DE68917367T2 - Optisches Halbleiterbauelement. - Google Patents

Optisches Halbleiterbauelement.

Info

Publication number
DE68917367T2
DE68917367T2 DE68917367T DE68917367T DE68917367T2 DE 68917367 T2 DE68917367 T2 DE 68917367T2 DE 68917367 T DE68917367 T DE 68917367T DE 68917367 T DE68917367 T DE 68917367T DE 68917367 T2 DE68917367 T2 DE 68917367T2
Authority
DE
Germany
Prior art keywords
optical semiconductor
semiconductor component
optical
component
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68917367T
Other languages
English (en)
Other versions
DE68917367D1 (de
Inventor
Takeshi C O Yokohama Sekiguchi
Nobuo C O Yokohama Works Shiga
Keigo C O Yokohama Works O Aga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63118947A external-priority patent/JP2737151B2/ja
Priority claimed from JP63118946A external-priority patent/JP2582120B2/ja
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of DE68917367D1 publication Critical patent/DE68917367D1/de
Application granted granted Critical
Publication of DE68917367T2 publication Critical patent/DE68917367T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
DE68917367T 1988-05-16 1989-05-16 Optisches Halbleiterbauelement. Expired - Fee Related DE68917367T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63118947A JP2737151B2 (ja) 1988-05-16 1988-05-16 光半導体装置
JP63118946A JP2582120B2 (ja) 1988-05-16 1988-05-16 光半導体装置

Publications (2)

Publication Number Publication Date
DE68917367D1 DE68917367D1 (de) 1994-09-15
DE68917367T2 true DE68917367T2 (de) 1995-04-27

Family

ID=26456773

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68917367T Expired - Fee Related DE68917367T2 (de) 1988-05-16 1989-05-16 Optisches Halbleiterbauelement.

Country Status (4)

Country Link
EP (1) EP0342594B1 (de)
KR (1) KR930000330B1 (de)
CA (1) CA1303712C (de)
DE (1) DE68917367T2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0783080B2 (ja) * 1990-01-18 1995-09-06 株式会社東芝 半導体装置用部品

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2322465A1 (fr) * 1975-08-29 1977-03-25 Doloise Metallurgique Dispositif de raccordement pour composants munis de fiches
JPS60165749A (ja) * 1984-02-08 1985-08-28 Fujitsu Ltd Ｌｓｉモジユ−ル用接続ピン

Also Published As

Publication number Publication date
CA1303712C (en) 1992-06-16
DE68917367D1 (de) 1994-09-15
KR890017555A (ko) 1989-12-16
EP0342594A2 (de) 1989-11-23
EP0342594A3 (en) 1990-06-13
KR930000330B1 (ko) 1993-01-15
EP0342594B1 (de) 1994-08-10

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Legal Events

Date Code Title Description
8381 Inventor (new situation)

Free format text: SEKIGUCHI, TAKESHI C/O YOKOHAMA WORKS OF SUMITOMO, YOKOHAMA-SHI KANAGAWA, JP SHIGA, NOBUO C/O YOKOHAMA WORKS OF SUMITOMO, YOKOHAMA-SHI KANAGAWA, JP AGA, KEIGO C/O YOKOHAMA WORKS OF SUMITOMO, YOKOHAMA-SHI KANAGAWA, JP

8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee