DE3783239D1 - Roentgenstrahlmaske. - Google Patents

Roentgenstrahlmaske.

Info

Publication number
DE3783239D1
DE3783239D1 DE8787101361T DE3783239T DE3783239D1 DE 3783239 D1 DE3783239 D1 DE 3783239D1 DE 8787101361 T DE8787101361 T DE 8787101361T DE 3783239 T DE3783239 T DE 3783239T DE 3783239 D1 DE3783239 D1 DE 3783239D1
Authority
DE
Germany
Prior art keywords
ray mask
mask
ray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787101361T
Other languages
English (en)
Other versions
DE3783239T2 (de
Inventor
Kenji Fujitsu Ltd Pat Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3783239D1 publication Critical patent/DE3783239D1/de
Publication of DE3783239T2 publication Critical patent/DE3783239T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/167—X-ray
    • Y10S430/168—X-ray exposure process
DE8787101361T 1986-02-03 1987-02-02 Roentgenstrahlmaske. Expired - Fee Related DE3783239T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61022562A JPS62202518A (ja) 1986-02-03 1986-02-03 Ｘ線露光用マスク

Publications (2)

Publication Number Publication Date
DE3783239D1 true DE3783239D1 (de) 1993-02-11
DE3783239T2 DE3783239T2 (de) 1993-04-29

Family

ID=12086305

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787101361T Expired - Fee Related DE3783239T2 (de) 1986-02-03 1987-02-02 Roentgenstrahlmaske.

Country Status (5)

Country Link
US (1) US4939052A (de)
EP (1) EP0231916B1 (de)
JP (1) JPS62202518A (de)
KR (1) KR900003254B1 (de)
DE (1) DE3783239T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0682604B2 (ja) * 1987-08-04 1994-10-19 三菱電機株式会社 Ｘ線マスク
JPH02103547A (ja) * 1988-10-13 1990-04-16 Fujitsu Ltd 導電性層の形成方法
US5422491A (en) * 1988-11-04 1995-06-06 Fujitsu Limited Mask and charged particle beam exposure method using the mask
JP2702183B2 (ja) * 1988-11-04 1998-01-21 富士通株式会社 半導体製造装置
US5262257A (en) * 1989-07-13 1993-11-16 Canon Kabushiki Kaisha Mask for lithography
JP2801270B2 (ja) * 1989-07-13 1998-09-21 キヤノン株式会社 マスク作成方法
US5258091A (en) * 1990-09-18 1993-11-02 Sumitomo Electric Industries, Ltd. Method of producing X-ray window
US5235626A (en) * 1991-10-22 1993-08-10 International Business Machines Corporation Segmented mask and exposure system for x-ray lithography
SG43954A1 (en) * 1991-11-15 1997-11-14 Canon Kk X-ray mask structure and x-ray exposing method and semiconductor device manufactured by use of x-ray mask structure and method for manufacturing x-ray mask structure
FI93680C (fi) * 1992-05-07 1995-05-10 Outokumpu Instr Oy Ohutkalvon tukirakenne ja menetelmä sen valmistamiseksi
US5418095A (en) * 1993-01-21 1995-05-23 Sematech, Inc. Method of fabricating phase shifters with absorbing/attenuating sidewalls using an additive process
US5411824A (en) * 1993-01-21 1995-05-02 Sematech, Inc. Phase shifting mask structure with absorbing/attenuating sidewalls for improved imaging
AU5681194A (en) * 1993-01-21 1994-08-15 Sematech, Inc. Phase shifting mask structure with multilayer optical coating for improved transmission
US6297169B1 (en) * 1998-07-27 2001-10-02 Motorola, Inc. Method for forming a semiconductor device using a mask having a self-assembled monolayer

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3925677A (en) * 1974-04-15 1975-12-09 Bell Telephone Labor Inc Platinum oxide lithographic masks
US4018938A (en) * 1975-06-30 1977-04-19 International Business Machines Corporation Fabrication of high aspect ratio masks
JPS57193031A (en) * 1981-05-22 1982-11-27 Toshiba Corp Manufacture of mask substrate for exposing x-ray
JPS5890729A (ja) * 1981-11-25 1983-05-30 Nec Corp Ｘ線マスク製作方法
JPS60132323A (ja) * 1983-12-21 1985-07-15 Hitachi Ltd Ｘ線露光用マスクの製造方法
US4549939A (en) * 1984-04-30 1985-10-29 Ppg Industries, Inc. Photoelectroforming mandrel and method of electroforming
JPS61245161A (ja) * 1985-04-23 1986-10-31 Fujitsu Ltd Ｘ線用マスクの製造方法
US4696878A (en) * 1985-08-02 1987-09-29 Micronix Corporation Additive process for manufacturing a mask for use in X-ray photolithography and the resulting mask

Also Published As

Publication number Publication date
EP0231916B1 (de) 1992-12-30
JPS62202518A (ja) 1987-09-07
DE3783239T2 (de) 1993-04-29
US4939052A (en) 1990-07-03
EP0231916A2 (de) 1987-08-12
JPH0255933B2 (de) 1990-11-28
KR900003254B1 (ko) 1990-05-12
EP0231916A3 (en) 1989-11-08
KR870008378A (ko) 1987-09-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee