generated by the solenoids 7,8 is preferably dimensioned such that at two spots in this field the value is 875 Gauss.
  • Oxygen which is brought into the chamber in a manner not shown is ionised at these spots and enters a plasma state in the area between the two spots.
  • the generated ions are transported along the magnetic field lines over the substrate. Since interaction with the chamber walls is avoided as far as possible, a pure and clean plasma is produced resulting in pure and clean layers.
  • the chamber 2 is kept at underpressure, for example of 10 "9 Torr, using a Balzer TM pump (not shown) .
  • the device 1 is preferably provided with Knudsen or effusion cells (9, 11) for applying other layers.
  • a YAG laser (12) is preferably galvanically con ⁇ trolled so that patterns can be written onto a substrate herewith.
  • the method can also be used for deposition of other layers such as diamond or epitaxial silicium.
  • a layer was grown in a plasma with an oxygen pressu ⁇ re of 5 x 10 "4 Torr and after that "quenched", i.e. chilled as quickly as possible.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
  • Oxygen, Ozone, And Oxides In General (AREA)
PCT/EP1990/000602 1989-04-10 1990-04-10 Method for applying a layer of superconducting material and a device suitable therefor WO1990012425A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP89200904.4 1989-04-10
EP89200904 1989-04-10
NL9000214A NL9000214A (nl) 1989-04-10 1990-01-29 Werkwijze voor het aanbrengen van een laag supergeleidend materiaal en een daarvoor geschikte inrichting.
NL9000214 1990-01-29

Publications (1)

Publication Number Publication Date
WO1990012425A1 true WO1990012425A1 (en) 1990-10-18

Family

ID=26121046

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1990/000602 WO1990012425A1 (en) 1989-04-10 1990-04-10 Method for applying a layer of superconducting material and a device suitable therefor

Country Status (8)

Country Link
EP (1) EP0392630B1 (de)
JP (1) JPH04501102A (de)
AT (1) ATE124574T1 (de)
DE (1) DE69020409T2 (de)
DK (1) DK0392630T3 (de)
ES (1) ES2073508T3 (de)
GR (1) GR3017236T3 (de)
WO (1) WO1990012425A1 (de)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989008605A1 (en) * 1988-03-16 1989-09-21 Kabushiki Kaisha Toshiba Process for producing thin-film oxide superconductor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6274073A (ja) * 1985-09-26 1987-04-04 Hitachi Ltd スパツタ装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989008605A1 (en) * 1988-03-16 1989-09-21 Kabushiki Kaisha Toshiba Process for producing thin-film oxide superconductor

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
APPLIED PHYSICS LETTERS. vol. 52, no. 4, 25 January 1988, NEW YORK US pages 320 - 322; L.LYNDS et al: "Superconducting thin films of Y-Ba-Cu-O produced by neodymium:yttrium aluminum garnet laser ablation" see figure 1 *
APPLIED PHYSICS LETTERS. vol. 53, no. 3, 18 July 1988, NEW YORK US pages 234 - 236; S. WITANACHCHI et al: "Deposition of superconducting Y-Ba-Cu-O films at 400 ØC without post-annealing" see page 234 *

Also Published As

Publication number Publication date
DE69020409D1 (de) 1995-08-03
DK0392630T3 (da) 1995-08-28
GR3017236T3 (en) 1995-11-30
EP0392630A1 (de) 1990-10-17
ES2073508T3 (es) 1995-08-16
EP0392630B1 (de) 1995-06-28
DE69020409T2 (de) 1995-11-16
JPH04501102A (ja) 1992-02-27
ATE124574T1 (de) 1995-07-15

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