DE68918995D1 - Montage von elektronischen Bauteilen. - Google Patents

Montage von elektronischen Bauteilen.

Info

Publication number
DE68918995D1
DE68918995D1 DE68918995T DE68918995T DE68918995D1 DE 68918995 D1 DE68918995 D1 DE 68918995D1 DE 68918995 T DE68918995 T DE 68918995T DE 68918995 T DE68918995 T DE 68918995T DE 68918995 D1 DE68918995 D1 DE 68918995D1
Authority
DE
Germany
Prior art keywords
assembly
electronic components
electronic
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68918995T
Other languages
English (en)
Other versions
DE68918995T2 (de
Inventor
Nobuyuki Yagi
Jiroh Inagaki
Kozo Morita
Yasutoshi Kaku
Shinji Mizuno
Akiko Yamanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teikoku Tsushin Kogyo Co Ltd
Original Assignee
Teikoku Tsushin Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63155632A external-priority patent/JPH025374A/ja
Priority claimed from JP63182575A external-priority patent/JPH0711872B2/ja
Priority claimed from JP63231880A external-priority patent/JPH0760926B2/ja
Application filed by Teikoku Tsushin Kogyo Co Ltd filed Critical Teikoku Tsushin Kogyo Co Ltd
Publication of DE68918995D1 publication Critical patent/DE68918995D1/de
Application granted granted Critical
Publication of DE68918995T2 publication Critical patent/DE68918995T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10946—Leads attached onto leadless component after manufacturing the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
DE68918995T 1988-06-23 1989-06-12 Montage von elektronischen Bauteilen. Expired - Fee Related DE68918995T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP63155632A JPH025374A (ja) 1988-06-23 1988-06-23 フレキシブルプリント基板の端子構造
JP63182575A JPH0711872B2 (ja) 1988-07-21 1988-07-21 ピックアップ機構の受光素子固定構造
JP63231880A JPH0760926B2 (ja) 1988-09-14 1988-09-14 電子部品実装体

Publications (2)

Publication Number Publication Date
DE68918995D1 true DE68918995D1 (de) 1994-12-01
DE68918995T2 DE68918995T2 (de) 1995-05-11

Family

ID=27320864

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68918995T Expired - Fee Related DE68918995T2 (de) 1988-06-23 1989-06-12 Montage von elektronischen Bauteilen.

Country Status (4)

Country Link
US (1) US5111363A (de)
EP (1) EP0347974B1 (de)
KR (1) KR950008430B1 (de)
DE (1) DE68918995T2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0685341B2 (ja) * 1991-09-27 1994-10-26 帝国通信工業株式会社 フレキシブル基板の端子構造
US5450286A (en) * 1992-12-04 1995-09-12 Parlex Corporation Printed circuit having a dielectric covercoat
USRE40150E1 (en) * 1994-04-25 2008-03-11 Matsushita Electric Industrial Co., Ltd. Fiber optic module
JP3326959B2 (ja) * 1994-04-25 2002-09-24 松下電器産業株式会社 光ファイバモジュール
JPH08335761A (ja) * 1995-06-06 1996-12-17 Matsushita Electric Ind Co Ltd 電子部品の配線基板への装着方法およびこれを用いた照光式スイッチユニット
CH691020A5 (de) * 1996-01-15 2001-03-30 Fela Holding Ag Verfahren zur Herstellung von spritzgegossenen dreidimensionalen Leiterformkörpern.
JPH09199196A (ja) * 1996-01-23 1997-07-31 Alps Electric Co Ltd フラットケーブルと端子の接続構造
US6093353A (en) * 1998-08-03 2000-07-25 Lear Automotive Dearborn, Inc. Method of forming electrical components
US6867948B1 (en) * 1999-01-22 2005-03-15 Seagate Technology Llc Disc drives having flexible circuits with liquid crystal polymer dielectric
US6408508B1 (en) * 1999-07-30 2002-06-25 Micron Technology, Inc. Method for making flexible trace surface circuit board
GB2358476B (en) * 2000-01-21 2004-06-23 Siemens Metering Ltd Improvements in or relating to metering
JP3588444B2 (ja) * 2000-10-26 2004-11-10 松下電器産業株式会社 電子部品、部品実装装置及び部品実装方法
JP4550268B2 (ja) * 2000-12-20 2010-09-22 古河電気工業株式会社 光・電気複合コネクタ
US6932621B2 (en) * 2003-03-21 2005-08-23 The Boeing Company Connector interface pad for structurally integrated wiring
US20040264139A1 (en) * 2003-06-24 2004-12-30 Nokia Corporation Process for manufacturing a cover
WO2005022556A2 (en) * 2003-09-02 2005-03-10 Integral Technologies, Inc. Very low resistance electrical interfaces to conductive loaded resin-based materials
US7739791B2 (en) * 2007-10-26 2010-06-22 Delphi Technologies, Inc. Method of producing an overmolded electronic module with a flexible circuit pigtail
JP5473571B2 (ja) * 2008-12-25 2014-04-16 京セラ株式会社 着脱端末、電子機器、および通信装置
JP4865020B2 (ja) * 2009-09-11 2012-02-01 株式会社東芝 電子機器
US20150116958A1 (en) * 2013-10-28 2015-04-30 Apple Inc. Circuit board modules having mechanical features
US10051724B1 (en) 2014-01-31 2018-08-14 Apple Inc. Structural ground reference for an electronic component of a computing device
CN205902188U (zh) * 2014-03-27 2017-01-18 株式会社村田制作所 电气元件以及移动设备
US9525222B2 (en) 2014-04-11 2016-12-20 Apple Inc. Reducing or eliminating board-to-board connectors
US9666967B2 (en) 2014-07-28 2017-05-30 Apple Inc. Printed circuit board connector for non-planar configurations
US10945664B1 (en) 2015-09-30 2021-03-16 Apple, Inc. Protective case with coupling gasket for a wearable electronic device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2885601A (en) * 1954-05-28 1959-05-05 Rca Corp Insulation of printed circuits
DE2831984A1 (de) * 1977-07-21 1979-02-01 Sharp Kk Elektrische verbindung zwischen zwei auf getrennte traeger aufgebrachten elektrischen schaltkreisen
JPS54105774A (en) * 1978-02-08 1979-08-20 Hitachi Ltd Method of forming pattern on thin film hybrid integrated circuit
US4188714A (en) * 1978-04-17 1980-02-19 Teledyne Electro-Mechanisms Rigid termination for flexible printed circuits
CH641626B (de) * 1979-01-18 Citizen Watch Co Ltd Verfahren zur herstellung von elektronischen uhrmodulen.
US4584767A (en) * 1984-07-16 1986-04-29 Gregory Vernon C In-mold process for fabrication of molded plastic printed circuit boards
US4631820A (en) * 1984-08-23 1986-12-30 Canon Kabushiki Kaisha Mounting assembly and mounting method for an electronic component
EP0176030B1 (de) * 1984-09-26 1992-04-29 TERUMO KABUSHIKI KAISHA trading as TERUMO CORPORATION Ultraschallwandler und Verfahren zur Herstellung desselben
JPS61147593A (ja) * 1984-12-20 1986-07-05 神東塗料株式会社 導電性接着剤層を付与したフレキシブル回路基材およびその製造方法
GB2181302B (en) * 1985-10-02 1989-09-27 Plessey Co Plc Improvements in or relating to circuit boards
JPS62169434A (ja) * 1986-01-22 1987-07-25 Sharp Corp Ｌｓｉ搭載方式

Also Published As

Publication number Publication date
EP0347974A3 (en) 1990-10-31
KR950008430B1 (ko) 1995-07-28
EP0347974B1 (de) 1994-10-26
EP0347974A2 (de) 1989-12-27
DE68918995T2 (de) 1995-05-11
KR900001058A (ko) 1990-01-31
US5111363A (en) 1992-05-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee