DE68919556D1 - Schichtartiges piezoelektrisches Element und dessen Herstellungsverfahren. - Google Patents

Schichtartiges piezoelektrisches Element und dessen Herstellungsverfahren.

Info

Publication number
DE68919556D1
DE68919556D1 DE68919556T DE68919556T DE68919556D1 DE 68919556 D1 DE68919556 D1 DE 68919556D1 DE 68919556 T DE68919556 T DE 68919556T DE 68919556 T DE68919556 T DE 68919556T DE 68919556 D1 DE68919556 D1 DE 68919556D1
Authority
DE
Germany
Prior art keywords
manufacturing process
piezoelectric element
layered piezoelectric
layered
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68919556T
Other languages
English (en)
Other versions
DE68919556T2 (de
Inventor
Akiomi Kohno
Masatugu Arai
Takeshi Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15989356&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE68919556(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE68919556D1 publication Critical patent/DE68919556D1/de
Application granted granted Critical
Publication of DE68919556T2 publication Critical patent/DE68919556T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/057—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by stacking bulk piezoelectric or electrostrictive bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
DE68919556T 1988-07-15 1989-07-14 Schichtartiges piezoelektrisches Element und dessen Herstellungsverfahren. Expired - Fee Related DE68919556T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17505088A JP2738706B2 (ja) 1988-07-15 1988-07-15 積層型圧電素子の製法

Publications (2)

Publication Number Publication Date
DE68919556D1 true DE68919556D1 (de) 1995-01-12
DE68919556T2 DE68919556T2 (de) 1995-04-13

Family

ID=15989356

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68919556T Expired - Fee Related DE68919556T2 (de) 1988-07-15 1989-07-14 Schichtartiges piezoelektrisches Element und dessen Herstellungsverfahren.

Country Status (4)

Country Link
US (1) US5196756A (de)
EP (1) EP0350941B1 (de)
JP (1) JP2738706B2 (de)
DE (1) DE68919556T2 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2013903A1 (en) * 1989-04-07 1990-10-07 Mitsui Chemicals, Inc. Laminated ceramic device and method of manufacturing the same
US5163209A (en) * 1989-04-26 1992-11-17 Hitachi, Ltd. Method of manufacturing a stack-type piezoelectric element
US5281885A (en) * 1989-11-14 1994-01-25 Hitachi Metals, Ltd. High-temperature stacked-type displacement device
JP2545639B2 (ja) * 1990-07-30 1996-10-23 富士通株式会社 積層型圧電素子
US5164808A (en) * 1991-08-09 1992-11-17 Radiant Technologies Platinum electrode structure for use in conjunction with ferroelectric materials
EP0584775B1 (de) * 1992-08-25 1997-12-17 Canon Kabushiki Kaisha Verfahren zur Herstellung einer laminierten piezoelektrischen Anordnung und Polarisationsverfahren und vibrationswellengetriebener Motor
JPH06334236A (ja) * 1993-05-20 1994-12-02 Fujitsu Ltd 積層型圧電・電歪アクチュエータの製造方法
US5578888A (en) * 1994-12-05 1996-11-26 Kulicke And Soffa Investments, Inc. Multi resonance unibody ultrasonic transducer
US5601184A (en) * 1995-09-29 1997-02-11 Process Technologies, Inc. Method and apparatus for use in photochemically oxidizing gaseous volatile or semi-volatile organic compounds
US5798599A (en) * 1996-10-24 1998-08-25 Dukane Corporation Ultrasonic transducer assembly using crush foils
WO1998024296A2 (en) * 1996-11-20 1998-06-11 The Regents Of The University Of California Multilaminate piezoelectric high voltage stack
DE19756182C2 (de) * 1997-12-17 1999-10-14 Siemens Ag Monolithisches piezokeramisches Bauelement und Verfahren zu seiner Herstellung
JP3876082B2 (ja) * 1998-10-29 2007-01-31 株式会社日立製作所 ２次元アレイ型モジュールの製造方法
DE19850610A1 (de) * 1998-11-03 2000-05-04 Bosch Gmbh Robert Verfahren zur Herstellung piezoelektrischer Aktoren
DE19936713C2 (de) * 1999-08-06 2001-08-23 Bosch Gmbh Robert Piezokeramischer Aktor sowie Verfahren zu seiner Herstellung
DE19946834A1 (de) * 1999-09-30 2001-05-03 Bosch Gmbh Robert Piezoaktor und ein Verfahren zu dessen Herstellung
US6438070B1 (en) 1999-10-04 2002-08-20 Halliburton Energy Services, Inc. Hydrophone for use in a downhole tool
JP3846271B2 (ja) * 2001-11-05 2006-11-15 松下電器産業株式会社 薄膜圧電体素子およびその製造方法
JP3935037B2 (ja) * 2002-09-30 2007-06-20 Ｄｏｗａホールディングス株式会社 アルミニウム−セラミックス接合基板の製造方法
DE10338486B3 (de) 2003-08-21 2005-04-28 Siemens Ag Verfahren zum Herstellen einer elektrischen Kontaktierung eines piezoelektrischen Aktors und Polarisierung des piezoelektrischen Aktors
WO2005031887A1 (ja) * 2003-09-25 2005-04-07 Kyocera Corporation 積層型圧電素子
US7651587B2 (en) 2005-08-11 2010-01-26 Applied Materials, Inc. Two-piece dome with separate RF coils for inductively coupled plasma reactors
ATE528769T1 (de) * 2006-03-10 2011-10-15 Joinset Co Ltd Keramisches komponentenelement und herstellungsverfahren dafür
JP2008004764A (ja) * 2006-06-22 2008-01-10 Fujitsu Ltd 圧電アクチュエータおよびその製造方法、磁気ディスク装置
JP4253334B2 (ja) * 2006-07-12 2009-04-08 株式会社東芝 ２次元アレイ型超音波プローブ
ATE450894T1 (de) * 2007-01-30 2009-12-15 Delphi Tech Inc Herstellungsverfahren für einen piezoelektrischen aktor
DE102009001938A1 (de) * 2009-03-27 2010-09-30 Robert Bosch Gmbh Piezoaktor mit einem Mehrlagenaufbau und ein Verfahren zu dessen Herstellung
DE102010062112A1 (de) * 2010-04-16 2011-10-20 Robert Bosch Gmbh Verfahren zum Heißpolarisieren eines piezokeramischen Bauelements
TWI559681B (zh) * 2015-01-07 2016-11-21 加高電子股份有限公司 石英震盪器環壁結構之製造方法及製備而得之石英震盪器環壁結構
US20220173305A1 (en) 2019-03-23 2022-06-02 Secretary, Department Of Atomic Energy Diffusion bonding of piezoelectric crystal to metal wear plate

Family Cites Families (16)

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Publication number Priority date Publication date Assignee Title
US2497666A (en) * 1945-05-04 1950-02-14 Brush Dev Co Electrode for piezoelectric crystals
US2641718A (en) * 1949-04-20 1953-06-09 Selectronics Inc Method of mounting thickness shear mode quartz crystal oscillator plates
US3317762A (en) * 1964-05-22 1967-05-02 Rudolph E Corwin Pre-stressed spherical electro-acoustic transducer
GB1207974A (en) * 1966-11-17 1970-10-07 Clevite Corp Frequency selective apparatus including a piezoelectric device
US3573669A (en) * 1968-09-03 1971-04-06 Bell Telephone Labor Inc Dispersive delay cell using anisotropic medium
JPS58100414A (ja) * 1981-10-24 1983-06-15 日本写真印刷株式会社 アルミニウム電極を有するチタン酸バリウムの製造方法
JPS58140173A (ja) * 1982-02-15 1983-08-19 Seiko Epson Corp 固体変位装置
DE3378393D1 (en) * 1982-05-11 1988-12-08 Nec Corp Multilayer electrostrictive element which withstands repeated application of pulses
JPS5998574A (ja) * 1982-11-27 1984-06-06 Toshiba Corp 高分子電気変換素子の製造方法
US4477952A (en) * 1983-04-04 1984-10-23 General Electric Company Piezoelectric crystal electrodes and method of manufacture
US4564782A (en) * 1983-09-02 1986-01-14 Murata Manufacturing Co., Ltd. Ceramic filter using multiple thin piezoelectric layers
JPH0740613B2 (ja) * 1983-12-05 1995-05-01 株式会社日本自動車部品総合研究所 積層型圧電体の製造方法
JPS60128682A (ja) * 1983-12-15 1985-07-09 Tohoku Metal Ind Ltd 積層型圧電アクチユエ−タの製造方法
JPH07118554B2 (ja) * 1986-01-16 1995-12-18 日本電装株式会社 積層型の圧電体装置
US4803763A (en) * 1986-08-28 1989-02-14 Nippon Soken, Inc. Method of making a laminated piezoelectric transducer
US4848643A (en) * 1988-09-19 1989-07-18 Honeywell Inc. Process of bonding plates

Also Published As

Publication number Publication date
JP2738706B2 (ja) 1998-04-08
EP0350941A2 (de) 1990-01-17
US5196756A (en) 1993-03-23
DE68919556T2 (de) 1995-04-13
JPH0226087A (ja) 1990-01-29
EP0350941B1 (de) 1994-11-30
EP0350941A3 (en) 1990-12-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee