DE68922645D1 - Röntgenstrahlmaske. - Google Patents

Röntgenstrahlmaske.

Info

Publication number
DE68922645D1
DE68922645D1 DE68922645T DE68922645T DE68922645D1 DE 68922645 D1 DE68922645 D1 DE 68922645D1 DE 68922645 T DE68922645 T DE 68922645T DE 68922645 T DE68922645 T DE 68922645T DE 68922645 D1 DE68922645 D1 DE 68922645D1
Authority
DE
Germany
Prior art keywords
ray mask
mask
ray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68922645T
Other languages
English (en)
Other versions
DE68922645T2 (de
Inventor
Masao Yamada
Kenji Nakagawa
Masafumi Nakaishi
Yuji Furumura
Takashi Eshita
Fumitake Mieno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP5436588A external-priority patent/JP2757939B2/ja
Priority claimed from JP5436488A external-priority patent/JP2573985B2/ja
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE68922645D1 publication Critical patent/DE68922645D1/de
Publication of DE68922645T2 publication Critical patent/DE68922645T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
DE68922645T 1988-03-08 1989-03-07 Röntgenstrahlmaske. Expired - Fee Related DE68922645T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5436588A JP2757939B2 (ja) 1988-03-08 1988-03-08 Ｘ線マスク
JP5436488A JP2573985B2 (ja) 1988-03-08 1988-03-08 Ｘ線マスク

Publications (2)

Publication Number Publication Date
DE68922645D1 true DE68922645D1 (de) 1995-06-22
DE68922645T2 DE68922645T2 (de) 1995-10-05

Family

ID=26395119

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68922645T Expired - Fee Related DE68922645T2 (de) 1988-03-08 1989-03-07 Röntgenstrahlmaske.

Country Status (4)

Country Link
US (1) US5082695A (de)
EP (1) EP0332130B1 (de)
KR (1) KR930004236B1 (de)
DE (1) DE68922645T2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5335256A (en) * 1991-03-18 1994-08-02 Canon Kabushiki Kaisha Semiconductor substrate including a single or multi-layer film having different densities in the thickness direction
TW337513B (en) * 1992-11-23 1998-08-01 Cvd Inc Chemical vapor deposition-produced silicon carbide having improved properties and preparation process thereof
US5416821A (en) * 1993-05-10 1995-05-16 Trw Inc. Grid formed with a silicon substrate
KR0138278B1 (ko) * 1995-01-24 1998-04-27 김광호 엑스레이 리소그래피용 마스크 및 그의 제조방법
JPH11162823A (ja) * 1997-12-01 1999-06-18 Nikon Corp マスク作製用部材、マスク及びそれらの製造方法
KR100447993B1 (ko) * 1998-12-28 2004-10-14 주식회사 하이닉스반도체 셀 투사 마스크_
US6764958B1 (en) 2000-07-28 2004-07-20 Applied Materials Inc. Method of depositing dielectric films
US6537733B2 (en) * 2001-02-23 2003-03-25 Applied Materials, Inc. Method of depositing low dielectric constant silicon carbide layers
US6656837B2 (en) * 2001-10-11 2003-12-02 Applied Materials, Inc. Method of eliminating photoresist poisoning in damascene applications

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US345867A (en) * 1886-07-20 Edward sonstadt
GB1039748A (en) * 1964-07-25 1966-08-24 Ibm Improvements relating to methods of growing silicon carbide crystals epitaxially
US3501356A (en) * 1966-05-12 1970-03-17 Westinghouse Electric Corp Process for the epitaxial growth of silicon carbide
US3577285A (en) * 1968-03-28 1971-05-04 Ibm Method for epitaxially growing silicon carbide onto a crystalline substrate
SU438364A1 (ru) * 1972-09-15 1976-07-05 В. И. Павличенко Диодный источник света на карбтде кремни
DE2364989C3 (de) * 1973-12-28 1979-10-18 Consortium Fuer Elektrochemische Industrie Gmbh, 8000 Muenchen Verfahren zur Herstellung von Schichten aus Siliciumcarbid auf einem Siliciumsubstrat
JPS5120869A (en) * 1974-08-10 1976-02-19 Hitachi Shipbuilding Eng Co Suichukosotaiheno setsukinsochi
US4028149A (en) * 1976-06-30 1977-06-07 Ibm Corporation Process for forming monocrystalline silicon carbide on silicon substrates
JPS5320767A (en) * 1976-08-10 1978-02-25 Nippon Telegr & Teleph Corp <Ntt> X-ray mask supporting underlayer and its production
GB2100713B (en) * 1981-06-23 1985-04-24 Atomic Energy Authority Uk Modifying the mechanical properties of silicon carbide
JPS6093440A (ja) * 1983-10-27 1985-05-25 Mitsubishi Electric Corp Ｘ線露光用マスク
JPS61198722A (ja) * 1985-02-28 1986-09-03 Nec Corp Ｘ線露光マスク及びその製造方法
JPS61199770A (ja) * 1985-03-02 1986-09-04 Koga Sangyo Kk 密閉箱体を有する自動乾海苔製造装置
JPH0658874B2 (ja) * 1986-03-18 1994-08-03 富士通株式会社 Ｘ線マスクの製造方法
EP0244496B1 (de) * 1986-05-06 1991-01-16 Ibm Deutschland Gmbh Maske für die Ionen-, Elektronen- oder Röntgenstrahllithographie und Verfahren zur ihrer Herstellung
JPH0746681B2 (ja) * 1986-10-28 1995-05-17 富士通株式会社 Ｘ線ステッパー用マスクの製造方法
DE3733311A1 (de) * 1987-10-02 1989-04-13 Philips Patentverwaltung Verfahren zur herstellung eines maskentraegers aus sic fuer roentgenstrahllithographie-masken
JP2692091B2 (ja) * 1987-10-31 1997-12-17 株式会社日本自動車部品総合研究所 炭化ケイ素半導体膜およびその製造方法

Also Published As

Publication number Publication date
US5082695A (en) 1992-01-21
KR890015348A (ko) 1989-10-30
DE68922645T2 (de) 1995-10-05
EP0332130B1 (de) 1995-05-17
EP0332130A3 (de) 1991-03-20
KR930004236B1 (ko) 1993-05-22
EP0332130A2 (de) 1989-09-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee