DE68918967D1 - Bipolare Transistorstruktur und Verfahren zu ihrer Herstellung. - Google Patents
Bipolare Transistorstruktur und Verfahren zu ihrer Herstellung.Info
- Publication number
- DE68918967D1 DE68918967D1 DE68918967T DE68918967T DE68918967D1 DE 68918967 D1 DE68918967 D1 DE 68918967D1 DE 68918967 T DE68918967 T DE 68918967T DE 68918967 T DE68918967 T DE 68918967T DE 68918967 D1 DE68918967 D1 DE 68918967D1
- Authority
- DE
- Germany
- Prior art keywords
- making
- bipolar transistor
- transistor structure
- bipolar
- transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66272—Silicon vertical transistors
- H01L29/66287—Silicon vertical transistors with a single crystalline emitter, collector or base including extrinsic, link or graft base formed on the silicon substrate, e.g. by epitaxy, recrystallisation, after insulating device isolation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
- H01L29/7317—Bipolar thin film transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
- H01L29/732—Vertical transistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63055023A JPH01230270A (ja) | 1988-03-10 | 1988-03-10 | バイポーラ型トランジスタ及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68918967D1 true DE68918967D1 (de) | 1994-12-01 |
DE68918967T2 DE68918967T2 (de) | 1995-03-02 |
Family
ID=12987073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68918967T Expired - Fee Related DE68918967T2 (de) | 1988-03-10 | 1989-03-06 | Bipolare Transistorstruktur und Verfahren zu ihrer Herstellung. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4974045A (de) |
EP (1) | EP0332106B1 (de) |
JP (1) | JPH01230270A (de) |
DE (1) | DE68918967T2 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5234844A (en) * | 1988-03-10 | 1993-08-10 | Oki Electric Industry Co., Inc. | Process for forming bipolar transistor structure |
US5227317A (en) * | 1989-04-21 | 1993-07-13 | Hitachi, Ltd. | Method of manufacturing semiconductor integrated circuit bipolar transistor device |
JPH02280340A (ja) * | 1989-04-21 | 1990-11-16 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
US5177582A (en) * | 1989-09-22 | 1993-01-05 | Siemens Aktiengesellschaft | CMOS-compatible bipolar transistor with reduced collector/substrate capacitance and process for producing the same |
US5017990A (en) * | 1989-12-01 | 1991-05-21 | International Business Machines Corporation | Raised base bipolar transistor structure and its method of fabrication |
JPH0785476B2 (ja) * | 1991-06-14 | 1995-09-13 | インターナショナル・ビジネス・マシーンズ・コーポレイション | エミッタ埋め込み型バイポーラ・トランジスタ構造 |
US5286996A (en) * | 1991-12-31 | 1994-02-15 | Purdue Research Foundation | Triple self-aligned bipolar junction transistor |
JP3172031B2 (ja) * | 1994-03-15 | 2001-06-04 | 株式会社東芝 | 半導体装置の製造方法 |
US5481126A (en) * | 1994-09-27 | 1996-01-02 | Purdue Research Foundation | Semiconductor-on-insulator electronic devices having trench isolated monocrystalline active regions |
US5494837A (en) * | 1994-09-27 | 1996-02-27 | Purdue Research Foundation | Method of forming semiconductor-on-insulator electronic devices by growing monocrystalline semiconducting regions from trench sidewalls |
JP2630275B2 (ja) * | 1994-10-12 | 1997-07-16 | 日本電気株式会社 | 半導体装置の製造方法 |
KR100191270B1 (ko) * | 1995-09-29 | 1999-06-15 | 윤종용 | 바이폴라 반도체장치 및 그의 제조방법 |
KR100190029B1 (ko) * | 1996-03-19 | 1999-06-01 | 윤종용 | 바이씨모스 에스램 소자의 제조방법 |
KR100248504B1 (ko) * | 1997-04-01 | 2000-03-15 | 윤종용 | 바이폴라 트랜지스터 및 그의 제조 방법 |
US6060388A (en) * | 1997-10-29 | 2000-05-09 | International Business Machines Corporation | Conductors for microelectronic circuits and method of manufacture |
KR100660722B1 (ko) * | 2005-12-30 | 2006-12-21 | 동부일렉트로닉스 주식회사 | 바이폴라 접합 트랜지스터 및 그 제조 방법 |
EP2740149B1 (de) * | 2011-08-05 | 2020-05-20 | IMEC vzw | Verfahren zur bildung von mustern mit unterschiedlich dotierten regionen |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3600651A (en) * | 1969-12-08 | 1971-08-17 | Fairchild Camera Instr Co | Bipolar and field-effect transistor using polycrystalline epitaxial deposited silicon |
US4425574A (en) * | 1979-06-29 | 1984-01-10 | International Business Machines Corporation | Buried injector memory cell formed from vertical complementary bipolar transistor circuits and method of fabrication therefor |
JPS59126671A (ja) * | 1983-01-10 | 1984-07-21 | Mitsubishi Electric Corp | 半導体装置 |
JPS60117664A (ja) * | 1983-11-30 | 1985-06-25 | Fujitsu Ltd | バイポ−ラ半導体装置 |
US4686763A (en) * | 1985-10-02 | 1987-08-18 | Advanced Micro Devices, Inc. | Method of making a planar polysilicon bipolar device |
US4663831A (en) * | 1985-10-08 | 1987-05-12 | Motorola, Inc. | Method of forming transistors with poly-sidewall contacts utilizing deposition of polycrystalline and insulating layers combined with selective etching and oxidation of said layers |
US4764801A (en) * | 1985-10-08 | 1988-08-16 | Motorola Inc. | Poly-sidewall contact transistors |
US4696097A (en) * | 1985-10-08 | 1987-09-29 | Motorola, Inc. | Poly-sidewall contact semiconductor device method |
US4849371A (en) * | 1986-12-22 | 1989-07-18 | Motorola Inc. | Monocrystalline semiconductor buried layers for electrical contacts to semiconductor devices |
-
1988
- 1988-03-10 JP JP63055023A patent/JPH01230270A/ja active Pending
-
1989
- 1989-03-03 US US07/318,604 patent/US4974045A/en not_active Expired - Lifetime
- 1989-03-06 EP EP89103891A patent/EP0332106B1/de not_active Expired - Lifetime
- 1989-03-06 DE DE68918967T patent/DE68918967T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH01230270A (ja) | 1989-09-13 |
DE68918967T2 (de) | 1995-03-02 |
EP0332106A2 (de) | 1989-09-13 |
US4974045A (en) | 1990-11-27 |
EP0332106A3 (de) | 1991-08-28 |
EP0332106B1 (de) | 1994-10-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |