DE68923576D1 - Bauteilträgervorrichtung. - Google Patents

Bauteilträgervorrichtung.

Info

Publication number
DE68923576D1
DE68923576D1 DE68923576T DE68923576T DE68923576D1 DE 68923576 D1 DE68923576 D1 DE 68923576D1 DE 68923576 T DE68923576 T DE 68923576T DE 68923576 T DE68923576 T DE 68923576T DE 68923576 D1 DE68923576 D1 DE 68923576D1
Authority
DE
Germany
Prior art keywords
component carrier
carrier device
component
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68923576T
Other languages
English (en)
Other versions
DE68923576T2 (de
Inventor
Shinichi Hara
Shunichi Uzawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE68923576D1 publication Critical patent/DE68923576D1/de
Publication of DE68923576T2 publication Critical patent/DE68923576T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
    • F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D19/00—Control of mechanical oscillations, e.g. of amplitude, of frequency, of phase
    • G05D19/02—Control of mechanical oscillations, e.g. of amplitude, of frequency, of phase characterised by the use of electric means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/802—Circuitry or processes for operating piezoelectric or electrostrictive devices not otherwise provided for, e.g. drive circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Epidemiology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Public Health (AREA)
  • General Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Details Of Measuring And Other Instruments (AREA)
DE68923576T 1988-05-11 1989-05-11 Bauteilträgervorrichtung. Expired - Fee Related DE68923576T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63112628A JPH01284793A (ja) 1988-05-11 1988-05-11 基板支持装置

Publications (2)

Publication Number Publication Date
DE68923576D1 true DE68923576D1 (de) 1995-08-31
DE68923576T2 DE68923576T2 (de) 1996-01-25

Family

ID=14591488

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68923576T Expired - Fee Related DE68923576T2 (de) 1988-05-11 1989-05-11 Bauteilträgervorrichtung.

Country Status (4)

Country Link
US (1) US5155523A (de)
EP (1) EP0342040B1 (de)
JP (1) JPH01284793A (de)
DE (1) DE68923576T2 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0412853B1 (de) * 1989-08-11 1997-03-26 Bridgestone Corporation Aktives Schwingungssteuergerät
US5333035A (en) * 1992-05-15 1994-07-26 Nikon Corporation Exposing method
KR950003927A (ko) * 1993-07-27 1995-02-17 김광호 화상형성장치
US5593800A (en) * 1994-01-06 1997-01-14 Canon Kabushiki Kaisha Mask manufacturing method and apparatus and device manufacturing method using a mask manufactured by the method or apparatus
JP3226704B2 (ja) * 1994-03-15 2001-11-05 キヤノン株式会社 露光装置
JP3402750B2 (ja) * 1994-05-25 2003-05-06 キヤノン株式会社 位置合わせ方法及びそれを用いた素子の製造方法
EP0715215B1 (de) * 1994-11-29 2001-05-30 Canon Kabushiki Kaisha Ausrichtverfahren und Halbleiterbelichtungsverfahren
JPH08293459A (ja) 1995-04-21 1996-11-05 Nikon Corp ステージ駆動制御方法及びその装置
JP3320262B2 (ja) * 1995-07-07 2002-09-03 キヤノン株式会社 走査露光装置及び方法並びにそれを用いたデバイス製造方法
JP3564833B2 (ja) 1995-11-10 2004-09-15 株式会社ニコン 露光方法
US5854819A (en) * 1996-02-07 1998-12-29 Canon Kabushiki Kaisha Mask supporting device and correction method therefor, and exposure apparatus and device producing method utilizing the same
US5920398A (en) * 1996-03-01 1999-07-06 Canon Kabushiki Kaisha Surface position detecting method and scanning exposure method using the same
JP3814359B2 (ja) * 1996-03-12 2006-08-30 キヤノン株式会社 Ｘ線投影露光装置及びデバイス製造方法
US6002987A (en) * 1996-03-26 1999-12-14 Nikon Corporation Methods to control the environment and exposure apparatus
GB2312972B (en) * 1996-05-11 2000-02-09 Marconi Gec Ltd Vibration control
US6089525A (en) * 1997-10-07 2000-07-18 Ultratech Stepper, Inc. Six axis active vibration isolation and payload reaction force compensation system
WO1999026120A1 (fr) * 1997-11-18 1999-05-27 Nikon Corporation Eliminateur de vibrations, dispositif d'alignement et procede d'exposition par projection
US6060813A (en) * 1998-01-08 2000-05-09 Xerox Corporation Vibration suppression and electromechanical damping apparatus for electrophotographic printing structures
JP4194160B2 (ja) 1998-02-19 2008-12-10 キヤノン株式会社 投影露光装置
JP3554186B2 (ja) 1998-04-08 2004-08-18 キヤノン株式会社 露光装置、デバイス製造方法および反力受け方法
US6113056A (en) * 1998-08-04 2000-09-05 Micrion Corporation Workpiece vibration damper
JP2003110012A (ja) * 2001-09-28 2003-04-11 Nissin Electric Co Ltd 基板保持方法およびその装置
JP2004281783A (ja) * 2003-03-17 2004-10-07 Renesas Technology Corp 半導体処理装置
JPWO2004107416A1 (ja) * 2003-05-27 2006-07-20 株式会社ニコン 露光装置及びデバイスの製造方法
US6834548B1 (en) * 2003-06-18 2004-12-28 International Business Machines Corporation Method and apparatus for reduction of high-frequency vibrations in thick pellicles
DE10344538A1 (de) 2003-09-25 2005-05-12 Integrated Dynamics Eng Gmbh Verfahren und Vorrichtung zur Schwingungsisolation, insbesondere für Elektronenstrahl-Meßwerkzeuge
US7355674B2 (en) * 2004-09-28 2008-04-08 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and computer program product
US7352198B2 (en) * 2006-01-18 2008-04-01 Electroglas, Inc. Methods and apparatuses for improved stabilization in a probing system
JP4708876B2 (ja) * 2005-06-21 2011-06-22 キヤノン株式会社 液浸露光装置
US7508494B2 (en) * 2006-12-22 2009-03-24 Asml Netherlands B.V. Lithographic apparatus and a subtrate table for exciting a shockwave in a substrate
US8519728B2 (en) 2008-12-12 2013-08-27 Formfactor, Inc. Compliance control methods and apparatuses

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1193297A (en) * 1966-07-01 1970-05-28 Telefunken Patent Device for the Fine Adjustment of Photomasks with respect to Semiconductor Elements
US4629313A (en) * 1982-10-22 1986-12-16 Nippon Kogaku K.K. Exposure apparatus
JPS59101830A (ja) * 1982-12-01 1984-06-12 Canon Inc 転写装置
JPS6032050A (ja) * 1983-08-02 1985-02-19 Canon Inc 露光装置
US4723086A (en) * 1986-10-07 1988-02-02 Micronix Corporation Coarse and fine motion positioning mechanism
US4875076A (en) * 1987-06-15 1989-10-17 Canon Kabushiki Kaisha Exposure apparatus
DE68921687T2 (de) * 1988-09-02 1995-08-03 Canon Kk Belichtungseinrichtung.

Also Published As

Publication number Publication date
EP0342040A3 (en) 1990-08-08
DE68923576T2 (de) 1996-01-25
EP0342040B1 (de) 1995-07-26
EP0342040A2 (de) 1989-11-15
JPH01284793A (ja) 1989-11-16
US5155523A (en) 1992-10-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee