DE68925410D1 - Vorrichtung zur automatischen Montage von elektronischen Bauelementen - Google Patents

Vorrichtung zur automatischen Montage von elektronischen Bauelementen

Info

Publication number
DE68925410D1
DE68925410D1 DE68925410T DE68925410T DE68925410D1 DE 68925410 D1 DE68925410 D1 DE 68925410D1 DE 68925410 T DE68925410 T DE 68925410T DE 68925410 T DE68925410 T DE 68925410T DE 68925410 D1 DE68925410 D1 DE 68925410D1
Authority
DE
Germany
Prior art keywords
electronic components
automatic assembly
automatic
assembly
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE68925410T
Other languages
English (en)
Other versions
DE68925410T2 (de
Inventor
Kenji Amao
Kazuyoshi Ohyama
Kenji Mizoguchi
Tsuneshi Akaishi
Takayoshi Takeuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Instruments Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63286951A external-priority patent/JP2622998B2/ja
Priority claimed from JP1214389A external-priority patent/JPH0378298A/ja
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Application granted granted Critical
Publication of DE68925410D1 publication Critical patent/DE68925410D1/de
Publication of DE68925410T2 publication Critical patent/DE68925410T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE68925410T 1988-11-14 1989-11-13 Vorrichtung zur automatischen Montage von elektronischen Bauelementen Expired - Lifetime DE68925410T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP63286951A JP2622998B2 (ja) 1988-11-14 1988-11-14 部品位置検出装置
JP1214389A JPH0378298A (ja) 1989-08-21 1989-08-21 部品装着装置
JP21680089 1989-08-22

Publications (2)

Publication Number Publication Date
DE68925410D1 true DE68925410D1 (de) 1996-02-22
DE68925410T2 DE68925410T2 (de) 1996-11-07

Family

ID=27329609

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68925410T Expired - Lifetime DE68925410T2 (de) 1988-11-14 1989-11-13 Vorrichtung zur automatischen Montage von elektronischen Bauelementen

Country Status (4)

Country Link
US (1) US4951383A (de)
EP (1) EP0373373B1 (de)
KR (1) KR920007433B1 (de)
DE (1) DE68925410T2 (de)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07105637B2 (ja) * 1990-05-31 1995-11-13 三洋電機株式会社 部品装着装置
JPH04291795A (ja) * 1991-03-20 1992-10-15 Matsushita Electric Ind Co Ltd 電子部品装着装置
JPH05129796A (ja) * 1991-09-25 1993-05-25 Toshiba Corp 部品実装装置
JPH0590796A (ja) * 1991-09-26 1993-04-09 Japan Tobacco Inc ワーク実装機
DE4209524A1 (de) * 1992-03-24 1993-09-30 Siemens Ag Verfahren zur Lageerkennung und/oder Teilungsprüfung und/oder Koplanaritätsprüfung der Anschlüsse von Bauelementen und Bestückkopf für die automatische Bestückung von Bauelementen
JPH066084A (ja) * 1992-06-19 1994-01-14 Olympus Optical Co Ltd 電子部品自動実装機
JPH0715171A (ja) * 1993-06-28 1995-01-17 Matsushita Electric Ind Co Ltd 部品装着装置
US5499443A (en) * 1993-10-25 1996-03-19 Ando Electric Co., Ltd. Connector press-fitting apparatus
JP2929937B2 (ja) * 1994-04-20 1999-08-03 松下電器産業株式会社 電子部品実装装置及び電子部品の実装方法
JP2930870B2 (ja) * 1994-07-06 1999-08-09 株式会社三協精機製作所 電子部品表面実装装置
JPH10507313A (ja) * 1994-09-14 1998-07-14 マイデータ オートメーション アクチボラグ 部品から像を捕捉する装置とその装置を備えた実装機
SE505133C2 (sv) * 1994-10-12 1997-06-30 Mydata Automation Ab Plockhuvud för komponentmonteringsmaskin
US5590456A (en) * 1994-12-07 1997-01-07 Lucent Technologies Inc. Apparatus for precise alignment and placement of optoelectric components
JPH08162797A (ja) * 1994-12-08 1996-06-21 Matsushita Electric Ind Co Ltd 電子部品実装装置
US5768765A (en) * 1995-02-21 1998-06-23 Samsung Aerospace Industries, Ltd. Component mounting apparatus
US5794329A (en) * 1995-02-27 1998-08-18 Mpm Corporation Support apparatus for circuit board
US5699448A (en) * 1995-07-05 1997-12-16 Universal Instruments Corporation Split field optics for locating multiple components
US5649356A (en) * 1995-09-22 1997-07-22 Universal Instruments Corporation Method and apparatus for supplying and placing components
US6691400B1 (en) * 1995-12-15 2004-02-17 Matsushita Electric Industrial Co., Ltd. High speed electronic parts mounting apparatus having mounting heads which alternately mount components on a printed circuit board
US5743001A (en) * 1996-08-16 1998-04-28 Amistar Corporation Surface mount placement system with single step, multiple place carriage
US6343415B1 (en) * 1996-12-25 2002-02-05 Matsushita Electric Industrial Co., Ltd. Part holding head, part mounting device and part holding method
JP3255062B2 (ja) * 1997-01-17 2002-02-12 松下電器産業株式会社 電子部品装着装置
US6568069B1 (en) * 1997-02-24 2003-05-27 Siemens Aktiengesellschaft Apparatus for manufacture of electrical assemblies
US6240628B1 (en) * 1997-09-29 2001-06-05 Matsushita Electric Industrial Co., Ltd. Device for securing a nozzle of a parts installer
JPH11186791A (ja) * 1997-12-18 1999-07-09 Fuji Mach Mfg Co Ltd 回路部品供給システムおよび供給方法
JP3678007B2 (ja) * 1998-07-10 2005-08-03 松下電器産業株式会社 電子部品実装装置における電子部品認識装置および電子部品認識方法
JP4353567B2 (ja) * 1999-01-28 2009-10-28 富士機械製造株式会社 保持装置および撮像方法
JP4147505B2 (ja) * 1999-01-28 2008-09-10 富士機械製造株式会社 保持ヘッド
US6203082B1 (en) 1999-07-12 2001-03-20 Rd Automation Mounting apparatus for electronic parts
JP2001053496A (ja) * 1999-08-06 2001-02-23 Matsushita Electric Ind Co Ltd 電子部品実装方法
JP2002118398A (ja) * 2000-10-05 2002-04-19 Fuji Mach Mfg Co Ltd プリント配線板の位置検出方法
JP2003059955A (ja) * 2001-08-08 2003-02-28 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法
CN1229010C (zh) * 2001-08-08 2005-11-23 松下电器产业株式会社 安装电子部件的设备和方法
US7513389B2 (en) * 2004-03-23 2009-04-07 Hitachi High-Tech Instruments Co., Ltd. Electronic component feeding device and electronic component mounting apparatus with electronic component feeding device
KR100702515B1 (ko) * 2005-06-16 2007-04-02 삼성전자주식회사 자화 제거부를 구비하는 전자부품 실장 장치 및 자화 제거방법
JP5584651B2 (ja) * 2011-05-12 2014-09-03 ヤマハ発動機株式会社 吸着状態検査装置、表面実装機及び部品試験装置
JP5845399B2 (ja) 2011-07-28 2016-01-20 パナソニックＩｐマネジメント株式会社 電子部品実装システムおよび電子部品実装方法
JP5747167B2 (ja) * 2012-02-02 2015-07-08 パナソニックＩｐマネジメント株式会社 下受けピンの配置方法および下受けピンの返戻方法
CN104641736B (zh) * 2012-09-20 2017-06-06 富士机械制造株式会社 散装元件供给装置及元件安装装置
WO2016189621A1 (ja) * 2015-05-25 2016-12-01 富士機械製造株式会社 部品実装機
JP6498312B2 (ja) * 2015-11-11 2019-04-17 ヤマハ発動機株式会社 シャフト装置、実装ヘッド、表面実装機

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986004479A1 (en) * 1985-01-21 1986-07-31 Fuji Machine Mfg. Co., Ltd. Method of and apparatus for detecting electronic device-holding position and electronic device-mounting apparatus
JPH0797019B2 (ja) * 1986-06-12 1995-10-18 松下電器産業株式会社 部品認識用照明方法及びその装置
JPS6354000A (ja) * 1986-08-22 1988-03-08 三洋電機株式会社 電子部品の位置検出装置

Also Published As

Publication number Publication date
KR920007433B1 (ko) 1992-08-31
EP0373373A2 (de) 1990-06-20
DE68925410T2 (de) 1996-11-07
EP0373373B1 (de) 1996-01-10
EP0373373A3 (en) 1990-12-12
KR900008922A (ko) 1990-06-04
US4951383A (en) 1990-08-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HITACHI HIGH-TECH INSTRUMENTS CO., LTD., GUNMA, JP